AT24C32D
I²C-Compatible (2-Wire) Serial EEPROM 32‑Kbit (4,096 x 8)
Features
• Low-Voltage and Standard-Voltage Operation:
– V
CC
= 1.7V to 5.5V
• Internally Organized as 4,096 x 8 (32K)
• Industrial Temperature Range: -40°C to +85°C
• I
2
C-Compatible (2-Wire) Serial Interface:
– 100 kHz Standard mode, 1.7V to 5.5V
– 400 kHz Fast mode, 1.7V to 5.5V
– 1 MHz Fast Mode Plus (FM+), 2.5V to 5.5V
• Schmitt Triggers, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• Write‑Protect Pin for Full Array Hardware Data Protection
• Ultra Low Active Current (3 mA maximum) and Standby Current (6 μA maximum)
• 32-Byte Page Write Mode:
– Partial page writes allowed
• Random and Sequential Read Modes
• Self‑Timed Write Cycle within 5 ms Maximum
• High Reliability:
– Endurance: 1,000,000 write cycles
– Data retention: 100 years
• Green Package Options (Lead-free/Halide-free/RoHS compliant)
• Die Sale Options: Wafer Form and Bumped Wafers
Packages
• 8-Lead SOIC, 8-Lead TSSOP, 8-Pad UDFN, 8-Pad XDFN, 5-Lead SOT23 and 8-Ball VFBGA
© 2018 Microchip Technology Inc.
Datasheet
DS20006047A-page 1
Table of Contents
Features.......................................................................................................................... 1
Packages.........................................................................................................................1
1. Package Types (not to scale).................................................................................... 4
2. Pin Descriptions.........................................................................................................5
2.1. Device Address Inputs (A0, A1, A2).............................................................................................5
2.2. Ground......................................................................................................................................... 5
2.3. Serial Data (SDA).........................................................................................................................5
2.4. Serial Clock (SCL)........................................................................................................................5
2.5. Write-Protect (WP)....................................................................................................................... 6
2.6. Device Power Supply................................................................................................................... 6
3. Description.................................................................................................................7
3.1. System Configuration Using 2-Wire Serial EEPROMs ................................................................7
3.2. Block Diagram.............................................................................................................................. 8
4. Electrical Characteristics........................................................................................... 9
4.1. Absolute Maximum Ratings..........................................................................................................9
4.2. DC and AC Operating Range.......................................................................................................9
4.3. DC Characteristics....................................................................................................................... 9
4.4. AC Characteristics......................................................................................................................10
4.5. Electrical Specifications..............................................................................................................11
5. Device Operation and Communication....................................................................13
5.1. Clock and Data Transition Requirements...................................................................................13
5.2. Start and Stop Conditions.......................................................................................................... 13
5.3. Acknowledge and No-Acknowledge...........................................................................................14
5.4. Standby Mode............................................................................................................................ 14
5.5. Software Reset...........................................................................................................................15
6. Memory Organization.............................................................................................. 16
6.1. Device Addressing..................................................................................................................... 16
7. Write Operations......................................................................................................18
7.1. Byte Write...................................................................................................................................18
7.2. Page Write..................................................................................................................................18
7.3. Acknowledge Polling.................................................................................................................. 19
7.4. Write Cycle Timing..................................................................................................................... 19
7.5. Write Protection..........................................................................................................................20
8. Read Operations..................................................................................................... 21
8.1. Current Address Read................................................................................................................21
8.2. Random Read............................................................................................................................ 21
AT24C32D
© 2018 Microchip Technology Inc.
