SUNDAY through THURSDAY / FEBRUARY 18, 19, 20, 21, and 22, 2024
2022 IEEE INTERNATIONAL
IEEE SOLID-STATE CIRCUITS SOCIETY
SOLID-STATE CIRCUITS CONFERENCE
2024
DIGEST
OF
TECHNICAL
PAPERS
VOLUME SIXTY-SEVEN
Online ISSN 0193-6530
2024 IEEE INTERNATIONAL
SOLID-STATE CIRCUITS CONFERENCE
DIGEST OF TECHNICAL PAPERS
First Edition
February 2024
IEEE Catalog Number CFP24ISS-ART
DIGEST OF TECHNICAL PAPERS • 1
2024 IEEE International Solid-State Circuits Conference
DIGEST OF TECHNICAL PAPERS
Copyright and Reprint Permission:
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LAYOUT IN THE UNITED STATES OF AMERICA
by S
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iPublishing, Inc.
Lisbon Falls, Maine
VOLUME 67
IEEE Cat. No. CFP24ISS-ART
ISBN 978-1-6654-2800-2
Library of Congress Number 81-644810
Online ISSN 2376-8606
Publisher and Managing Editor: Laura C. Fujino
Technical Editors: Jason H. Anderson, Leonid Belostotski, Dustin Dunwell, Vincent Gaudet,
Glenn Gulak, James W. Haslett, David Halupka, Shahriar Mirabbasi
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• 2024 IEEE International Solid-State Circuits Conference
979-8-3503-0620-0/24/$31.00 ©2024 IEEE
3 DIGEST OF TECHNICAL PAPERS •
REFLECTIONS....................................................................................4
FOREWORD.......................................................................................5
AWARDS..........................................................................................21
PAPER SESSIONS
1 Plenary.........................................................................................8
2 Processors and Communication SoCs......................................34
3 Analog Techniques.....................................................................52
4 High Performance Transceivers and Transmitters for................74
Communication and Ranging
5 Wireless RF and mm-Wave Receiver Techniques......................86
6 Imagers and Ultrasound.............................................................98
7 Ultra-High-Speed Wireline........................................................122
8 Hybrid DC-DC Converters........................................................142
9 Noise-Shaping and SAR ADCs..................................................166
10 Frequency Synthesis................................................................186
11 Industry Invited.......................................................................206
12 Electromagnetic Interface ICs for Information and Power........216
13 High-Density Memory and Interfaces.......................................230
14 Digital Techniques for System Adaptation,...............................252
Power Management and Clocking
15 Embedded Memories & Ising Computing................................274
16 Security: From Processors to Circuits......................................294
17 Emerging Sensing and Computing Technologies.....................312
18 High-Performance Optical Transceivers...................................336
19 RF to mm-Wave Oscillators and Multipliers..............................346
20 Machine Learning Accelerators................................................358
21 Audio Amplifiers.......................................................................376
22 High-Speed Analog-to-Digital Converters.................................386
23 Energy-Efficient Connectivity Radios........................................398
24 D-Band/Sub-THz Transmitters and Sensors.............................410
25 Invited: Innovations from Outside the (ISSCC’s) Box...............420
26 Display and User Interaction Technologies............................430
27 Wireless Power.........................................................................442
28 High-Density Power Management............................................454
29 ICs for Quantum Technologies.................................................468
30 Domain-Specific Computing and Digital Accelerators..............480
31 Power Converter Techniques....................................................494
32 Power Amplification and Signal Generation..............................518
33 Intelligent Neural Interfaces and Sensing Systems..................540
34 Compute-In-Memory................................................................564
TUTORIALS
TUTORIALS 1-10...............................................................................584
FORUMS
F1 Efficient Chiplets and.............................................................589
Die-to-Die Communications
F2 Energy-Efficient AI-Computing Systems................................593
for Large-Language Models
F3 Digitally Enhanced Analog Circuits........................................597
Trends & State-of-the-Art Designs
