IEC 61709
Edition 3.0 2017-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electric components – Reliability – Reference conditions for failure rates and
stress models for conversion
Composants électriques – Fiabilité – Conditions de référence pour les taux de
défaillance et modèles de contraintes pour la conversion
IEC 61709:2017-02(en-fr)
®
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IEC 61709
Edition 3.0 2017-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electric components – Reliability – Reference conditions for failure rates and
stress models for conversion
Composants électriques – Fiabilité – Conditions de référence pour les taux de
défaillance et modèles de contraintes pour la conversion
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020
ISBN 978-2-8322-3902-5
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
®
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– 2 – IEC 61709:2017 © IEC 2017
CONTENTS
FOREWORD ........................................................................................................................... 9
INTRODUCTION ................................................................................................................... 11
1 Scope ............................................................................................................................ 12
2 Normative references .................................................................................................... 12
3 Terms, definitions and symbols ..................................................................................... 12
3.1 Terms and definitions............................................................................................ 12
3.2 Symbols ................................................................................................................ 16
4 Context and conditions .................................................................................................. 17
4.1 Failure modes and mechanisms ............................................................................ 17
4.2 Thermal modelling ................................................................................................ 18
4.3 Mission profile consideration ................................................................................. 18
4.3.1 General ......................................................................................................... 18
4.3.2 Operating and non-operating conditions ........................................................ 18
4.3.3 Dormancy ...................................................................................................... 19
4.3.4 Storage ......................................................................................................... 19
4.4 Environmental conditions ...................................................................................... 19
4.5 Components choice .............................................................................................. 21
4.6 Reliability growth during the deployment phase of new equipment ........................ 22
4.7 How to use this document ..................................................................................... 23
5 Generic reference conditions and stress models ............................................................ 24
5.1 Recommended generic reference conditions ......................................................... 24
5.2 Generic stress models .......................................................................................... 25
5.2.1 General ......................................................................................................... 25
5.2.2 Stress factor for voltage dependence,
U
π
...................................................... 26
5.2.3 Stress factor for current dependence,
I
π
........................................................ 26
5.2.4 Stress factor for temperature dependence,
T
π
.............................................. 26
5.2.5 Environmental application factor,
E
π
............................................................. 28
5.2.6 Dependence on switching rate,
S
π
................................................................ 28
5.2.7 Dependence on electrical stress,
ES
π
............................................................ 29
5.2.8 Other factors of influence .............................................................................. 29
6 Integrated semiconductor circuits .................................................................................. 29
6.1 Specific reference conditions ................................................................................ 29
6.2 Specific stress models .......................................................................................... 31
6.2.1 General ......................................................................................................... 31
6.2.2 Voltage dependence, factor
U
π
..................................................................... 32
6.2.3 Temperature dependence, factor
T
π
............................................................. 32
7 Discrete semiconductors ............................................................................................... 35
7.1 Specific reference conditions ................................................................................ 35
7.2 Specific stress models .......................................................................................... 36
7.2.1 General ......................................................................................................... 36
7.2.2 Voltage dependence for transistors, factor
U
π
............................................... 37
7.2.3 Temperature dependence, factor
T
π
............................................................. 37
8 Optoelectronic components ........................................................................................... 39
IEC 61709:2017 © IEC 2017 – 3 –
8.1
Specific reference conditions ................................................................................ 39
8.2 Specific stress models .......................................................................................... 41
8.2.1 General ......................................................................................................... 41
8.2.2 Voltage dependence, factor
U
π
..................................................................... 41
8.2.3 Current dependence, factor
I
π
....................................................................... 41
8.2.4 Temperature dependence, factor
T
π
............................................................. 42
9 Capacitors ..................................................................................................................... 44
9.1 Specific reference conditions ................................................................................ 44
9.2 Specific stress model ............................................................................................ 44
9.2.1 General ......................................................................................................... 44
9.2.2 Voltage dependence, factor
U
π
..................................................................... 44
9.2.3 Temperature dependence, factor
T
π
............................................................. 46
10 Resistors and resistor networks ..................................................................................... 47
10.1 Specific reference conditions ................................................................................ 47
10.2 Specific stress models .......................................................................................... 48
10.2.1 General ......................................................................................................... 48
10.2.2 Temperature dependence, factor
T
π
............................................................. 48
11 Inductors, transformers and coils ................................................................................... 49
11.1 Reference conditions ............................................................................................ 49
11.2 Specific stress model ............................................................................................ 49
11.2.1 General ......................................................................................................... 49
11.2.2 Temperature dependence, factor
T
π
.............................................................. 49
12 Microwave devices ........................................................................................................ 50
12.1 Specific reference conditions ................................................................................ 50
12.2 Specific stress models .......................................................................................... 51
13 Other passive components ............................................................................................ 51
13.1 Specific reference conditions ................................................................................ 51
13.2 Specific stress models .......................................................................................... 51
14 Electrical connections .................................................................................................... 51
14.1 Specific reference conditions ................................................................................ 51
14.2 Specific stress models .......................................................................................... 52
15 Connectors and sockets ................................................................................................ 52
15.1 Reference conditions ............................................................................................ 52
15.2 Specific stress models .......................................................................................... 52
16 Relays ........................................................................................................................... 52
16.1 Reference conditions ............................................................................................ 52
16.2 Specific stress models .......................................................................................... 53
16.2.1 General ......................................................................................................... 53
16.2.2 Dependence on switching rate, factor
S
π
...................................................... 53
16.2.3 Dependence on electrical stress, factor
ES
π
.................................................. 54
16.2.4 Temperature dependence, factor
T
π
............................................................. 55
17 Switches and push-buttons ............................................................................................ 55
17.1 Specific reference conditions ................................................................................ 55
17.2 Specific stress model ............................................................................................ 56
17.2.1 General ......................................................................................................... 56