7.
TEST PROCEDURE ..................................................................................................................................... 5
7.1 Ambient ......................................................................................................................................................... 5
7.2 Operational Check ........................................................................................................................................ 5
7.3 Test Technique ............................................................................................................................................. 5
8.
DATA PRESENTATION ............................................................................................................................... 9
8.1 Documentation .............................................................................................................................................. 9
8.2 Data Analysis ................................................................................................................................................ 9
9.
IC EMISSIONS REFERENCE LEVELS ........................................................................................................ 9
10.
NOTES .......................................................................................................................................................... 9
10.1 Marginal indicia ............................................................................................................................................. 9
APPENDIX A EXAMPLE CALIBRATION AND SET UP VERIFICATION SHEET ............................................................ 10
APPENDIX B 1 GHZ TEM CELL AND WIDEBAND TEM CELL ....................................................................................... 11
APPENDIX C CALCULATION OF DIPOLE MOMENT FROM MEASURED DATA .......................................................... 12
APPENDIX D SPECIFICATION OF EMISSION LEVELS ................................................................................................. 13
FIGURE 1 1 GHZ TEM CELL WITH TEST PCB ............................................................................................................ 6
FIGURE 2 WIDEBAND TEM CELL WITH TEST PCB ................................................................................................... 7
FIGURE 3 WIDEBAND TEM CELL WITH DETAIL OF TEST PCB AND PORT ............................................................ 7
FIGURE 4 IC TEST PRINTED CIRCUIT BOARD .......................................................................................................... 8
TABLE 1 PIN LOADING RECOMMENDATIONS (FROM SAE J1752-1) .................................................................... 6
1. SCOPE
This measurement procedure defines a method for measuring the electromagnetic radiation from an integrated circuit
(IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port
(referred to as a wall port) cut in the top or bottom of a TEM or wideband TEM (GTEM) cell. The test board is not in the
cell as in the conventional usage but becomes a part of the cell wall. This method is applicable to any TEM or
GTEM cell modified to incorporate the wall port; however, the measured RF voltage is affected by the septum to test
board (wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to wall spacing of 45 mm and
a GTEM cell with average septum to wall spacing of 45 mm over the port area. Other cells may not produce identical
spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A
conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to wall
spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates
any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell,
one of the 50 Ω ports is terminated with a 50 Ω load. The other 50 Ω port for a TEM cell, or the single 50 Ω port for a
GTEM cell, is connected to the input of a spectrum analyzer or receiver that measures the RF emissions emanating from
the IC and coupled onto the septum of the TEM cell.
1.1 Measurement Philosophy
The RF voltage appearing at the input to the spectrum analyzer is related to the electromagnetic radiation potential of the
IC and of the electronic module of which it would be a part. The intent is to provide a quantitative measure of the RF
emissions from ICs for comparison or other purposes.
2. REFERENCES
General information supporting this document is in SAE J1752-1, Integrated Circuit EMC Measurement Procedures,
General and Definitions.
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