S3C2451USER'SMANUAL资源-CSDN文库

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### S3C2451 用户手册知识点概览 #### 一、S3C2451 微处理器概述 **S3C2451**是一款由三星电子设计生产的16/32位RISC（精简指令集计算）微处理器。这款微处理器主要应用于嵌入式系统领域，以其高性能、低功耗的特点而受到市场的广泛欢迎。S3C2451的设计融合了多项先进技术，旨在为用户提供高效稳定的解决方案。 #### 二、重要通知与法律声明在用户手册开头部分明确指出了关于使用S3C2451的重要通知及法律声明，这些内容对于确保用户正确理解和使用该微处理器至关重要： 1. **准确性声明**：三星认为所提供的所有信息均经过仔细校对，并在发布时被认为是准确无误的。 2. **责任免责声明**：尽管三星尽力确保信息的准确性，但并不承担任何因使用这些信息而可能产生的错误或遗漏的责任。 3. **产品改进声明**：三星保留随时对其产品及其规格进行更改的权利，以改善其功能或设计，无需事先通知。 4. **专利权声明**：本出版物不授予购买者使用在此描述的半导体器件的任何专利权利。 5. **适用性声明**：三星不对产品适用于任何特定用途做出任何保证或陈述，并明确否认因产品的应用或使用而可能产生的任何责任。 6. **生命支持应用声明**：特别强调S3C2451并未设计用于手术植入人体或其他支持或维持生命的系统中。如果用户将S3C2451用于此类未经设计或授权的应用场景，买方需承担因此可能导致的所有损失和责任。 #### 三、技术特性与应用场景 1. **高性能与低功耗**：S3C2451采用了先进的制造工艺，能够在提供强大处理能力的同时保持较低的能耗，非常适合于移动设备和物联网(IoT)等注重能效的应用场景。 2. **多核架构**：虽然手册中没有详细描述S3C2451的具体核心配置，但通常这类处理器会采用多核架构，以提高并行处理能力和整体性能。 3. **丰富的外设接口**：S3C2451配备了多种类型的接口，如USB、SPI、I2C等，支持与各种外围设备进行通信，增强了其在嵌入式系统的应用灵活性。 4. **内存管理单元(MMU)**：内置MMU可以实现虚拟内存管理和地址转换，有助于提高程序运行效率和安全性。 5. **中断控制器**：集成的中断控制器能够有效管理来自不同来源的中断请求，确保系统的实时响应能力。 6. **电源管理**：支持多种电源管理模式，包括休眠模式、待机模式等，以适应不同工作条件下的功耗需求。 #### 四、使用注意事项与维护建议 - 在安装和使用S3C2451前，应仔细阅读用户手册中的安全指南和技术规范，确保正确的安装和使用方式。 - 对于特定的应用场景，用户应根据实际情况调整处理器的工作参数，以达到最佳性能表现。 - 定期检查硬件连接和软件配置，及时更新固件版本，确保系统的稳定性和安全性。 - 在遇到问题时，应首先参考用户手册中的故障排除指南，若问题仍未解决，则应及时联系三星技术支持部门寻求帮助。 S3C2451作为一款高性能的16/32位RISC微处理器，在嵌入式系统开发中扮演着重要角色。通过深入了解其技术特性和应用场景，结合合理的使用维护策略，可以充分发挥其优势，为用户提供可靠高效的解决方案。

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USER'S MANUAL

S3C2451

16/32-Bit RISC Microprocessor

March 2009

REV 1.10

Confidential Proprietary of Samsung Electronics Co., Ltd

Important Notice

The information in this publication has been carefully

checked and is believed to be entirely accurate at

the time of publication. Samsung assumes no

responsibility, however, for possible errors or

omissions, or for any consequences resulting from

the use of the information contained herein.

Samsung reserves the right to make changes in its

products or product specifications with the intent to

improve function or design at any time and without

notice and is not required to update this

documentation to reflect such changes.

This publication does not convey to a purchaser of

semiconductor devices described herein any license

under the patent rights of Samsung or others.

