CONTENTS
X2000 AIoT Application Processor Data Sheet
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CONTENTS
1 Overview ............................................................................................ 5
1.1 Block Diagram ......................................................................................................................... 5
1.2 Features .................................................................................................................................. 6
1.2.1 CPU Core ......................................................................................................................... 6
1.2.2 Video Process Unit(VPU) ................................................................................................ 6
1.2.3 MIPI-CSI .......................................................................................................................... 6
1.2.4 Video Input Control(VICx2) .............................................................................................. 7
1.2.5 Image Signal Processor(ISPx2) ....................................................................................... 7
1.2.6 Lite Camera ..................................................................................................................... 8
1.2.7 Memory Interface ............................................................................................................. 8
1.2.8 Audio ................................................................................................................................ 8
1.2.9 Display ............................................................................................................................. 9
1.2.10 System Functions ............................................................................................................ 9
1.2.11 Peripherals ..................................................................................................................... 11
1.2.12 Bootrom ......................................................................................................................... 13
2 PAD Information ............................................................................... 14
2.1 Pin Map ................................................................................................................................. 14
2.2 Pin Description ...................................................................................................................... 16
2.2.1 GPIO Group A ................................................................................................................ 16
2.2.2 GPIO Group B................................................................................................................ 17
2.2.3 GPIO Group C ............................................................................................................... 19
2.2.4 GPIO Group D ............................................................................................................... 21
2.2.5 GPIO Group E................................................................................................................ 22
2.3 X2000 Analog PAD DESCRIPTION ...................................................................................... 23
2.4 X2000 Digital PAD DESCRIPTION ....................................................................................... 28
3 Electrical Specifications .................................................................... 34
3.1 Absolute Maximum Ratings ................................................................................................... 34
3.2 Recommended operating conditions ..................................................................................... 35
3.3 DC Specifications .................................................................................................................. 36
3.4 Audio codec ........................................................................................................................... 42
3.5 Power On, Reset and BOOT ................................................................................................. 43
3.5.1 Power-On Timing ........................................................................................................... 43
3.5.2 Reset procedure ............................................................................................................ 44
3.5.3 BOOT ............................................................................................................................. 45
4 Packaging Information ...................................................................... 47
4.1 Overview ................................................................................................................................ 47
4.2 Device Dimensions ................................................................................................................ 47
4.3 Solder Ball Materials ............................................................................................................. 48
