1G DDR2 E die
[Industrial Model]
IBIS & HSPICE
Verication Report
DRAM Design
Memory Division
Samsung Electronics Co. LTD
1. IBIS/HSPICE Model Verication Report
!" #$
"%& '()*+()*+
,),-. / "0/&'123
4,5-. / "0//6/&'1
*"!1+ 16''
2. Device Modeling Conditions
787$ 17*%&.+167*.9+1:7*(3+
;!!&*<+ =5*%&.+'5*(3+=5*.9+>.?
=*%&.+'5*(3+:=5*.9+>,!3.@
.!!! '1:*,!!.3!.%+
3.3!"3 7AB'1:75AB'&(AB=
,!&3"!..C. 7,DEB'1=77,D4B1=7
3. IBIS Verication Summary
7-! .!23*3!23+.!
.3&& (..F4.A3!"
%! ':!!"*2%,),54#G+
!. ,),*3!",),23!,),CG1+
4. IBIS/HSPICE Model Verication Results
$33!"&!&3!H@&C3!"(..3!"84.A3!"
*.!4.A3!"!.!(..3!"+
@.C.H!18%&181
*I!+ !1*'1:J/C.+ %&1*1'J/C.+ 1*1J/C.+
Rtt_150
&1 ' =' '
1 G6 : 6
Rtt_75
&1 ' 6= :'
1 6 6
Rtt_50
&1 ' =' '
1 = : =