简称 全文 简称 全文 简称 全文
AHE Automated handling equipment FP Field plate Rcrit Critical resistance
ANSI American National Standards Institute FWHM Full Width at Half Maximum RDL Redistribution layer
APD Anti-parallel diodes GP Ground plane RFPP RF pin pairs
ASTM American Society for Testing and Materials GSA Global Semiconductor Alliance Rpgp Resistance point-to-groundable point
ASTM American Society for Testing and Materials Gtp Ground termination point Rpp Resistance point-to-point
BCM Body contacting mechanism HBM Human body model Rtg Resistance Top to Ground
BCP Body contact point HMM Human metal model Rtt Resistance Top to Top
CAFÉ Constant area and force electrode IC Integrated Circuit S Standard
CBE Charged body event IDD / ISS Supply / ground current SCR Silicon controlled rectifier
CDE Cable discharge event IDDNOM Nominal supply current SDM Socketed device model
CDM Charged device model IDDNOM Nominal supply current SMTA Surface Mount Technology Association
CPM Charged plate monitor IDEMA International Disk Drive Equipment and
SOA Safe operation area
CTI Components Technology Institute, Inc. IDM Integrated device manufacturer SoC System on chip
CUT Component under test IEC International Electrotechnical Commission SP Standard practice
DIN Deutsches Institut fur Normung IEEE Institute of Electrical and Electronics
Engineers
SSPP Special signal pin pairs
DRC Design rule check IEST Institute of Environmental Sciences and
Technology
STDCOM Standards Committee
DUT Device under test iNARTE National Association of Radio and
Telecommunications Engineers
STM Standard test method
EDA Electronic design automation IP Intellectual property TAS Technical Advisory Support Committee
EGC Equipment grounding conductor IPC Association Connecting Electronic
Industries
TCAD Technology computer-aided design
EMI Electromagnetic imaging ISO International Organization for
Standardization
TDR Time domain reflectometer
EMI Electromagnetic interference ISTRESSMAX Stress current limit TDRT Time domain transmission and reflection
EOS Electrical overstress JEDEC Solid State Technology Association,
formerly known as the Joint Electron
TDT Time domain transmission
EPA ESD protected area LDMOS Laterally diffused MOS TFB Test fixture board
ERC Electrical rule check LVDS Low voltage differential signaling TLP Transmission line pulse
ESA Electrostatics Society of America MCM Multi-chip modules TR Technical report
ESD Electrostatic Discharge MM Machine model UPA Unprotected area
ESDS Electrostatic discharge sensitivity OVT Over-Voltage Tolerant circuit design VBM Vote-by-Mail
ESDS Electrostatic discharge susceptibility PCELL Parameterized cell VDD Supply voltage
eut Equipment under Test PUT Port under Test VDMOS Vertical diffused MOS
FCS Floor contacting surface Rbus Bus resistance VF-TLP Very fast transmission line pulse
评论0
最新资源