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SPI2008 Relative Permittivity Variation Surrounding PCB Via Hole Structures Lambert Simonovich
Introduction
Introduction
¾
¾
Present IC technology advancements are allowing
Present IC technology advancements are allowing
data rates beyond 6
data rates beyond 6
Gb/s
Gb/s
¾
¾
PCB through hole via parasitics becoming more of a
PCB through hole via parasitics becoming more of a
factor affecting BER performance
factor affecting BER performance
¾
¾
Accurate via modeling and topology simulation are a
Accurate via modeling and topology simulation are a
must
must
¾
¾
All models and methodologies require defining
All models and methodologies require defining
relative permittivity (
relative permittivity (
ε
ε
r
r
) or dielectric constant (
) or dielectric constant (
Dk
Dk
) of
) of
material surrounding the via hole structure
material surrounding the via hole structure
