USB Power Delivery Specification Revision 1.0 Page 1
Universal Serial Bus
Power Delivery Specification
Revision 1.0
Including Errata through 26-June-201311-March-2014 (Version 1.23)
Page 2 USB Power Delivery Specification Revision 1.0
Editor
Bob Dunstan
Intel Corporation
Richard Petrie
DisplayLink
Contributors
Bruce Montag
Dell Inc.
Gary Verdun
Dell, Inc.
Dan Ellis
DisplayLink
Richard Petrie
DisplayLink
PD Chair/Device Policy Lead
AJ Yang
Foxconn / Hon Hai
Steve Sedio
Foxconn / Hon Hai
Terry Little
Foxconn / Hon Hai
Alan Berkema
Hewlett Packard
Lee Atkinson
Hewlett Packard
Rahul Lakdawala
Hewlett Packard
Ron Schooley
Hewlett Packard
Vaibhav Malik
Hewlett Packard
Walter Fry
Hewlett Packard
Bob Dunstan
Intel Corporation
PD Chair/Protocol WG Lead
Brad Saunders
Intel Corporation
Dan Froelich
Intel Corporation
David Harriman
Intel Corporation
Harry Skinner
Intel Corporation
Jervis Lin
Intel Corporation
John Howard
Intel Corporation
Leo Heiland
Intel Corporation
Maarit Harkonen
Intel Corporation
Paul Durley
Intel Corporation
USB Power Delivery Specification Revision 1.0 Page 3
Rahman Ismail
Intel Corporation
System Policy Lead
Sarah Sharp
Intel Corporation
Scott Brenden
Intel Corporation
Sridharan
Ranganathan
Intel Corporation
Steve McGowan
Intel Corporation
Tim McKee
Intel Corporation
PD Chair/Compliance Lead
Toby Opferman
Intel Corporation
Kenta Minejima
Japan Aviation Electronics Industry Ltd. (JAE)
Mark Saubert
Japan Aviation Electronics Industry Ltd. (JAE)
Toshio Shimoyama
Japan Aviation Electronics Industry Ltd. (JAE)
Daniel H Jacobs
LeCroy Corporation
Mike
MichelettMicheletti
LeCroy Corporation
Roy Chestnut
LeCroy Corporation
Dave Thompson
LSI Corporation
Geert Knapen
MCCI Corporation
Chris Yokum
MCCI Corporation
Marwan Kadado
Microsoft Corporation
Randy Aull
Microsoft Corporation
Yang You
Microsoft Corporation
Pat Crowe
MQP Electronics Ltd.
Sten Carlsen
MQP Electronics Ltd.
Frank Borngräber
Nokia Corporation
Pekka Leinonen
Nokia Corporation
Richard Petrie
Nokia Corporation
PD Vice-Chair/Device Policy Lead
Sten Carlsen
Nokia Corporation
Physical Layer WG Lead
Bart Vertenten
NXP Semiconductors
Page 4 USB Power Delivery Specification Revision 1.0
Robert de Nie
NXP Semiconductors
Robert Heaton
Obsidian Technology
Cor Voorwinden
ON Semiconductor
Edward Berrios
ON Semiconductor
Power Supply WG Lead
Tom Duffy
ON Semiconductor
Narendra Mehta
Qualcomm, Inc.
Terry Remple
Qualcomm, Inc.
Yoram Rimoni
Qualcomm, Inc.
Atsushi Mitamura
Renesas Electronics Corp.
Kiichi Muto
Renesas Electronics Corp.
Masami Katagiri
Renesas Electronics Corp.
Patrick Yu
Renesas Electronics Corp.
Peter Teng
Renesas Electronics Corp.
Steve Roux
Renesas Electronics Corp.
Tetsu Sato
Renesas Electronics Corp.
Akihiro Ono
Rohm Co., Ltd.
Chris Lin
Rohm Co., Ltd.
Manabu Miyata
Rohm Co., Ltd.
Vijendra Kuroodi
Rohm Co., Ltd.
Alvin Cox
Seagate Technology LLC
Cab Con WG Lead
John Hein
Seagate Technology LLC
Marc Noblitt
Seagate Technology LLC
Ronald Rueckert
Seagate Technology LLC
Tony Priborsky
Seagate Technology LLC
John Sisto
SMSC
Ken Gay
SMSC
Mark Bohm
SMSC
USB Power Delivery Specification Revision 1.0 Page 5
Richard Wahler
SMSC
Shannon Cash
SMSC
Tim Knowlton
SMSC
William Chiechi
SMSC
Fabien FRIESS
ST-Ericsson
Giuseppe Platania
ST-Ericsson
Jean-Francois Gatto
ST-Ericsson
Milan Stamenkovic
ST-Ericsson
Nicolas Florenchie
ST-Ericsson
Patrizia Milazzo
ST-Ericsson
Pascal Legrand
ST-Microelectronics
Anand Dabak
Texas Instruments
Deric Waters
Texas Instruments
Physical Layer WG Lead
Grant Ley
Texas Instruments
Ingolf Frank
Texas Instruments
Ivo Huber
Texas Instruments
Javad Ahmad
Texas Instruments
Jean Picard
Texas Instruments
Martin Patoka
Texas Instruments
Srinath Hosur
Texas Instruments
Steven Tom
Texas Instruments
Terrance Shih
VIA Technologies, Inc.
Charles Neumann
Western Digital Technologies, Inc.
Curtis Stevens
Western Digital Technologies, Inc.
John Maroney
Western Digital Technologies, Inc.
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