Datasheet
DS20006047A-page 2
8.3. Sequential Read.........................................................................................................................22
9. Device Default Condition from Microchip................................................................ 23
10. Packaging Information.............................................................................................24
10.1. Package Marking Information.....................................................................................................24
11. Revision History.......................................................................................................36
The Microchip Web Site................................................................................................ 37
Customer Change Notification Service..........................................................................37
Customer Support......................................................................................................... 37
Product Identification System........................................................................................38
Microchip Devices Code Protection Feature................................................................. 38
Legal Notice...................................................................................................................39
Trademarks................................................................................................................... 39
Quality Management System Certified by DNV.............................................................40
Worldwide Sales and Service........................................................................................41
AT24C32D
© 2018 Microchip Technology Inc.
Datasheet
DS20006047A-page 3
1. Package Types (not to scale)
A0
A1
A2
GND
Vcc
WP
SCL
SDA
8-pad UDFN/XDFN
(Top View)
8-lead SOIC/TSSOP
(Top View)
A0 1
2
3
4
8
7
6
5
A1
A2
GND
Vcc
WP
SCL
SDA
1
2
3
4
8
7
6
5
A0
A1
A2
GND
Vcc
WP
SCL
SDA
8-ball VFBGA
(Top View)
5-lead SOT23
(1)
(Top View)
SCL 1
2
3
5
4
GND
SDA
WP
Vcc
1
2
3
4 5
6
7
8
Note:
1. Refer to 6.1 Device Addressing for details about addressing the SOT23 version of the device.
AT24C32D
Package Types (not to scale)
© 2018 Microchip Technology Inc.
Datasheet
DS20006047A-page 4
2. Pin Descriptions
The descriptions of the pins are listed in Table 2-1.
Table 2-1. Pin Function Table
Name 8‑Lead SOIC 8‑Lead TSSOP 8‑Pad
UDFN
(1)
8-Pad XDFN 5-Lead
SOT23
8‑Ball VFBGA Function
A0
(2)
1 1 1 1 — 1 Device Address Input
A1
(2)
2 2 2 2 — 2 Device Address Input
A2
(2)
3 3 3 3 — 3 Device Address Input
GND 4 4 4 4 2 4 Ground
SDA 5 5 5 5 3 5 Serial Data
SCL 6 6 6 6 1 6 Serial Clock
WP
(2)
7 7 7 7 5 7 Write-Protect
V
CC
8 8 8 8 4 8 Device Power Supply
Note:
1. The exposed pad on this package can be connected to GND or left floating.
2. If the A0, A1, A2 or WP pins are not driven, they are internally pulled down to GND. In order to
operate in a wide variety of application environments, the pull‑down mechanism is intentionally
designed to be somewhat strong. Once these pins are biased above the CMOS input buffer’s trip
point (~0.5 x V
CC
), the pull‑down mechanism disengages. Microchip recommends connecting these
pins to a known state whenever possible.
2.1 Device Address Inputs (A0, A1, A2)
The A0, A1 and A2 pins are device address inputs that are hard-wired (directly to GND or to V
CC
) for
compatibility with other 2-wire Serial EEPROM devices. When the pins are hard-wired, as many as eight
devices may be addressed on a single bus system. A device is selected when a corresponding hardware
and software match is true. If these pins are left floating, the A0, A1 and A2 pins will be internally pulled
down to GND. However, due to capacitive coupling that may appear in customer applications, Microchip
recommends always connecting the address pins to a known state. When using a pull‑up resistor,
Microchip recommends using 10 kΩ or less.
2.2 Ground
The ground reference for the power supply. GND should be connected to the system ground.
2.3 Serial Data (SDA)
The SDA pin is an open‑drain bidirectional input/output pin used to serially transfer data to and from the
device. The SDA pin must be pulled high using an external pull‑up resistor (not to exceed 10 kΩ in value)
and may be wire-ORed with any number of other open‑drain or open‑collector pins from other devices on
the same bus.
2.4 Serial Clock (SCL)
The SCL pin is used to provide a clock to the device and to control the flow of data to and from the
device. Command and input data present on the SDA pin is always latched in on the rising edge of SCL,
AT24C32D
Pin Descriptions
© 2018 Microchip Technology Inc.
Datasheet
DS20006047A-page 5
