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OMAP3530 and OMAP3525 devices are based on the enhanced OMAP 3 architecture. The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following: • Streaming video • Video conferencing • High-resolution still image The device supports high-level operating systems (HLOSs), such as: • Linux® • Windows® CE • Android™
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OMAP3530, OMAP3525
www.ti.com
SPRS507H –FEBRUARY 2008–REVISED OCTOBER 2013
OMAP3530 and OMAP3525 Applications Processors
Check for Samples: OMAP3530, OMAP3525
1 OMAP3530 and OMAP3525 Applications Processors
1.1 Features
12
• Protected Mode Operation
• OMAP3530 and OMAP3525 Devices:
• Exceptions Support for Error Detection
– OMAP™ 3 Architecture
and Program Redirection
– MPU Subsystem
• Hardware Support for Modulo Loop
• Up to 720-MHz ARM® Cortex™-A8 Core
Operation
• NEON™ SIMD Coprocessor
• C64x+ L1 and L2 Memory Architecture
– High-Performance Image, Video, Audio
– 32KB of L1P Program RAM and Cache
(IVA2.2™) Accelerator Subsystem
(Direct Mapped)
• Up to 520-MHz TMS320C64x+™ DSP Core
– 80KB of L1D Data RAM and Cache (2-Way
• Enhanced Direct Memory Access (EDMA)
Set-Associative)
Controller (128 Independent Channels)
– 64KB of L2 Unified Mapped RAM and Cache
• Video Hardware Accelerators
(4-Way Set-Associative)
– PowerVR® SGX™ Graphics Accelerator
– 32KB of L2 Shared SRAM and 16KB of L2
(OMAP3530 Device Only)
ROM
• Tile-Based Architecture Delivering up to
• C64x+ Instruction Set Features
10 MPoly/sec
– Byte-Addressable (8-, 16-, 32-, and 64-Bit
• Universal Scalable Shader Engine: Multi-
Data)
threaded Engine Incorporating Pixel and
– 8-Bit Overflow Protection
Vertex Shader Functionality
– Bit Field Extract, Set, Clear
• Industry Standard API Support:
– Normalization, Saturation, Bit-Counting
OpenGLES 1.1 and 2.0, OpenVG1.0
– Compact 16-Bit Instructions
• Fine-Grained Task Switching, Load
Balancing, and Power Management – Additional Instructions to Support Complex
Multiplies
• Programmable High-Quality Image Anti-
Aliasing • ARM Cortex-A8 Core
– Fully Software-Compatible with C64x and – ARMv7 Architecture
ARM9™
• TrustZone®
– Commercial and Extended Temperature
• Thumb®-2
Grades
• MMU Enhancements
• Advanced Very-Long-Instruction-Word (VLIW)
– In-Order, Dual-Issue, Superscalar
TMS320C64x+ DSP Core
Microprocessor Core
– Eight Highly Independent Functional Units
– NEON Multimedia Architecture
• Six ALUs (32- and 40-Bit), Each Supports
– Over 2x Performance of ARMv6 SIMD
Single 32-Bit, Dual 16-Bit, or Quad 8-Bit
– Supports Both Integer and Floating-Point
Arithmetic per Clock Cycle
SIMD
• Two Multipliers Support Four 16 x 16-Bit
– Jazelle® RCT Execution Environment
Multiplies (32-Bit Results) per Clock
Architecture
Cycle or Eight 8 x 8-Bit Multiplies (16-Bit
– Dynamic Branch Prediction with Branch
Results) per Clock Cycle
Target Address Cache, Global History
– Load-Store Architecture with Nonaligned
Buffer, and 8-Entry Return Stack
Support
– Embedded Trace Macrocell (ETM) Support
– 64 32-Bit General-Purpose Registers
for Noninvasive Debug
– Instruction Packing Reduces Code Size
• ARM Cortex-A8 Memory Architecture:
– All Instructions Conditional
– 16-KB Instruction Cache (4-Way Set-
– Additional C64x+ Enhancements
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to
Copyright © 2008–2013, Texas Instruments Incorporated
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
OMAP3530, OMAP3525
SPRS507H –FEBRUARY 2008–REVISED OCTOBER 2013
www.ti.com
Associative) • Luma and Chroma Separate Video (S-
Video)
– 16-KB Data Cache (4-Way Set-Associative)
– Rotation 90-, 180-, and 270-Degrees
– 256-KB L2 Cache
– Resize Images From 1/4x to 8x
• 112KB of ROM
– Color Space Converter
• 64KB of Shared SRAM
– 8-Bit Alpha Blending
• Endianess:
• Serial Communication
– ARM Instructions – Little Endian
– 5 Multichannel Buffered Serial Ports
– ARM Data – Configurable
(McBSPs)
– DSP Instruction and Data - Little Endian
• 512-Byte Transmit and Receive Buffer
• External Memory Interfaces:
(McBSP1, McBSP3, McBSP4, and
– SDRAM Controller (SDRC)
McBSP5)
• 16- and 32-Bit Memory Controller with
• 5-KB Transmit and Receive Buffer
1GB of Total Address Space
(McBSP2)
• Interfaces to Low-Power Double Data
• SIDETONE Core Support (McBSP2 and
Rate (LPDDR) SDRAM
McBSP3 Only) For Filter, Gain, and Mix
• SDRAM Memory Scheduler (SMS) and
Operations
Rotation Engine
• Direct Interface to I2S and PCM Device
– General Purpose Memory Controller (GPMC)
and TDM Buses
• 16-Bit-Wide Multiplexed Address and
• 128-Channel Transmit and Receive Mode
Data Bus
– Four Master or Slave Multichannel Serial
• Up to 8 Chip-Select Pins with 128-MB
Port Interface (McSPI) Ports
Address Space per Chip-Select Pin
– High-, Full-, and Low-Speed USB OTG
• Glueless Interface to NOR Flash, NAND
Subsystem (12- and 8-Pin ULPI Interface)
Flash (with ECC Hamming Code
– High-, Full-, and Low-Speed Multiport USB
Calculation), SRAM, and Pseudo-SRAM
Host Subsystem
• Flexible Asynchronous Protocol Control
• 12- and 8-Pin ULPI Interface or 6-, 4-, and
for Interface to Custom Logic (FPGA,
3-Pin Serial Interface
CPLD, ASICs, and so forth)
• Supports Transceiverless Link Logic
• Nonmultiplexed Address and Data Mode
(TLL)
(Limited 2-KB Address Space)
– One HDQ™/1-Wire® Interface
• System Direct Memory Access (sDMA)
– Three UARTs (One with Infrared Data
Controller (32 Logical Channels with
Association [IrDA] and Consumer Infrared
Configurable Priority)
[CIR] Modes)
• Camera Image Signal Processor (ISP)
– Three Master and Slave High-Speed Inter-
– CCD and CMOS Imager Interface
Integrated Circuit (I
2
C) Controllers
– Memory Data Input
• Removable Media Interfaces:
– BT.601 (8-Bit) and BT.656 (10-Bit) Digital
– Three Multimedia Card (MMC)/Secure Digital
YCbCr 4:2:2 Interface
(SD) with Secure Data I/O (SDIO)
– Glueless Interface to Common Video
• Comprehensive Power, Reset, and Clock
Decoders
Management
– Resize Engine
– SmartReflex™ Technology
• Resize Images From 1/4x to 4x
– Dynamic Voltage and Frequency Scaling
• Separate Horizontal and Vertical Control
(DVFS)
• Display Subsystem
• Test Interfaces
– Parallel Digital Output
– IEEE 1149.1 (JTAG) Boundary-Scan
• Up to 24-Bit RGB
Compatible
• HD Maximum Resolution
– ETM Interface
• Supports Up to 2 LCD Panels
– Serial Data Transport Interface (SDTI)
• Support for Remote Frame Buffer
• 12 32-Bit General-Purpose Timers
Interface (RFBI) LCD Panels
• 2 32-Bit Watchdog Timers
– 2 10-Bit Digital-to-Analog Converters (DACs)
• 1 32-Bit 32-kHz Sync Timer
Supporting:
• Up to 188 General-Purpose I/O (GPIO) Pins
• Composite NTSC and PAL Video
(Multiplexed with Other Device Functions)
2 OMAP3530 and OMAP3525 Applications Processors Copyright © 2008–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: OMAP3530 OMAP3525
OMAP3530, OMAP3525
www.ti.com
SPRS507H –FEBRUARY 2008–REVISED OCTOBER 2013
• 65-nm CMOS Technologies .65-mm Ball Pitch (Top), .5-mm Ball Pitch
(Bottom)
• Package-On-Package (POP) Implementation for
Memory Stacking (Not Available in CUS – 423-pin s-PBGA Package (CUS Suffix),
Package) .65-mm Ball Pitch
• Discrete Memory Interface (Not Available in • 1.8-V I/O and 3.0-V (MMC1 Only),
CBC Package) 0.985-V to 1.35-V Adaptive Processor Core
Voltage
• Packages:
0.985-V to 1.35-V Adaptive Core Logic Voltage
– 515-pin s-PBGA Package (CBB Suffix),
Note: These are default Operating Performance
.5-mm Ball Pitch (Top), .4-mm Ball Pitch
Point (OPP) voltages and could be optimized to
(Bottom)
lower values using SmartReflex AVS.
– 515-pin s-PBGA Package (CBC Suffix),
1.2 Applications
• Portable Navigation Devices
• Portable Media Player
• Digital Video Camera
• Portable Data Collection
• Point-of-Sale Devices
• Gaming
• Web Tablet
• Smart White Goods
• Smart Home Controllers
Copyright © 2008–2013, Texas Instruments Incorporated OMAP3530 and OMAP3525 Applications Processors 3
Submit Documentation Feedback
Product Folder Links: OMAP3530 OMAP3525
OMAP3530, OMAP3525
SPRS507H –FEBRUARY 2008–REVISED OCTOBER 2013
www.ti.com
1.3 Description
OMAP3530 and OMAP3525 devices are based on the enhanced OMAP 3 architecture.
