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ISSCC 2023 Digest
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2023-03-16
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ISSCC 2023 Digest
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SUNDAY through THURSDAY / FEBRUARY 19, 20, 21, 22 and 23, 2023
2023 IEEE INTERNATIONAL
IEEE SOLID-STATE CIRCUITS SOCIETY
SOLID-STATE CIRCUITS CONFERENCE
2023
DIGEST
OF
TECHNICAL
PAPERS
VOLUME SIXTY-SIX
Online ISSN 2376-8606
2023 IEEE INTERNATIONAL
SOLID-STATE CIRCUITS CONFERENCE
DIGEST OF TECHNICAL PAPERS
First Edition
February 2023
IEEE Catalog Number CFP23ISS-ART
DIGEST OF TECHNICAL PAPERS • 1
2023 IEEE International Solid-State Circuits Conference
DIGEST OF TECHNICAL PAPERS
Copyright and Reprint Permission:
Abstracting is permitted with credit to the source. Libraries are permitted to photocopy beyond
the limit of U.S. copyright law for private use of patrons those articles in this volume that carry
a code at the bottom of the first page, provided the per-copy fee indicated in the code is paid
through Copyright Clearance Center, 222 Rosewood Drive, Danvers, MA 01923. For reprint or
republication permission, email to IEEE Copyrights Manager at pubs-permissions@ieee.org. All
rights reserved. Copyright ©2023 by IEEE.
LAYOUT IN THE UNITED STATES OF AMERICA
by S
3
iPublishing, Inc.
Lisbon Falls, Maine
VOLUME 66
IEEE Cat. No. CFP23ISS-ART
ISBN 978-1-6654-2800-2
Library of Congress Number 81-644810
Online ISSN 2376-8606
Publisher and Managing Editor: Laura C. Fujino
Technical Editors: Jason H. Anderson, Leonid Belostotski, Dustin Dunwell, Vincent Gaudet,
Glenn Gulak, James W. Haslett, David Halupka, Shahriar Mirabbasi, Kenneth C. Smith
2
• 2023 IEEE International Solid-State Circuits Conference 978-1-6654-9016-0/23/$31.00 ©2023 IEEE
REFLECTIONS....................................................................................4
FOREWORD.......................................................................................5
AWARDS..........................................................................................23
PAPER SESSIONS
1 Plenary....................................................................................6
2 Digital Processors...................................................................36
3 Amplifiers and Oscillators.......................................................52
4 Frequency Synthesizers...........................................................72
5 Image Sensors........................................................................88
6 Advanced Wireline Links and Techniques..............................106
7 SRAM Compute-In-Memory..................................................124
8 GHz-to-Millimeter Wave Frequency Generation.....................144
9 Highlighted Chip Releases:....................................................154
Digital and Machine Learning Processors
10 Pipelined and Noise-Shaping ADCs........................................164
11 USB and Compute Power Delivery.........................................180
12 High Performance Optical Receivers......................................202
13 Ideas for the Future................................................................210
14 Digital Techniques for Clocking and Power Management......224
15 IOT & Security.......................................................................234
16 Efficient Compute-In-Memory Based Processors for ML.......246
17 High-Speed Data Converters.................................................262
18 mm-Wave & sub-THz for Wireless and Sensing....................280
19 5G and Satcom: Receivers and Transmitters..........................290
20 GaN Power Conversion..........................................................300
21 Emerging Sensing Systems and IOT......................................310
22 Heterogenous ML Accelerators...............................................324
23 Analog Sensor Interfaces.......................................................344
24 THz Signal Generation..............................................................360
25 RF Transceiver Building Blocks...............................................368
26 Display and User Interaction Technologies............................380
27 Innovations from Outside the (ISSCC) Box............................388
28 High-Density Memories and High-Speed Interface...................398
29 Digital Accelerators and Circuit Techniques............................416
30 Power Management Techniques...............................................436
31 Energy-Efficient Radios for UWB, BMI, and IoT Systems.........458
32 Intelligent Biomedical Circuits and Systems..........................476
33 Non-Volatile Memory and Compute-In-Memory....................492
34 Cryo-CMOS for Quantum Computing.......................................502
TUTORIALS
TUTORIALS 1-12........................................................514
FORUMS
F1 Transceivers for Exascale:.....................................................519
Towards Tbps/mm and sub-pJ/bit
F2 The Power Behind Electrical Vehicles –.................................522
Accelerating the Future of Automotive Technology
F3 Efficient Wireless Power Amplification and Linearization......525
F4 Advancing Technologies for Extended Reality (XR)...............528
to Make the “Metaverse” Possible
F5 Extreme Data Converters and Their Peripherals.....................531
F6 The Future of Heterogeneous Multi-Core...............................534
Architectures for AI and Other Specialized Processing
F7 Advanced Circuits and Technologies.....................................537
for Wearable and Implantable Devices
SPECIAL EVENTS
EE1 Student Research Preview: ...................................................540
Short Presentations with Poster Session
EE2 Integrated Circuits in an Interconnected World......................545
EE3 The Path to Sustainable IC Ecosystems.................................547
EE4 The Smartest Designer in The Universe, Post-Pandemic!......550
EE5 What will be the Essential Skills for IC Designers...................553
in the Next Decade?
SHORT COURSE
SC Principles of Quantum Computing and the Application............556
of Cryoelectronics to Qubit Control and Readout
INDEX TO AUTHORS.....................................................................558
EXECUTIVE COMMITTEE...............................................................564
INTERNATIONAL TECHNICAL PROGRAM COMMITTEE.................565
ITPC EUROPEAN SUBCOMMITTEE................................................569
ITPC FAR EAST SUBCOMMITTEE..................................................570
2024 CALL FOR PAPERS..............................................................571
CONFERENCE TIMETABLE.............................................................572
CONFERENCE SPACE LAYOUT.........................................................573
3 DIGEST OF TECHNICAL PAPERS •
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