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/ / / _ \/ __ `/ __ `__ \ / __/ / /_ / /| |
/ / / __/ /_/ / / / / / / / /___/ __/ / ___ |
/_/ \___/\__,_/_/ /_/ /_/ /_____/_/ /_/ |_|
[*] Crack Notes
Copy patch folder program to original file directory and replace it.
[*] Update log (see https://www.pcblibraries.com/forum/version-history_forum1.html)
=======================
2023.07
=======================
Fixes & Enhancements:
Options:
Updated the IPC-7352.opt file – The default Thermal Tab Paste Mask Reduction was changed from 50% to 60%
New Library Files:
Added 5 FPX files to the Library folder that contain over 18,600 component mfr. Case Codes:
BGA, SM Discrete, TH Discrete, Semiconductors, Connectors
Calculators:
Updated – Enlarged the graphic dimensional images so that the image fits in the box
DPAK – L1 dimension can now be a negative value and it autogenerates a Thermal Pad
QFN – Assembly Outline was not mapping to the Nominal dimension when set “Map to Nominal” in Options
LCC – Changing a package dimension threw an unhandled exception error
Library Editor:
When selecting a single footprint row, selecting the Batch Build option added a duplicate Density Level suffix
FP Designer:
Silkscreen to Pad Clearance Option was not being applied to through-hole pads
CAD Tool Interfaces:
KiCad – translator didn’t produce rounded-corner shapes for surface mount Square pad
=======================
2023.02
=======================
Fixes & Enhancements:
Resolved FIPS issue
Options:
Console Options was not restoring the component outline color if it was changed and restored
FP Designer:
Added a new feature – the silkscreen and assembly outlines now map to the outside of the package body outline
Assign Pins – Pin reorder was not working 100%
Physical Description Text File:
Updated the Physical Descriptions for all footprints with Thermal Pads
This impacted physical descriptions for footprints created in FP Designer
Calculators:
Chip and MELF Assembly Ref Des was using the wrong package dimension to calculate the height
Resolved issues with Footprint Names:
DFN 2, 3, 4 – duplicating pin quantity
DPAK missing a tab dimension
SOJ & SOL, and OSCJ & OSCL & Crystal was using lead span E instead of body dimension of E1
=======================
2023.01
=======================
Fixes & Enhancements:
Console Options:
Added IPC-7352 Naming Convention
Calculators:
2-Pin DFN – updated the assembly outline polarity marker from upper left to lower left
Physical Description – updated QFN, PQFN, SON, PSON, QFP & SOP to add a comma after the closed parentheses
Options:
Pad Stack Rules – Corner Rounding > Corner Radius Limit – changing the value to 0.00 now results in a rectangle pad
Library Editor:
These FPX columns were removed – Symbol Name, Pin Quantity, Value, Tolerance, Voltage, STEP File Name
You can manually remove these columns from your master FPX file
New Feature – Middle mouse wheel zoom now zooms wherever the cursor is
FPX File Converter:
Updated to the new V23 format both internally and the separate .exe version
FP Designer:
Enhanced the Import .CSV file feature
CAD Tool Translators:
Altium – fixed an issue with pad place round-offs for 0.65 mm Pin Pitch parts
Allegro – 3D STEP file was not placed in the correct directory folder
Footprint Expert Viewer:
This free edition of the Footprint Expert was discontinued, but the Enterprise version runs as a Viewer when no license is found
POD Builder:
This free edition of the Footprint Expert was discontinued
=======================
2022.15
=======================
Fixes & Enhancements:
Calculators:
User interface updated – Unrequired calculator dimensional cell background color changed from gray to light blue
All Surface Mount non-polarized diodes – updated the footprint naming convention from DIONP to DION
SOD – when pad trimming under component is turned on the Toe goal was also trimmed
SODFL – Non-polarized diodes had assembly and silkscreen polarity markings
DPAK – Flat Lug Tab redefined from ‘Thermal’ to ‘Mechanical’.
FP Designer:
Pad stack manager not enabling ‘Save’ buttons after adding layers
Rotating rectangle footprints the pads rotated but not the drafting outlines
3D STEP:
When the CAD output directory was set to “Same As Translator Directory” the 3D STEP model would not auto-import
Drafting Elements:
Selecting a Round shape Keepout threw a Handled Exception Error
=======================
2022.14
=======================
Fixes & Enhancements:
Calculators:
DFN component families – assembly polarity marker appeared on non-polarized parts
Reselection required in order to query even though pin or shape or label or symbol indicates it is selected
Options:
Changing Density Levels did not affect the silkscreen line width
FP Designer:
FP Designer parts with offset pins batch building from library without offset
Pad Stack Designer slotted holes were rotated 90 degrees from pad
Pad Stack Designer not creating Side Radiused surface mount pads
=======================
2022.13
=======================
Fixes & Enhancements:
Calculators:
New – added a 6-pin version of the Side Concave Package
Mounting Hole – removed “A” (for annular) from mounting hole name
DFN 4-pin:
Pad to Pad Clearance bug not following Options rule
Option to expand silkscreen outline
Axial Lead – Body Diameter uses height (A) instead of diameter (E) dimension
SOL – Width uses Body width (E1) instead of Lead Span (E) dimension
Corrected Mfr. Dimensions' roundoffs for place and pad size round offs
Corrected paste mask percent-to-excess calculation
Round-To function for TH pad stacks resolved for non-millimeter units
Courtyard relation to pads with zero excess
Symbol & Keepout rectangle shape orientations now rotate properly with the footprint
FP Designer:
New – added pin orientation to FP Designer pin placement import .csv file
Pad Stack Designer – hole size round off and non-plated hole mask pad stack name
Move Origin by Coordinates not recognizing other than mm units
Ref Des for Silkscreen and Assembly label orientations synced
Zero values in the pin-place text boxes
Options:
Options/Pad Place Units not saving
CAD Tool Translators:
Altium – added feature that automatically opens the output folder if the user wants to
Library Editor:
Exception thrown when a library is loaded when there are no data grid rows showing
=======================
2022.12
=======================
Fixes & Enhancements:
Library Editor:
Import efficiency increased 10X for importing an FPX file into another FPX file; now shows a progress bar
Utilities > Update BOM From Library can open multiple dialog boxes and was reduced it to one
Utilities > Find Duplicates – improved the duplicate entries to display all duplicates rather than one at a time
FP Designer:
When rotating footprints with Drafting lines, was not working correctly
Pad Stack Manager Rounded Rectangular pad shape was unable to turn off
When moving a Vertical Header to FP Designer, none of the values came across
Added the ability to rotate square pad stacks 45 degrees
Improved solder mask defined pad stacks for chamfered pad stacks
Options:
New individual orientation options for SOFL & SODFL
Pad Size and Pad Place Roundoff in footprint calculators not complying with options selection
Changing the Console Options to mil units caused the percentage features to be disabled
Calculators:
New features:
Ability to select the ESC keyboard button to close Property dialog boxes
Ability to move through-hole Oscillators to FP designer
Updating an existing Row in the FPX library will no display the update message if there is no change
Inserting a Keep Out on All Layers was disabled. Calculators and FP Designer
Layer Display