The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing
sufficient to support the following:
• Streaming video
• Video conferencing
• High-resolution still image
The device supports high-level operating systems (HLOSs), such as:
• Linux®
• Windows® CE
• Android™
This OMAP device includes state-of-the-art power-management techniques required for high-performance
mobile products.
The following subsystems are part of the device:
• Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
• IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core
• PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3530 device only)
• Camera image signal processor (ISP) that supports multiple formats and interfacing options connected
to a wide variety of image sensors
• Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a
programmable interface supporting a wide variety of displays. The display subsystem also supports
NTSC and PAL video out.
• Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple
initiators to the internal and external memory controllers and to on-chip peripherals
The device also offers:
• A comprehensive power- and clock-management scheme that enables high-performance, low-power
operation, and ultralow-power standby features. The device also supports SmartReflex adaptative
voltage control. This power-management technique for automatic control of the operating voltage of a
module reduces the active power consumption.
• Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC
packages only)
OMAP3530 and OMAP3525 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-
PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and
CBC packages are not available in the CUS package. (See Table 1-1 for package differences).
This data manual presents the electrical and mechanical specifications for the OMAP3530 and
OMAP3525 applications processors. The information in this data manual applies to both the commercial
and extended temperature versions of the OMAP3530 and OMAP3525 applications processors unless
otherwise indicated. This data manual consists of the following sections:
• Section 2, Terminal Description: assignment, electrical characteristics, multiplexing, and functional
description
• Section 3, Electrical Characteristics: power domains, operating conditions, power consumption, and
DC characteristics
• Section 4, Clock Specifications: input and output clocks, DPLL and DLL
• Section 5, Video DAC Specifications
• Section 6, Timing Requirements and Switching Characteristics
• Section 7, Package Characteristics: thermal characteristics, device nomenclature, and mechanical data
for available packaging
4 OMAP3530 and OMAP3525 Applications Processors Copyright © 2008–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: OMAP3530 OMAP3525
IVA 2.2Subsystem
TMS320DM64x+DSP
ImagingVideoand
AudioProcessor
32K/32KL1$
48KL1DRAM
64KL2$
32KL2RAM
16KL2ROM
VideoHardware
Accelerators
64
32
Async
64
32
64
64
Async
64
64
L2$
256K
MPU
Subsystem
ARMCortex-
A8
TM
Core
16K/16KL1$
POWERVR
SGX
Graphics
Accelerator
(3530only)
TM
32
32
32
Channel
System
DMA
3232
Parallel
TV
Amp
LCDPanel
CVBS
or
S-Video
DualOutput3-Layer
DisplayProcessor
(1xGraphics,2xVideo)
TemporalDithering
SDTV → QCIFSupport
32
Camera
ISP
Image
Capture
Hardware
Image
Pipeline
and
Preview
Camera
(Parallel)
64
HSUSB
Host
(with
USB
TTL)
HS
USB
OTG
32
L3InterconnectNetwork-Hierarchial,Performance,andPowerDriven
64K
On-Chip
RAM
2KB
Public/
62KB
Secure
32
112K
On-Chip
ROM
80KB
Secure/
32KB
BOOT
32
SMS:
SDRAM
Memory
Scheduler/
Rotation
64
SDRC:
SDRAM
Memory
Controller
L4Interconnect
32
System
Controls
PRCM
2xSmartReflex
TM
Control
Module
External
Peripherals
Interfaces
Peripherals:
3xUART,3xHigh-SpeedI2C,
5xMcBSP
(2xwithSidetone/AudioBuffer)
4xMcSPI,6xGPIO,
3xHigh-SpeedMMC/SDIO,
HDQ/1Wire,
2xMailboxes
12xGPTimers,2xWDT,
32KSyncTimer
GPMC:
General
Purpose
Memory
Controller
NAND/
NOR
Flash,
SRAM
32
Emulation
Debug:SDTI,ETM,JTAG,
Coresight
TM
DAP
Externaland
StackedMemories
32
OMAP ApplicationsProcessor
OMAP3530, OMAP3525
www.ti.com
SPRS507H –FEBRUARY 2008–REVISED OCTOBER 2013
1.4 Functional Block Diagram
Figure 1-1 shows the functional block diagram of the OMAP3530 and OMAP3525 applications processors.
Figure 1-1. OMAP3530 and OMAP3525 Device Functional Block Diagram
Copyright © 2008–2013, Texas Instruments Incorporated OMAP3530 and OMAP3525 Applications Processors 5
Submit Documentation Feedback
Product Folder Links: OMAP3530 OMAP3525
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