【最新版】ECPEGuidelineAQG-324.pdf

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ECPE Guideline

AQG 324

Version 01 / 04-2018

Page 1 of 66

ECPE Guideline AQG 324

Qualification of Power Modules for Use in Power Electronics

Converter Units (PCUs) in Motor Vehicles

Version no.: V01.05

Release date: 12.04.2018

Contact: ECPE European Center for Power Electronics e.V.

Dipl.-Phys. Thomas Harder

Landgrabenstrasse 94

90443 Nuremberg, Germany

Email thomas.harder@ecpe.org

Phone (+49) 911 8102 880

ECPE Guideline

AQG 324

Version 01 / 04-2018

Page 2 of 66

Preface

This Guideline was prepared by the ECPE Working Group ´Automotive Power Module

Qualification´ comprising ECPE member companies active in the automotive market.

The original version is based on the supply specification LV 324 which has been

developed by German automotive OEMs together with representatives from the power

electronics supplier industry in a joint working group of ECPE and the German ZVEI

association.

The industrial standards referenced in this document have consciously been selected in

the specific versions or release years. This means they represent the technical state of

the art of the industry, which was not prepared for automotive applications, but has

been deemed suitable with regard to automotive applications. In particular, this avoids

automotive-relevant details being omitted during revisions with a focus on non-

automotive applications.

The official version of the Guideline released by the ECPE Working Group is a public

document available on the ECPE web site (www.ecpe.org).

Legal disclaimer

No liability shall attach to ECPE e.V. or its directors, employees, member organizations

or members of the responsible ECPE working group for any personal injury, property

damage or other damage of any nature whatsoever, whether direct or indirect, or for

costs (including legal fees) and expenses arising out of the publication of, use of, or

reliance upon, this ECPE Guideline or any other ECPE publications.

ECPE guidelines and publications are adopted without regard to whether or not their

adoption may involve patents or articles, materials, or processes. By such action ECPE

does not assume any liability to any patent owner, nor does it assume any obligation

whatever to parties adopting the ECPE guidelines or publications.

The ECPE Guideline AQG 324 is owned by ECPE European Center for Power

Electronics e.V.

This ECPE Guideline AQG 324 is licensed under a Creative Commons license

(license model CC BY ND) - with credit and sharing under the same conditions.

ECPE Guideline

AQG 324

Version 01 / 04-2018

Page 3 of 66

Contents

1 Scope 5

2 Overview 6

3 Referenced standards 8

4 Terms and definitions 9

4.1 Definitions 9

4.2 Abbreviations 11

4.3 Voltages and currents 12

4.4 Temperatures 13

4.5 Humidity 13

4.6 Times 14

4.7 Standard tolerances 14

4.8 Standard values 14

5 General part 15

5.1 Prerequisites for chip usage in the module 15

5.2 Technology qualification 15

5.3 Qualification of special designs (of power el. modules) based on discrete devices 15

5.4 Sampling rates and measured value resolutions 16

5.5 Design of insulation properties 16

5.6 Interface description 17

5.7 Physical analysis 17

5.8 Procedure limitations 17

6 Module test 18

6.1 QM – 01 Module test 18

7 Characterizing module testing 21

7.1 QC-01 Determining parasitic stray inductance (L

) 21

7.2 QC-02 Determining thermal resistance (R

value) 21

7.3 QC-03 Determining short-circuit capability 24

7.4 QC-04 Insulation test 27

7.5 QC-05 Determining mechanical data 29

7.6 Test sequence 30

8 Environmental testing 31

8.1 Use of generic data 31

8.2 QE-01 Thermal shock test (TST) 31

8.3 QE-02 Contactability (CO) 33

8.4 QE-03 Vibration (V) 33

8.5 QE-04 Mechanical shock (MS) 39

9 Lifetime testing 41

9.1 Use of generic data 41

9.2 QL-01 Power cycling (PC

sec

) 41

9.3 QL-02 Power cycle (PC

min

) 45

9.4 QL-03 High-temperature storage (HTS) 50

9.5 QL-04 Low-temperature storage (LTS) 51

9.6 QL-05 High-temperature reverse bias (HTRB) 52

9.7 QL-06 High-temperature gate bias (HTGB) 55

9.8 QL-07 High-humidity, high-temperature reverse bias (H3TRB) 56

ECPE Guideline

AQG 324

Version 01 / 04-2018

Page 5 of 66

1 Scope

This document defines requirements, test conditions and tests for validating properties,

including the lifetime of power electronics modules and equivalent special designs

based on discrete devices, for use in power electronics converter units (PCUs) of motor

vehicles up to 3.5 t gross vehicle weight

The described tests concern the module design as well as the qualification of devices

on module level (i.e. the assembly), but not the qualification of semiconductor chips or

manufacturing processes.

These tests do not replace the tests for complete vehicle PCUs.

The qualification requirements shall be extended or adapted, as necessary, on use of

technologically novel designs.

The requirements, test conditions and tests listed in this document essentially refer to

power modules based on Si power semiconductors. Future releases of this guideline

will address alternative semiconductor technologies e.g. SiC or GaN, and novel

assembly and interconnection technologies where other failure mechanisms become

important compared to the todays technologies.

The tests listed in this document also apply for validating power module properties when

using a thermal interface between the power module and the cooling system on PCU-

level, if this interface is not a part of the module structure as a result of the design.

Corresponding tests must be conducted on a reference test setup recommended and

documented by the module manufacturer, and any equivalent/generic test setups must

be specified and documented.

Note:

If the thermal interface to the cooling system is implemented in the PCU and not in the

power module, the module manufacturer cannot validate this interface. However, the

module manufacturer must demonstrate that his module passes the module

qualification in case of a connection as per the specification (recommended reference

test setups). The PCU manufacturer must ensure that the thermal interface selected by

it complies with the specifications from the module manufacturer.

Example:

Validation of the thermal interface of power electronics modules, which are applied to a

heat sink using a thermal interface material (TIM), is considered through specified

reference test setups (including materials) in this document.

Validation of the thermal interface of power electronics modules with a pin-fin base plate

located directly in the cooling medium is considered in this document.

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