JEDEC Standard No. 209-4-1A
-i-
Addendum No. 1 to JESD209-4 - LOW POWER DOUBLE DATA RATE 4X (LPDDR4X)
Contents
1
Scope ................................................................................................................................. 1
2 Package Ballout and Pin Definition ................................................................................ 2
Pad Order .......................................................................................................................... 2
2.2 Single Channel Pad Order ............................................................................................... 3
2.3 LPDDR4X packages.......................................................................................................... 4
2.3.1 LPDDR4 34x34 Quad x16 Channel (Fits 14x14 0.4 mm pitch) – Using MO-317A ........ 4
2.3.2 144 ball ePoP MCP One-Channel FBGA (top view) using MO-323A ............................ 5
2.3.3 200-ball x32 Discrete Package, 0.80 mm x 0.65 mm using MO-311 ............................. 6
2.3.4 432-ball x64 HDI Discrete Package, 0.50 mm x 0.50 mm (MO-313) .............................. 7
2.3.5 254 ball e•MMC MCP Two-Channel FBGA (top view) using MO-276 ............................ 8
2.3.6 254 ball UFS MCP Two-Channel FBGA (top view) using MO-276 ................................ 9
2.4 Pad Definition and Description ..................................................................................... 13
2.5 Mode Register Definition ............................................................................................... 14
3 Command Definitions and Timing Diagrams ............................................................... 25
3.1 Pull Up/Pull Down Driver Characteristics and Calibration ......................................... 25
3.2 ODT Mode Register and ODT Characteristics ............................................................. 25
3.2 ODT Mode Register and ODT Characteristics (cont’d) ............................................... 26
3.3 On Die Termination for DQ, DQS and DMI .................................................................... 27
3.4 Output Driver and Termination Register Temperature and Voltage Sensitivity ....... 29
3.5 Single-ended mode for Clock and Strobe .................................................................... 30
3.5.1 Combination of Mode Register setting and ODT termination .................................... 30
3.5.2 Restriction of Single-ended mode ................................................................................ 30
3.5.3 Switching sequence between Differential and Single-ended ..................................... 31
3.5.4 VRCG Enable timing ....................................................................................................... 36
3.5.5 Command bus training procedure ................................................................................ 38
3.5.6 Mode Register Function with two physical registers .................................................. 41
3.5.7 Reference level for Single-ended mode ....................................................................... 42
3.5.8 AC parameters for Single Ended (SE) .......................................................................... 43
4 AC and DC Operating Conditions ................................................................................. 44
4.1 Recommended DC Operating Conditions for low voltage .......................................... 44
4.2 Single Ended Output Slew Rate .................................................................................... 44
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