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s3c6400 datasheet
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2009-02-24
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这是三星6400芯片的datasheet,其内核是arm11,这是继2440以后将大量使用的芯片。
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USER'S MANUAL
S3C6400X
RISC Microprocessor
February 28, 2008
REV 1.00
Confidential Proprietary of Samsung Electronics Co., Ltd
Copyright © 2008 Samsung Electronics, Inc. All Rights Reserved
Important Notice
The information in this publication has been carefully
checked and is believed to be entirely accurate at
the time of publication. Samsung assumes no
responsibility, however, for possible errors or
omissions, or for any consequences resulting from
the use of the information contained herein.
Samsung reserves the right to make changes in its
products or product specifications with the intent to
improve function or design at any time and without
notice and is not required to update this
documentation to reflect such changes.
This publication does not convey to a purchaser of
semiconductor devices described herein any license
under the patent rights of Samsung or others.
Samsung makes no warranty, representation, or
guarantee regarding the suitability of its products for
any particular purpose, nor does Samsung assume
any liability arising out of the application or use of
any product or circuit and specifically disclaims any
and all liability, including without limitation any
consequential or incidental damages.
"Typical" parameters can and do vary in different
applications. All operating parameters, including
"Typicals" must be validated for each customer
application by the customer's technical experts.
Samsung products are not designed, intended, or
authorized for use as components in systems
intended for surgical implant into the body, for other
applications intended to support or sustain life, or for
any other application in which the failure of the
Samsung product could create a situation where
personal injury or death may occur.
Should the Buyer purchase or use a Samsung
product for any such unintended or unauthorized
application, the Buyer shall indemnify and hold
Samsung and its officers, employees, subsidiaries,
affiliates, and distributors harmless against all
claims, costs, damages, expenses, and reasonable
attorney fees arising out of, either directly or
indirectly, any claim of personal injury or death that
may be associated with such unintended or
unauthorized use, even if such claim alleges that
Samsung was negligent regarding the design or
manufacture of said product.
S3C6400X RISC Microprocessor
User's Manual, Revision 1.00
Copyright © 2008 Samsung Electronics Co.,Ltd.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in
any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior
written consent of Samsung Electronics Co.,Ltd.
Samsung Electronics Co., Ltd.
San #24 Nongseo-Dong, Giheung-Gu
Yongin-City Gyeonggi-Do, Korea
446-711
Home Page: http://www.samsungsemi.com/
E-Mail: mobilesol.cs@samsung.com
Printed in the Republic of Korea
S3C6400X_USER’S MANUAL_REV 1.00 iii
Revision History
Revision No Description of Change Refer to Author(s) Date
1.00 - Initial Release - W.J.Kim February 28, 2008
NOTE: Revised parts are written in blue.
iv S3C6400X_USER’S MANUAL_REV 1.00
Table of Contents
Chapter 1 Product Overview
1 Architectural Overview ...............................................................................................................................1-1
1.1 Features..............................................................................................................................................1-2
1.1.1 S3C6400X RISC Microprocessor Features Summary................................................................1-3
1.1.2 Microprocessor ............................................................................................................................1-4
1.1.3 Memory Subsystem.....................................................................................................................1-5
1.1.3.1 SROM Memory Port configurable to support the following memory types: .........................1-5
1.1.3.2 DRAM port configurable to support the following memory types:........................................1-6
1.1.4 Multimedia Acceleration ..............................................................................................................1-6
1.1.4.1 Camera Interface..................................................................................................................1-6
1.1.4.2 Multi Format Codec (MFC)...................................................................................................1-7
1.1.4.3 JPEG Codec.........................................................................................................................1-7
1.1.5 2D Graphics Accelerator .............................................................................................................1-7
1.1.6 Image Rotator..............................................................................................................................1-7
1.1.7 Display Control ............................................................................................................................1-8
1.1.7.1 TFT LCD Interface................................................................................................................1-8
1.1.7.2 Video Post Processor...........................................................................................................1-8
1.1.7.3 TV (NTSC/PAL) Video Encoder with Image Enhancer........................................................1-8
1.1.8 Audio Interface.............................................................................................................................1-8
1.1.8.1 AC97 Audio-CODEC Interface.............................................................................................1-8
1.1.8.2 PCM serial Audio Interface ..................................................................................................1-8
1.1.8.3 IIS-Bus Stereo DAC Interface ..............................................................................................1-9
1.1.9 USB Support................................................................................................................................1-9
1.1.9.1 USB OTG 2.0 High Speed(Device)......................................................................................1-9
1.1.9.2 USB Host..............................................................................................................................1-9
1.1.10 IrDA v1.1....................................................................................................................................1-9
1.1.11 Serial Communication ...............................................................................................................1-9
1.1.11.1 UART..................................................................................................................................1-9
1.1.11.2 IIC-Bus Interface ................................................................................................................1-10
1.1.11.3 SPI Interface.......................................................................................................................1-10
1.1.11.4 MIPI HSI .............................................................................................................................1-10
1.1.12 Modem Interface........................................................................................................................1-10
