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文库首页行业研究行业报告SPI2008_43_Rel_Permittivity_Var_Via_Structure_Poster.pdf

SPI2008_43_Rel_Permittivity_Var_Via_Structure_Poster.pdf

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SPI2008_43_Rel_Permittivity_Var_Via_Structure_Poster

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SPI2008 Relative Permittivity Variation Surrounding PCB Via Hole Structures

Relative Permittivity Variation

Surrounding PCB Via Hole Structures

SPI2008 Avignon France

May 12-15, 2008

Lambert Simonovich

lambert@nortel.com

SPI2008 Relative Permittivity Variation Surrounding PCB Via Hole Structures Lambert Simonovich

Introduction

Present IC technology advancements are allowing

data rates beyond 6

Gb/s

PCB through hole via parasitics becoming more of a

factor affecting BER performance

Accurate via modeling and topology simulation are a

must

All models and methodologies require defining

relative permittivity (

) or dielectric constant (

) of

material surrounding the via hole structure

SPI2008 Relative Permittivity Variation Surrounding PCB Via Hole Structures Lambert Simonovich

PCB Fabrication Overview

Conventional PCB laminates are fabricated with

a weave of E

glass fiber yarns (

Dk 6.6 @ 1MHz

)

and resin (

Dk 3.2 @ 1MHz

) [1]

Effective

is a function of glass to resin ratio

of laminates used in the PCB stackup

For FR

4 PCBs an effective

of 4.3 is often

used for trace etch impedance calculations

SPI2008 Relative Permittivity Variation Surrounding PCB Via Hole Structures Lambert Simonovich

N4000-6

Dielectric Properties Table [1], [2]

Style

Glass /

Laminate

Thickness

Ratio

(mils)

Resin

Content

(%)

Yarn

Count

(threads/inch)

Yarn

Pitch

(mils)

106 1.4/2.0 69.0 56x56 17.9x17.9

1080 2.3/3.0 62.0 60x40 16.7x21.3

2113 2.9/4.0 54.5 60x56 16.7x17.9

2116 3.8/4.0 43.0 60x58 16.7x17.2

7628 6.8/8.0 44.4 44x32 22.7x31.3

Resin

Fiberglass Weave

Fiberglass weaves vs. resin content illustration.

Smaller glass diameter and thread count results

in higher resin content, while larger glass

diameter and thread count results in lower resin

content.

2113106 7628

Fiberglass Weave

Resin Content

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