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Silicon Wafer Processing 评分:

To provide an overview for manufacturing systems students of the steps and processes required to make integrated circuits from blank silicon wafers.

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2011-03-18 上传 大小:1.41MB
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Silicon Wafer Processing

To provide an overview for manufacturing systems students of the steps and processes required to make integrated circuits from blank silicon wafers.

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ENDPOINT DETECTION OF SILICON WAFER ETCH...

传感器在半导体晶圆片制造业中的应用与研究

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wafer introduce

公司内部资料,主要用于了解wafer生长工艺的,有兴趣的可以看看。

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wafer 小程序 quickstart nodejs master 示例代码 开发技术

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wafer上芯片产量估算,这是一个粗略估算wafer上die的产量excel文档,可以根据需要优化,修改,非常实用!

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K15A WAFER DATASHEET

MT9D111(K15A) WAFER DATASHEET

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Wafer 服务端 SDK - PHP

Wafer 服务端 SDK - PHP

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Wafer 服务端 Demo - PHP

Wafer 服务端 Demo - PHP

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WAFER-CV-N2600

CPU board 3,5" format from IEI

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在wafer2下部署小程序

此资料提供了 如何在wafer上部署小程序,并提供了服务器,数据库相关的配置

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微信小程序wafer的php后台demo,给新手学习用,很实用!

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on-wafer去嵌方法论文

Deembedding a device mounted between a pair of identical transitions requires the transition two-port parameters. These can be obtained using the through-line (TL) deembedding method requiring only through and uniform line deembedding standards. Other related deembedding methods introduce factors to

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转换G85wafer Maps到SINF格式

该工具可以将G85格式的WAfer maps转换成SINF格式, 便于设备直接调用。

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Wafer腾讯云下一代小程序综合解决方案

Wafer - 腾讯云下一代小程序综合解决方案

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Modified robust sliding-mode control method for wafer scanner

sliding-mode control 一篇不错的sci

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(FRN4 Wafer)SanDick_TLC_XXL_512Gb_BiCS3_SWDFR_512GB3ED3D_Toggle_Rev1.0_20170630

这是Flash的资料,里面有Pad的坐标和定义,对晶元的测试非常有帮助

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Real-time Monitoring of a Pulsed Power for Reactive Magnetron Sputtering Using a LabVIEW System

台大 文献 Due to a pulsed power offering the instant energy for extremely high plasma density, the purpose of this study is to develop the real-time monitoring system for the modern pulsed plasma coating by the LabVIEW technique. One selected exampl of the thin-film formation was testified based upon va

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KXTJ2-1009加速度传感器文档

he KXTJ2 is a tri-axis +/-2g, +/-4g or +/-8g silicon micromachined accelerometer. The sense element is fabricated using Kionix’s proprietary plasma micromachining process technology. Acceleration sensing is based on the principle of a differential capacitance arising from acceleration-induced

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± 8g / 16g / 32g Tri-axis Digital Accelerometer Specifications

The KX224-1053 is a tri-axis ±8g, ±16g or ±32g silicon micromachined accelerometer with integrated 2048-byte buffer, orientation, Directional-Tap TM /Double-Tap TM , activity detecting, and Free fall algorithms. The sense element is fabricated using Kionix’s proprietary plasma micromac

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芯片制造流程(中文)

芯片的制造过程可概分为晶圆处理工序(Wafer Fabrication)、晶圆针测工序(Wafer Probe)、构装工序(Packaging)、测试工序(Initial Test and Final Test)等几个步骤。其中晶圆处理工序和晶圆针测工序为前段(Front End)工序,而构装工序、测试工序为后段(Back End)工序。

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