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MIL-STD-1310E.021105.PDF
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MIL-STD-1310E.021105.PDF
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M1L-STD-1310E (NAVY)
18 August 1987
SUPERSEDING
NIL-STD-I31OD(NAVY)
8 February 1979
(See 6.3)
MILITARY STANDARD
SHIPBOARD BONDING,
GROUNDING , AND OTHER TECHNIQUES
FOR ELECTRONAGNET1 C CONPATIB ILITY
AND SAFETY
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ANSC N/A
AREA EMCS
DISTRIBUTION STATEMENT A Approved for public release; distribution unlimited
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NIL-STD-I.510E(NAVY)
18 August 1987
DEPARTMENT OF THE NAVY
NAVAL SEA SYSTEMS CONNAND
Washington, DC 20362-5101
Shipboard Bonding, Grounding, and Other Techniques for Electromagnet ic
Compatibility and Safety
1. This f’filitaryStandard is approved for use by the Naval Sea Systems
Command, Department of the Navy;” and is available for use by al 1 Departments
.
and Agencies of the Department of Defense.
2. Beneficial comments (recommendations, additions, delet ions) and any
pertinent data which may be of use in improving this document should be
addressed to: Commander, Naval Sea Systems Command, SEA 55Z3, Department of
the Navy, Washington, DC 20362-5101 by using the self-addressed Standardization
Document Improvement Proposal (DD Form 1426) appearing at the end of this
document or by letter.
ii
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!!IL-STI)-131OE[NAVY)
18 August 1987
FORELIORD
The increased use of solid state equipment aboard Naval ships poses a
major electromagnetic interference (EnI) problem to ship operation and per-
formance due to the susceptibility of these equipments to the high shipboard
electromagnetic environment. Another potential problem to electronic equipmer,t
is the detrimental effects of an electromagnetic pulse (EMP) To provide
protection to solid state electronics,
this revision of M1L-STD-131O has been
expanded to provide additional requirements and details for EM I and ENP protec-
tion. Hardware to accomplish this protection has been developed and installation
methods have been detailed. The bonding, grounding, and shielding requirements
for both EMP protection and EM1 reduction are similar since the intent in both
cases is to keep electromagnetic radiations (EMP and high frequency (HF) antenna
radiations) from coupling to below deck equipment
The EMP protection requirements specified herein are minimum requirements
and are those that can be achieved within the scope of this standard. These
requirements do not include methods for EMP hardening of topside equipment or
below deck equipment. The hardening for tops ide equipment, including antennas,
and the additional hardening that may be required for below deck equipment shall
be specified in equipment acquisition specifications, SHIPALTS, ORDALTS, field
changes , or other publications.
●
This standard does not specify methods for achieving EM1 reduction through
equipment design, frequency selection, limits on operating power, equipment
location,
or use of m.ulticouplers or blankers These requirements may be found
in other publications
iii
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Paragraph 1.
1.1
1.2
1.3
1.4
1.5
2.
2.1
2.1.1
2.1.2
2.2
2.3
3.
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
3.19
3.20
3.21
3.22
3.23
3.24
3.25
4.
4.1
4.2
4.2.1
4.2.2
4.3
NIL-S”rD-131.OE(NAVY)
16 August 1987
CONTENTS
w
SCOPE ................................................
Scope ................................ .... ....... .
Application
............................ ... .
Classification ......................... ......... .
Bond strap types ............. ......... ...
Class B bonding preparation
........ ... ... ...
REFERENCED DOCUMENTS ..............................
Government documents ........... ....... ..... .. .
Specifications and standards ........................
Other Government drawings and publications .,....
Other publications ...................... ....
Order of precedence ................................
DEFINITIONS ............................. ............
Bond, electrical ............................... . .
Conduit ........................................... .
Electromagnetic interference (EM1) tests .,
Electromagnetic pulse (ENP) .................. ......
Enclosure ................................ ..........
Equipment, electrical .......... ....... .... .....
Equipment, electronic.,.. ........................
Ground (ground potential) ..........................
Ground, personnel safety.. ...... .... ........... .
Ground plates .................................... .
Ground, radio frequency (rf). .......................
Ground, single point
............................
Ground system
........................... . .........
Ground, 360 degrees ............................... .
Grounding ...........................................
Nonlinear junction ..............................
Nontopside areas ................................ .
Penetration .............................. ..... . ..
Shield or shield ing ............. . . ............. .
Space, electrical ................. ..... . .......
Space, electronic ....................... .........
Tack weld ...........................................
Terminal protection device (TPD) ....................
Topside areas ............................. .........
~nk, wireway ......................................
GENERAL REQUIREMENTS .................................
Ground potent ial designation ........................
Ground system installation
.........................
Metal lic hull ships .................................
Nonmetal lic hull ships ............. .............
EMIand IMI reduction ......... .....................
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o
rlllJ-s’rD-1310E(Ni\vY)
1.8August 1987
CONTENTS - Continued
Paragraph 4.3.1
4.3. 1.1
4.3.1 .1.1
4.3.1 .1.2
4.3. 1.1,3
4.3.1 ,1.4
4.3. 1.1.5
4.3. 1.1.6
4,3.2
4.3.2.1
EM1 reduction, basic criteria ....................
EM1 reduction, general requirements . .
Equipment .. .... .. .. .... ... ................
Cables .... .......... .............. . .........
Portable spaces .. ..................... ....’.....
Broadband ENI reduction ..........................
Regrounding ............................ .
Maintenance E!lI ............................ .
1!11reduction, basic criteria ................ .,
IN1 reduction, general requirements ..............
5. DETAILED REQUIREMENTS ................... .........
5.1
Cable ground systems ..........................
5.1.1 Nonmetal lic hull ships ...........................
5.1.1.1 Ground plates .................. ............. ..
5. 1.1.2 Ground cables .......... .... .............
5. 1.1.2.1 Ground plate interconnecting cable .........
5 .1.1.2.2 Electronic transmitter ground cable . . .
5.1.1.2.3 Antenna tuners ground cable ... ..................
5.1.1.2.4 Main ground cable ................... ............
5.1.1.2.5 Branch ground cables ................... . .......
5,1.1.2.6 Ground cable installation ....... .... ...........
5.1,1.2.7 Lightning protect ion..... ........................
5.1.1.3
Equipment requiring grounding ........ ...........
5.1.1.3.1 Grounding to shielded room .. ....................
5.1.1.3.2 Connections ......................................
5.1.1.4
5.2
5.2.1
5 .2.2
5,2.3
5.2.4
5.2.5
5.3
5.3.1
5,3.1.1
5.3. 1.2
5.3. 1.3
5.3. 1.4
5.3.2
5.3.2.1
5.3.2.2
5.3.2.3
5.3.2.4
5.3.2.5
5,3.2.6
5.3.2.7
Ground loops ......................... ...........
Personnel safety ............. ...................
Fixed equipment grounding ........................
ilorkbench grounding ..............................
Honeycomb bulkhead grounding ....................
Welding equipment grounding .............. .......
Rfradiation or burn hazards ............ .......
EMIand INI reduction ........... ... .... .... ..
ENI reduction ....................... ...........
Equipment .... ....... ..........................
Cables .......................... . . . . .
Waveguides, pipes, tubing and exhaust stacks ....
Submarines .... ..................... .. .
IMI reduction ............... . . .
Yardarm foot and band safety ropes .......
Rigging ..........................................
Lifelines and liferails ..........................
Life and safety nets .............................
Portable flagstaffs , jackstaffs , and stanchions
Awnings ..........................................
Ladders .............................. ...........
@
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