IBIS
(I/O Buffer Information Specification)
Version 5.0
Ratified August 29, 2008
page 2 IBIS Version 5.0
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| I/O Buffer Information Specification (IBIS) Version 5.0 (August 29, 2008)
|
| IBIS is a standard for electronic behavioral specifications of integrated
| circuit input/output analog characteristics.
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| Copyright (c) IBIS Open Forum 2008
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| T A B L E O F C O N T E N T S
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| Section 1 .... GENERAL INTRODUCTION
| Section 2 .... STATEMENT OF INTENT
| Section 3 .... GENERAL SYNTAX RULES AND GUIDELINES
| Section 3a ... KEYWORD HIERARCHY
| Section 4 .... FILE HEADER INFORMATION
| Section 5 .... COMPONENT DESCRIPTION
| Section 6 .... MODEL STATEMENT
| Section 6a ... ADD SUBMODEL DESCRIPTION
| Section 6b ... MULTI-LINGUAL MODEL EXTENSIONS
| Section 6c ... ALGORITHMIC MODELING INTERFACE (AMI)
| Section 7 .... PACKAGE MODELING
| Section 8 .... ELECTRICAL BOARD DESCRIPTION
| Section 9 .... NOTES ON DATA DERIVATION METHOD
| Section 10 ... NOTES ON ALGORITHMIC MODELING INTERFACE AND PROGRAMMING GUIDE
| Section 11 ... EMI PARAMETERS
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Section 1 GENERAL INTRODUCTION .................................................................................. 8
Section 2 STATEMENT OF INTENT ...................................................................................... 9
Section 3 GENERAL SYNTAX RULES AND GUIDELINES ............................................. 11
Section 3a KEYWORD HIERARCHY ..................................................................................... 13
Section 4 FILE HEADER INFORMATION .......................................................................... 19
[IBIS Ver] ..................................................................................................................................... 19
[Comment Char] ........................................................................................................................... 19
[File Name]................................................................................................................................... 19
[File Rev]...................................................................................................................................... 20
[Date],
[Source],
[Notes],
[Disclaimer],
[Copyright].................................................................................................................................... 20
Section 5 COMPONENT DESCRIPTION ............................................................................. 21
[Component]................................................................................................................................. 21
[Manufacturer].............................................................................................................................. 21
[Package] ...................................................................................................................................... 21
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[Pin] .............................................................................................................................................. 22
[Package Model]........................................................................................................................... 23
[Alternate Package Models],
[End Alternate Package Models].................................................................................................. 23
[Pin Mapping]............................................................................................................................... 24
[Diff Pin]....................................................................................................................................... 27
[Series Pin Mapping] .................................................................................................................... 28
[Series Switch Groups]................................................................................................................. 30
[Model Selector] ........................................................................................................................... 31
Section 6 MODEL STATEMENT ........................................................................................... 33
[Model] ......................................................................................................................................... 33
[Model Spec]................................................................................................................................. 37
[Receiver Thresholds]................................................................................................................... 44
[Add Submodel]............................................................................................................................ 47
[Driver Schedule].......................................................................................................................... 48
[Temperature Range].................................................................................................................... 52
[Voltage Range]............................................................................................................................ 52
[Pullup Reference]........................................................................................................................ 53
[Pulldown Reference] ................................................................................................................... 53
[POWER Clamp Reference]......................................................................................................... 53
[GND Clamp Reference] .............................................................................................................. 53
[External Reference]..................................................................................................................... 54
[TTgnd],
[TTpower]..................................................................................................................................... 54
[Pulldown],
[Pullup],
[GND Clamp],
[POWER Clamp].......................................................................................................................... 55
[ISSO PD],
[ISSO PU]..................................................................................................................................... 58
[Rgnd],
[Rpower],
[Rac],
[Cac].............................................................................................................................................. 63
[On],
[Off] .............................................................................................................................................. 65
[R Series],
[L Series],
[Rl Series],
[C Series],
[Lc Series],
[Rc Series]..................................................................................................................................... 65
[Series Current]............................................................................................................................. 66
[Series MOSFET] ......................................................................................................................... 67
[Ramp] .......................................................................................................................................... 70
[Rising Waveform],
page 4 IBIS Version 5.0
[Falling Waveform] ...................................................................................................................... 71
[Composite Current] ..................................................................................................................... 74
[Test Data] .................................................................................................................................... 79
[Rising Waveform Near],
[Falling Waveform Near],
[Rising Waveform Far],
[Falling Waveform Far],
[Diff Rising Waveform Near],
[Diff Falling Waveform Near],
[Diff Rising Waveform Far],
[Diff Falling Waveform Far] ........................................................................................................ 79
[Test Load].................................................................................................................................... 81
Section 6a ADD SUBMODEL DESCRIPTION ....................................................................... 83
[Submodel].................................................................................................................................... 84
[Submodel Spec]........................................................................................................................... 85
[GND Pulse Table],
[POWER Pulse Table].................................................................................................................. 86
Section 6b MULTI-LINGUAL MODEL EXTENSIONS ........................................................ 98
[External Model],
[End External Model] ................................................................................................................. 105
[External Circuit],
[End External Circuit]................................................................................................................. 125
[Node Declarations],
[End Node Declarations] ............................................................................................................ 132
[Circuit Call],
[End Circuit Call]........................................................................................................................ 133
Section 6c ALGORITHMIC MODELING INTERFACE (AMI)......................................... 139
INTRODUCTION ...................................................................................................................... 139
GENERAL ASSUMPTIONS..................................................................................................... 139
DEFINITIONS............................................................................................................................ 140
Notes........................................................................................................................................... 141
[Algorithmic Model],
[End Algorithmic Model] ........................................................................................................... 142
Section 7 PACKAGE MODELING ....................................................................................... 151
[Define Package Model]............................................................................................................. 152
[Manufacturer]............................................................................................................................ 152
[OEM]......................................................................................................................................... 152
[Description]............................................................................................................................... 153
[Number Of Sections]................................................................................................................. 153
[Number Of Pins]........................................................................................................................ 153
[Pin Numbers]............................................................................................................................. 153
[Model Data]............................................................................................................................... 156
[End Model Data] ....................................................................................................................... 156
[Resistance Matrix],
[Inductance Matrix],
[Capacitance Matrix] .................................................................................................................. 156
IBIS Version 5.0 page 5