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MIL-STD-1276K-002.pdf
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MIL-STD-1276K-002.pdf
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AMSC N/A FSC 5999
Distribution Statement A. Approved for public release; distribution is unlimited.
INCH-POUND
MIL-STD-1276K
24 March 2023
SUPERSEDING
MIL-STD-1276J
12 February 2018
DEPARTMENT OF DEFENSE
INTERFACE STANDARD
LEADS FOR ELECTRONIC COMPONENT PARTS
Source: https://assist.dla.mil -- Downloaded: 2023-04-25T17:21Z
Check the source to verify that this is the current version before use.
MIL-STD-1276K
ii
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. Comments, suggestions, or questions on this document should be addressed to: DLA Land and Maritime,
ATTN: VAT, Post Office Box 3990, Columbus, OH 43218-3990 or emailed to relay@dla.mil. Since contact
information can change, you may want to verify the currency of this address information using the ASSIST
Online database at
https://assist.dla.mil.
Source: https://assist.dla.mil -- Downloaded: 2023-04-25T17:21Z
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MIL-STD-1276K
iii
CONTENTS
PARAGRAPH PAGE
FOREWORD…………………………………………………………………………………………………… ii
1. SCOPE ............................................................................................................................................. 1
1.1 Scope................................................................................................................................... 1
1.2 Classification ........................................................................................................................ 1
1.2.1 Type designator ................................................................................................................... 1
1.2.1.1 Cross section ....................................................................................................................... 1
1.2.1.2 Nominal size ........................................................................................................................ 1
1.2.1.3 Composition ......................................................................................................................... 1
1.2.1.4 Final finish ............................................................................................................................ 1
1.2.1.5 Underplating ........................................................................................................................ 1
2. APPLICABLE DOCUMENTS ............................................................................................................. 3
2.1 General ................................................................................................................................ 3
2.2 Government documents....................................................................................................... 3
2.2.1 Specifications, standards, and handbooks........................................................................... 3
2.3. Non-Government publications ............................................................................................. 3
2.4. Order of precedence ............................................................................................................ 4
3. DEFINITIONS ..................................................................................................................................... 5
3.1 Definitions ............................................................................................................................ 5
4. GENERAL REQUIREMENTS ............................................................................................................ 6
4.1 Preferred methods of assembly ........................................................................................... 6
4.2 Solderability ......................................................................................................................... 7
4.3 Thickness............................................................................................................................. 7
4.4 Adhesion .............................................................................................................................. 7
4.5 Porosity ................................................................................................................................ 7
4.6 Recycled, recovered, or environmentally preferable materials ............................................ 7
4.7 Pure tin ……………………………………………………………………………………………. 7
4.8 Workmanship in finishes ...................................................................................................... 7
5. DETAILED REQUIREMENTS ............................................................................................................ 8
5.1 Composition ......................................................................................................................... 8
5.2 Final finish ............................................................................................................................ 9
5.2.1 Underplating ........................................................................................................................10
5.2.1.1 Gold plating ..........................................................................................................................10
5.2.1.2 Composition F, G, and K......................................................................................................10
5.2.1.3 Hot solder dip .......................................................................................................................10
5.2.1.4 Composition A, B, J, and X ..................................................................................................10
6. NOTES .............................................................................................................................................11
6.1 Intended use ........................................................................................................................11
6.2 Precaution............................................................................................................................11
6.3 Removal of gold plating before soldering .............................................................................11
6.4 Passive nickel ......................................................................................................................11
6.5 Cross reference ...................................................................................................................11
6.6 Cleanliness ..........................................................................................................................12
6.7 Supersession data ...............................................................................................................12
6.8 Subject term (key word) listing .............................................................................................13
6.9 Changes from previous issue ..............................................................................................13
Source: https://assist.dla.mil -- Downloaded: 2023-04-25T17:21Z
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MIL-STD-1276K
iv
TABLES
I. Nominal size………………………………………………………………………………………... 2
II. Preferred methods of assembly ........................................................................................... 6
III. Chemical Composition ......................................................................................................... 8
IV. Cross reference of lead types ..............................................................................................11
V. Supersession data for final finishes .....................................................................................13
Source: https://assist.dla.mil -- Downloaded: 2023-04-25T17:21Z
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