F4 Intelligent Sensing.................................................................601
F5 Recent Developments in High-Performance Frequency.........605
Synthesis Circuits and Systems
F6 Toward Next Generation of Highly Integrated Electrical.........609
and Optical Transceivers
SPECIAL EVENTS
EE1 Student Research Preview: ...................................................613
Short Presentations with Poster Session
EE2 Career Trajectories: Sharing Our Paths to Success................618
EE3 Mixed-Foundry Chiplets? Opportunities and Challenges........624
EE4 Generative AI for Chip Design................................................627
EE5 The Legacy of Gordon Moore................................................630
SHORT COURSE
SC Machine Learning Hardware:.....................................................632
Considerations and Accelerator Approaches
INDEX TO AUTHORS......................................................................634
EXECUTIVE COMMITTEE.................................................................642
INTERNATIONAL TECHNICAL PROGRAM COMMITTEE..................643
ITPC EUROPEAN SUBCOMMITTEE.................................................647
ITPC FAR EAST SUBCOMMITTEE...................................................648
ITPC NORTH AMERICAN SUBCOMMITTEE.......................................649
2025 CALL FOR PAPERS...............................................................650
CONFERENCE TIMETABLE..............................................................651
CONFERENCE SPACE LAYOUT..........................................................652
Well, it has been yet another year living with uncertainty! As was done the past two years, with everyone pulling together,
we again had our paper-selection process on-line, as scheduled, and what you see in front of you, is the result of decades
of continuous iterative refinement of the submission process and information processing. What has become the norm, we
are providing the e-Digest which will include all 3 pages for each paper, and will continue to be included in the Digest
download and in IEEE Xplore.
Once more, this year, we have a technical editorial group (listed below) under the direction of a managing editor (Laura
Chizuko Fujino). Again, we emphasize full technical and language editing of most papers, as the need dictates.
In recognition of the huge amount of work (20% more papers than previous years) leading to the Digest open before you,
I wish to acknowledge a great many individuals: Frank O’Mahony, Tom Burd, Eugenio Cantatore, Anantha Chandrakasan,
the 12 Subcommittee Chairs, members of the ITPC, and all of the authors, for their individual contributions; Brad Phillips,
and MiraSMART Conferencing, for Web-based and other preparatory support, including continuing improvement and
facilitation of the paper-review and pre-voting process in a continuing double-blind world, as well as preparation and
implementation of the Conference platform; Stephen Bonney, and S
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iPublishing, for author and Session-Chair interaction,
for figure layout, for paper formatting, and for general assistance; Melissa Widerkehr, for general interfacing, problem-
solving, and coordination; Jason Anderson (University of Toronto), Leo Belostotski (University of Calgary), Dustin Dunwell
(Alphawave), Vincent Gaudet (University of Waterloo), Glenn Gulak (University of Toronto), David Halupka (StarIC), James
Haslett (University of Calgary), and Shahriar Mirabbasi (University of British Columbia), as the technical editors for their
heroic effort on the traditional very challenging schedule. My sincere thanks to you all!
As many of you are know, I suffered a great personal loss at the end of October. My beloved husband and partner-in-life,
Kenneth (KC) Smith
1
passed away quiety in his sleep at home at the age of 91. Ken enjoyed a rich full life full of laughter
and joy! I know he will always be with me and many others he touched in spirit with his legacy and wisdom forever engraved
in our hearts! As I have been preparing this year’s Digest, I can hear him say do not forget the comma, add a hyphen there,
and so on.
A little background on KC’s 5 decade history with ISSCC:
1974 – 1976 member of the Program Committee
1976 – 2024 Awards & Recognition Committee Chair (ARC)
1993 – 1994 Emerging Technologies Subcommittee (precursor to TD)
1994 – 1996 Technology Directions
1995 – 2024 ARC Chair/Press Relations
Be well, and stay safe!
Laura Chizuko Fujino
ISSCC Director of Publications and Presentations
February 2024
Reflections
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• 2024 IEEE International Solid-State Circuits Conference
979-8-3503-0620-0/24/$31.00 ©2024 IEEE
ISSCC 2024 Program Assembly Meeting
1. See IEEE SSCS Magazine, 2024 Winter Edition, pages 71, 80