Samsung makes no warranty, representation, or

guarantee regarding the suitability of its products for

any particular purpose, nor does Samsung assume

any liability arising out of the application or use of

any product or circuit and specifically disclaims any

and all liability, including without limitation any

consequential or incidental damages.

"Typical" parameters can and do vary in different

applications. All operating parameters, including

"Typicals" must be validated for each customer

application by the customer's technical experts.

Samsung products are not designed, intended, or

authorized for use as components in systems

intended for surgical implant into the body, for other

applications intended to support or sustain life, or for

any other application in which the failure of the

Samsung product could create a situation where

personal injury or death may occur.

Should the Buyer purchase or use a Samsung

product for any such unintended or unauthorized

application, the Buyer shall indemnify and hold

Samsung and its officers, employees, subsidiaries,

affiliates, and distributors harmless against all

claims, costs, damages, expenses, and reasonable

attorney fees arising out of, either directly or

indirectly, any claim of personal injury or death that

may be associated with such unintended or

unauthorized use, even if such claim alleges that

Samsung was negligent regarding the design or

manufacture of said product.

S3C2451 16/32-Bit RISC Microprocessor

User's Manual, Revision 1.10

Publication Number: 21.10-S3-C2450- 082008

any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior

written consent of Samsung Electronics.

Samsung Electronics' microcontroller business has been awarded full ISO-14001

certification (BSI Certificate No. FM24653). All semiconductor products are

designed and manufactured in accordance with the highest quality standards and

objectives.

Samsung Electronics Co., Ltd.

San #24 Nongseo-Dong, Giheung-Gu

Yongin-City, Gyeonggi-Do, Korea

C.P.O. Box #37, Suwon 446-711

TEL: (82)-(31)-209-4593

FAX: (82)-(31)-209-5324

Home Page: http://www.samsungsemi.com

Printed in the Republic of Korea

E-Mail: mobilesol.cs@samsung.com

S3C2451X RISC MICROPROCESSOR i

Table of Contents

Chapter 1 Product Overview

1 Introduction ...............................................................................................................................................1-1

2 Features....................................................................................................................................................1-2

3 Block Diagram...........................................................................................................................................1-5

4 Pin Assignments .......................................................................................................................................1-6

4.1 Signal Descriptions..........................................................................................................................1-24

4.2 S3C2451 Operation Mode Description ...........................................................................................1-31

4.3 S3C2451 Memory MAP and Base Address of Special Registers...................................................1-32

Chapter 2 System Controller

1 Overview ...................................................................................................................................................2-1

2 Feature......................................................................................................................................................2-1

3 Block Diagram...........................................................................................................................................2-2

4 Functional Descriptions.............................................................................................................................2-3

4.1 Reset Management and Types .......................................................................................................2-3

4.2 Hardware Reset...............................................................................................................................2-3

4.3 Watchdog Reset..............................................................................................................................2-4

4.4 Software Reset ................................................................................................................................2-5

4.5 Wakeup Reset.................................................................................................................................2-5

5 Clock Management...................................................................................................................................2-6

5.1 Clock Generation Overview.............................................................................................................2-6

5.2 Clock Source Selection ...................................................................................................................2-6

5.3 PLL (Phase-Locked-Loop) .............................................................................................................. 2-8

5.4 Change PLL Settings In Normal Operation.....................................................................................2-8

5.5 System Clock Control......................................................................................................................2-9

5.6 ARM & BUS Clock Divide Ratio ......................................................................................................2-10

5.7 Examples for configuring clock regiter to produce specific frequency of AMBA clocks..................2-11

5.8 ESYSCLK Control ...........................................................................................................................2-12

6 Power Management..................................................................................................................................2-13

6.1 Power Mode State Diagram ............................................................................................................2-13

6.2 Power Saving Modes.......................................................................................................................2-14

6.3 Wake-Up Event

...............................................................................................................................2-19

6.4 Output Port State and STOP and SLEEP Mode .............................................................................2-19

6.5 Power Saving Mode Entering/Exiting Condition..............................................................................2-20

7 Register Descriptions................................................................................................................................2-21

7.1 Address Map ...................................................................................................................................2-21

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