Contents
1 Overview............................................................ 5
2 Block diagram.....................................................5
3 Feature comparison......................................... 12
4 Ordering information.........................................17
4.1 Determining valid orderable parts ................ 17
5 General.............................................................17
5.1 Absolute maximum ratings............................18
5.2 Voltage and current operating requirements.19
5.3 Thermal operating characteristics.................21
5.4 ESD and Latch-up Protection Characteristics
...................................................................... 22
6 Power management......................................... 22
6.1 Power management system - S32K344,
S32K324, S32K341, S32K314, S32K342, and
S32K322....................................................... 23
6.2 Power management system - S32K312,
S32K311, S32K310...................................... 24
6.3 Power management system - S32K358,
S32K348, S32K338, S32K328......................25
6.4 Power management system - S32K388....... 26
6.5 Power mode transition operating behaviors..26
6.5.1 Power mode transition operating behavior... 26
6.5.2 Boot time, HSE firmware not installed.......... 27
6.5.3 Boot time, HSE firmware installed................ 27
6.5.4 HSE firmware memory verification time
examples.......................................................28
6.6 Supply Monitoring......................................... 32
6.7 Recommended Decoupling Capacitors........ 34
6.8 V15 regulator (SMPS option) electrical
specifications................................................ 46
6.9 V15 regulator (BJT option, NPN ballast
transistor control) electrical specifications.... 47
6.10 V11 regulator (NMOS ballast transistor control)
electrical specifications................................. 48
6.11 Supply currents............................................. 49
6.12 Operating mode............................................ 68
6.13 Cyclic wake-up current .................................70
7 I/O parameters................................................. 70
7.1 GPIO DC electrical specifications, 3.3V Range
(2.97V - 3.63V)..............................................70
7.2 GPIO DC electrical specifications, 5.0V (4.5V -
5.5V)............................................................. 74
7.3 5.0V (4.5V - 5.5V) GPIO Output AC
Specification..................................................78
7.4 3.3V (2.97V - 3.63V) GPIO Output AC
Specification..................................................79
8 Glitch Filter....................................................... 80
9 Flash memory specification..............................81
9.1 Flash memory program and erase
specifications................................................ 81
9.2 Flash memory Array Integrity and Margin Read
specifications................................................ 82
9.3 Flash memory module life specifications...... 83
9.3.1 Data retention vs program/erase cycles....... 83
9.4 Flash memory AC timing specifications........ 84
9.5 Flash memory read timing parameters......... 84
10 Analog modules................................................85
10.1 SAR ADC...................................................... 85
10.2 Supply Diagnosis.......................................... 88
10.3 Low Power Comparator (LPCMP)................ 88
10.4 Temperature Sensor..................................... 92
11 Clocking modules............................................. 92
11.1 FIRC..............................................................92
11.2 SIRC............................................................. 93
11.3 PLL................................................................93
11.4 Fast External Oscillator (FXOSC)................. 94
11.5 Slow Crystal Oscillator (SXOSC).................. 97
12 Communication interfaces................................97
12.1 LPSPI............................................................97
12.2 LPSPI0 20 MHz and 15 MHz Combinations102
12.3 Communication between two S32K388
devices........................................................102
12.3.1 Timing specification for S32K388 to S32K388
communication............................................104
12.4 I
2
C............................................................... 104
12.5 FlexCAN characteristics..............................104
12.6 SAI electrical specifications........................ 104
12.6.1 SAI Electrical Characteristics, Slave Mode.105
12.6.2 SAI Electrical Characteristics, Master Mode106
12.7 Ethernet characteristics.............................. 107
12.7.1 Ethernet MII (100 Mbps)............................. 107
12.7.2 Ethernet MII (200 Mbps)............................. 109
12.7.3 Ethernet RMII..............................................111
12.7.4 Ethernet RGMII........................................... 113
12.7.5 MDIO timing specifications......................... 114
12.8 QuadSPI..................................................... 115
12.8.1 QuadSPI Quad 3.3V SDR 120MHz............ 115
12.8.2 QuadSPI Octal 3.3V DDR 100MHz............ 117
12.8.3 QuadSPI Quad 3.3V SDR 103.33MHz....... 118
12.8.4 QuadSPI Octal 3.3V DDR 120MHz............ 119
12.8.5 QuadSPI Quad 3.3V SDR 125MHz............ 120
12.9 uSDHC........................................................121
12.9.1 uSDHC SDR electrical specifications......... 121
12.9.2 uSDHC DDR electrical specifications......... 122
12.10 LPUART specifications............................... 123
13 Debug modules.............................................. 123
13.1 Debug trace timing specifications............... 124
13.2 SWD electrical specifications......................124
13.3 JTAG electrical specifications..................... 126
14 Thermal Attributes.......................................... 128