1.1.12.1 Parallel Modem Chip Interface...........................................................................................1-10
1.1.13 GPIO (General Purpose I/O) .....................................................................................................1-10
1.1.14 Input Devices.............................................................................................................................1-10
1.1.14.1 Keypad Interface ................................................................................................................1-10
1.1.14.2 A/D Converter and Touch Screen Interface.......................................................................1-10
1.1.15 Storage Devices ........................................................................................................................1-11
1.1.15.1 MMC/SD Host ....................................................................................................................1-11
1.1.16 System Peripherals....................................................................................................................1-11
1.1.16.1 DMA controller....................................................................................................................1-11
1.1.16.2 Vectored Interrupt Controller..............................................................................................1-11
1.1.16.3 TrustZone Protection Controller.........................................................................................1-11
1.1.16.4 Timer with PWM (Pulse Width Modulation) .......................................................................1-12
1.1.16.5 16-bit Watchdog Timer.......................................................................................................1-12
1.1.16.6 RTC (Real Time Clock) ......................................................................................................1-12
1.1.17 System Management.................................................................................................................1-12
1.1.18 System Operating Frequencies.................................................................................................1-12
S3C6400X_USER’S MANUAL_REV 1.00 v
Table of Contents
Chapter 1 Product Overview
1.2 Power Management................................................................................................................................1-13
1.3 Electrical Characteristics.........................................................................................................................1-13
1.4 Package ..................................................................................................................................................1-13
1.5 Pin Assignments .....................................................................................................................................1-14
1.5.1 The Table Below Shows I/O Types and Descriptions.................................................................1-32
1.6 Pin Description........................................................................................................................................1-33
1.6.1 External Memory Interface ..........................................................................................................1-33
1.6.2 Serial Communication .................................................................................................................1-36
1.6.3 Parallel Communication ..............................................................................................................1-40
1.6.4 Modem Interface .........................................................................................................................1-41
1.6.5 Image/Video Processing .............................................................................................................1-43
1.6.6 Display Control............................................................................................................................1-44
1.6.7 Storage Devices..........................................................................................................................1-45
1.6.8 System Management ..................................................................................................................1-46
1.7 Power-supply Groups .........................................................................................................................1-47
Chapter 2 Memory_Map
2.1 Memory System Block Diagram..............................................................................................................2-1
2.2 Device Specific Address Space..............................................................................................................2-3
Chapter 3 System Controller
3.1 overview ..................................................................................................................................................3-1
3.2 Features..................................................................................................................................................3-1
3.3 Functional description.............................................................................................................................3-2
3.3.1 Hardware architecture ....................................................................................................................3-2
3.3.2 Clock architecture ...........................................................................................................................3-3
3.3.2.1 Clock source selection .............................................................................................................3-4
3.3.2.2 Phase locked loop (PLL) ..........................................................................................................3-4
3.3.2.3 Clock selection between PLL's and input reference clock.......................................................3-5
3.3.2.4 ARM and AXI/AHB/APB bus clock generation.........................................................................3-6
3.3.2.5 Clock ratio change....................................................................................................................3-7
3.3.2.6 OneNAND clock generation.....................................................................................................3-8
3.3.2.7 MFC clock generation ..............................................................................................................3-8
3.3.2.8 Camera I/F clock generation....................................................................................................3-9
3.3.2.9 Clock generation for display (POST, LCD, and scaler) ...........................................................3-9
3.3.2.10 Clock generation for audio (IIS and PCM) .............................................................................3-10
3.3.2.11 Clock generation for UART, SPI, and MMC...........................................................................3-10
3.3.2.12 Clock generation for IrDA, USB host......................................................................................3-11
3.3.2.13 Clock ON/OFF control............................................................................................................3-11
3.3.2.14 Clock output ...........................................................................................................................3-11
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