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MIL-STD-1580B.005764.pdf
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MIL-STD-1580B.005764.pdf
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METRIC
MIL-STD-l580B
7 January 2003
SUPERSEDING
MIL-STD-l580A(USAF)
22 December 1989
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
DESTRUCTIVE PHYSICAL ANALYSIS
FOR
ELECTRONIC, ELECTROMAGNETIC,
AND ELECTROMECHANICAL PARTS
AMSC N/A FSC 59GP
DISTRIBUTION STATEMENT A
. Approved for public release; distribution is unlimited.
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MIL-STD-1580B
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. To ensure the required high quality of parts used in the designs of space and launch vehicles, stringent in-
process controls are imposed and a comprehensive test program is conducted on the completed parts. A key
ingredient of the test program is the assessment of part lot quality based on the destructive examination of samples
randomly selected from each production lot. The destructive physical analysis (DPA) is used to inspect and verify the
internal design, materials, construction, and workmanship of the part. It can also be used to monitor processes, for
failure analysis, or to suggest corrective actions. The information derived from the DPA may be used:
a. To preclude installation of parts having patent or latent defects;
b. To aid in dispositioning parts that exhibit anomalies;
c. To aid in defining improvement changes in design, materials, or processes;
d. To evaluate supplier production trends.
3. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in
improving this document should be addressed to: Defense Supply Center, Columbus, ATTN: DSCC-VAT,
P.O. Box 3990, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD
Form 1426) appearing at the end of this document or by letter.
ii
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MIL-STD-1580B
CONTENTS
PARAGRAPH
PAGE
1. SCOPE ................................................................................................................................. 1
1.1 Purpose ................................................................................................................................ 1
1.2 Application of the standard ................................................................................................... 1
2. APPLICABLE DOCUMENTS................................................................................................ 1
2.1 General ................................................................................................................................. 1
2.2 Government documents........................................................................................................1
2.2.1 Specifications, standards, and handbooks............................................................................ 1
2.2.2 Government documents, drawings, and publications ........................................................... 3
2.3 Non-Government publications .............................................................................................. 4
2.4 Order of precedence............................................................................................................. 4
3. DEFINITIONS ....................................................................................................................... 4
3.1 Contracting officer................................................................................................................. 4
3.2 Defect ................................................................................................................................... 4
3.3 Destructive physical analysis ................................................................................................ 4
3.4 Lot-related defect.................................................................................................................. 4
3.5 Production lot (electronic parts) ............................................................................................ 4
3.6 Screenable defect ................................................................................................................. 4
3.7 Calibration............................................................................................................................. 4
3.8 Acronyms.............................................................................................................................. 5
3.9 Recycled, recovered, or environmentally preferable materials ............................................. 5
4. GENERAL REQUIREMENTS............................................................................................... 5
4.1 Sample size .......................................................................................................................... 5
4.1.1 DPA for a lot conformance test ............................................................................................. 5
4.1.1.1 DPA sample criteria .............................................................................................................. 5
4.1.1.2 Parallel tests ......................................................................................................................... 5
4.1.1.3 Combined samples ............................................................................................................... 5
4.1.1.4 Utilization of rejects............................................................................................................... 5
4.1.2 Resampling........................................................................................................................... 5
4.2 DPA procedures ................................................................................................................... 6
4.2.1 Baseline sketch..................................................................................................................... 6
4.2.2 DPA data records ................................................................................................................. 6
4.2.3 Test and inspection methods ................................................................................................ 6
4.2.3.1 External visual ...................................................................................................................... 6
4.2.4 Evaluation criteria ................................................................................................................. 6
4.3 Radiography ......................................................................................................................... 8
4.4 Disassembly and sample preparation................................................................................... 8
4.4.1 Delidding............................................................................................................................... 8
4.4.2 Sectioned samples ............................................................................................................... 8
4.4.3 Scanning Electron Microscopy samples ............................................................................... 8
4.5 Photographs/imagery............................................................................................................ 8
4.6 DPA residues/samples.......................................................................................................... 8
iii
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MIL-STD-1580B
PARAGRAPH
PAGE
5. DETAILED REQUIREMENTS .............................................................................................. 10
5.1 Detailed requirements........................................................................................................... 10
6. NOTES ................................................................................................................................. 10
6.1 Intended use ......................................................................................................................... 10
6.2 Tailored application............................................................................................................... 10
6.3 Documentation...................................................................................................................... 10
6.4 Subject term (key word) listing.............................................................................................. 10
6.5 Changes from the previous issue ......................................................................................... 10
FIGURE
PAGE
4-1 Sample DPA summary sheet................................................................................................ 7
4-2 Example of flat pack delidding vise....................................................................................... 9
