Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 2
3 说明................................................................................... 3
3.1 功能模块图.................................................................. 4
4 Revision History.............................................................. 5
5 Device Comparison......................................................... 9
5.1 Related Products...................................................... 12
6 Terminal Configuration and Functions........................13
6.1 Pin Diagram.............................................................. 13
6.2 Pin Attributes.............................................................14
6.3 Signal Descriptions................................................... 82
6.4 Pin Multiplexing.......................................................138
6.5 Connections for Unused Pins................................. 153
7 Specifications.............................................................. 156
7.1 Absolute Maximum Ratings.................................... 156
7.2 ESD Ratings........................................................... 160
7.3 Power-On-Hour (POH) Limits................................. 160
7.4 Recommended Operating Conditions.....................160
7.5 Operating Performance Points................................163
7.6 Power Consumption Summary............................... 163
7.7 Electrical Characteristics.........................................164
7.8 VPP Specifications for One-Time Programmable
(OTP) eFuses............................................................171
7.9 Thermal Resistance Characteristics....................... 173
7.10 Timing and Switching Characteristics................... 174
8 Detailed Description....................................................291
8.1 Overview................................................................. 291
8.2 Processor Subsystems........................................... 292
8.3 Accelerators and Coprocessors..............................293
8.4 Other Subsystems.................................................. 295
9 Applications and Implementation.............................. 304
9.1 Power Supply Mapping........................................... 304
9.2 Device Connection and Layout Fundamentals....... 307
9.3 Peripheral- and Interface-Specific Design
Information................................................................ 309
10 Device and Documentation Support........................314
10.1 Device Nomenclature............................................314
10.2 Tools and Software............................................... 316
10.3 Documentation Support........................................ 317
10.4 支持资源................................................................317
10.5 Trademarks........................................................... 317
10.6 Electrostatic Discharge Caution............................317
10.7 术语表................................................................... 317
11 Mechanical, Packaging, and Orderable
Information.................................................................. 318
11.1 Packaging Information.......................................... 318
4 Revision History
Changes from July 22, 2021 to August 27, 2021 (from Revision I (July 2021) to Revision J
(August 2021)) Page
• 通篇：删除了引用的“DMIPS”.........................................................................................................................1
• (Device Comparison): Deleted "MCU Island with Lockstep Arm Cortex-R5Fs" row, as info in Lockstep and
Safety Targeted rows. ........................................................................................................................................ 9
• (Pin Attributes): Updated Buffer Types for MCU_PORz and PORz to FS Reset..............................................14
• Updated USB0/1_RCALIB note to indicate the pin must be connected with an external resistor to VSS even
when unused.................................................................................................................................................. 106
• Updated REXT pin note to show it should always be connected through an external resistor to VSS, even
when unused.................................................................................................................................................. 106
• Added clarification notes to MMC1_SDCD and MMC2_SDCD signals about pulled down requirement........112
• Updated CSI0 Signal Descriptions and CSI1 Signal Descriptions to show the RCALIB pins must be
connected to VSS through the external resistor even when unused.............................................................. 128
• (DSI_TX0 Signal Descriptions): Updated RCALIB pin description to show the pin must be connected to VSS
through an external resistor even when unused.............................................................................................129
• Added note indicting power balls should be connected to voltage specified in Recommended Operating
Conditions when unused................................................................................................................................ 134
• Added SERDES[0:4]_REXT rows in Connections for Unused Pins, these pins need to be connected to VSS
when unused.................................................................................................................................................. 153
• Showed VMON balls should be connected to PWR if unused in Connections for Unused Pins. Also added
note specifying MMC1_SDCD and MMC2_SDCD should be pulled down to function properly ....................153
• Showed CSI[1:0]_RXRCALIB, DSI_TXRCALIB, USB[1:0]_RCALIB pins should be connected to VSS is
unused in Connections for Unused Pins ........................................................................................................153
• Updated Specifications and removed note saying specifications are preliminary.......................................... 156
• (Speed Grade Maximum Frequency): Updated/Changed LPDDR4 frequency for L and E speed grades from
"4266" and "3733" MT/s to "3733" and "3200" MT/s, respectively................................................................. 163
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TDA4VM-Q1, TDA4VM
ZHCSKP3J – FEBRUARY 2019 – REVISED AUGUST 2021
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