1 Scope
Preamble
The AQG 324 represents an industry guideline based on best practices and outstanding
requirement engineering alignment through the automotive supply chain for power
electronic converter units. It also acts as blueprint for further approaches within the
automotive transformation to overcome innovation blocking hurdles and to close gaps in
product capability or corresponding assurance processes.
With the continuously increasing complexity of automotive electronics systems it is
necessary to combine the expertise and to standardize approaches along the whole
supply chain – different to outdated approaches where the alignment primarily occurred
within a design hierarchical level, rather than from a complete system perspective.
Consequently, a core achievement has been and still is to define the same technical
language as was only possible through jointly define and tune terms, definitions and
processes.
This document defines requirements, test conditions and tests for validating properties,
including the lifetime of power electronics modules and equivalent special designs based
on discrete devices, for use in power electronics converter units (PCUs) of motor vehicles
up to 3.5 t gross vehicle weight.
In case the power electronics components used in a PCU are not covered by the scope
of this guideline, the supplier and the customer need to ensure, that the tests described
in this document will be performed either in the qualification of the discrete devices, or on
converter unit level. Should one or more of the tests described in AQG 324 guideline not
be applicable in a certain design, the supplier must provide an explanation about the
reason for the inapplicability to the customer.
The described tests concern the module design as well as the qualification of devices on
module level (i.e. the assembly), but not the qualification of semiconductor chips or
manufacturing processes.
These tests do not replace the qualification tests for complete vehicle PCUs.
The qualification requirements shall be extended or adapted, as necessary, on use of
technologically novel designs.
The requirements, test conditions and tests listed in the main document essentially refer
to power modules based on Si power semiconductors while the specialities of SiC-based
power modules are addressed in Annex III.A of this guideline. Future releases of the
AGQ 324 Guideline will address further wide bandgap power semiconductors (e.g. GaN),
as well as novel assembly and interconnection technologies where other failure
mechanisms become important compared to the todays technologies.
The tests listed in this document also apply for validating power module properties when
using a thermal interface between the power module and the cooling system on PCU-
level, if this interface is not a part of the module structure as a result of the design.
Corresponding tests must be conducted on a reference test setup recommended and
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