REQUIREMENT
10 Detailed requirements for capacitors.
11 Detailed requirements for connectors.
12 Detailed requirements for quartz crystals.
13 Detailed requirements for diodes.
14 Detailed requirements for feed-through filters.
15 Detailed requirements for magnetic devices (inductors, transformers, and coils).
16 Detailed requirements for microcircuits (monolithic, hybrid, optocoupler, and multichip module).
17 Detailed requirements for relays.
18 Detailed requirements for resistors.
19 Detailed requirements for switches.
20 Detailed requirements for thermistors.
21 Detailed requirements for transistors.
22 Detailed requirements for selected RF devices.
23 Detailed requirements for fuses.
24 Detailed requirements for heaters.
iv
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MIL-STD-1580B
1. SCOPE
1.1 Scope
. This standard describes the general requirements for performance of destructive physical analysis
(DPA) on samples of parts. In addition to the requirements for the analysis procedures, the general criteria for
interpreting results, such as for the acceptance or rejection of associated production lots, is included for typical
electronic, electromagnetic, and electromechanical parts.
1.2 Application of the standard
. This standard; is intended to be referenced, in detailed part specifications; or in
other documents where DPA requirements are imposed, to assure that the practices, procedures, and criteria
contained herein are uniformly applied. The requirements are intended to provide the general framework and basis
for detailed DPA procedures for specific part types.
2. APPLICABLE DOCUMENTS
2.1 General
. The documents listed in this section are specified in sections 3, 4, and 5 of this standard. This
section does not include documents cited in other sections of this standard or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements documents cited in sections 3, 4, and 5 of this
standard, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and
supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATIONS
DEPARTMENT OF DEFENSE
MIL-PRF-20 - Capacitor, Fixed, Ceramic Dielectric (Temperature Compensating), Established
Reliability and Non-Established Reliability, General Specification for.
MIL-PRF-27 - Transformers and Inductors, (Audio, Power, and High-Power Pulse), General
Specification for.
MIL-PRF-123 - Capacitors, Fixed, Ceramic Dielectric (Temperature Stable and General
Purpose), High Reliability, General Specification for.
MIL-PRF-3098 - Crystals Units, Quartz, General Specification for.
MIL-PRF-6106 - Relays, Electromagnetic, General Specification for.
MIL-PRF-14409 - Capacitors, Variable (Piston Type, Tubular Trimmer), General Specification for.
MIL-PRF-15305 Coils, Fixed or Variable, Radio Frequency, General Specification for.
MIL-PRF-15160 - Fuses, Instrument, Power, and Telephone, General Specification for.
MIL-PRF-15733 - Filters and Capacitors, Radio Frequency Interference, General Specification for.
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
MIL-PRF-19978 - Capacitors, Fixed, Plastic (or Paper-Plastic), Dielectric, (Hermetically Sealed in
Metal, Ceramic, or Glass Cases) Established and Non-Established Reliability,
General Specification for.
MIL-PRF-21038 - Transformers, Pulse, Low Power, General Specification for.
MIL-PRF-23269 - Capacitor, Fixed, Glass Dielectric, Established Reliability, General Specification
for.
MIL-PRF-23648 - Resistor, Thermal (Thermistor) Insulated, General Specification for.
MIL-PRF-24236 - Switches, Thermostatic, (Metallic and Bimetallic), General Specification for.
MIL-H-28719 - Header, Hermetically Sealed.
MIL-PRF-28861 - Filters and Capacitors, Radio Frequency/Electromagnetic Interference
Suppression, General Specification for.
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
1
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