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1997 Microchip Technology Inc. DS21222A-page 1
M
24LC01B/02B MODULES
FEATURES
• ISO 7816 Compliant pad locations
• Low power CMOS technology
- 1 mA active current typical
- 10
µ
A standby current typical at 5.5V
• Organized as a single block of 128 bytes (128 x 8)
or 256 bytes (256 x 8)
• 2-wire serial interface bus, I
2
C™ compatible
• 100 kHz (2.5V) and 400 kHz (5V) compatibility
• Self-timed write cycle (including auto-erase)
• Page-write buffer for up to 8 bytes
• 2 ms typical write cycle time for page-write
• ESD protection > 4 kV
• 1,000,000 E/W cycles guaranteed
• Data retention > 200 years
• Temperature ranges available:
DESCRIPTION
The Microchip Technology Inc. 24LC01B and 24LC02B
are 1K-bit and 2K-bit Electrically Erasable PROMs in
ISO modules for smart card applications. The devices
are organized as a single block of 128 x 8-bit or 256 x
8-bit memory with a two-wire serial interface. The
24LC01B and 24LC02B also have page-write capabil-
ity for up to 8 bytes of data.
ISO MODULE LAYOUT
BLOCK DIAGRAM
- Commercial (C): 0
°
C to +70
°
C
VSS
SDA
SCL
V
DD
HV GENERATOR
EEPROM
ARRAY
PAGE LATCHES
YDEC
XDEC
SENSE AMP
R/W CONTROL
MEMORY
CONTROL
LOGIC
I/O
CONTROL
LOGIC
SDA SCL
VCC
VSS
1K/2K I
2
C
™
Serial EEPROMs in ISO Micromodules
24LC01B/02B Modules
DS21222A-page 2
1997 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
1.1 Maxim
um Ratings*
V
CC
...................................................................................7.0V
All inputs and outputs w.r.t. V
SS
................-0.6V to V
CC
+1.0V
Storage temperature ..................................... -65˚C to +150˚C
Ambient temp. with power applied................. -65˚C to +125˚C
ESD protection on all pads.............................................
≥
4 kV
*Notice:
Stresses above those listed under “Maximum ratings”
may cause permanent damage to the device. This is a stress rat-
ing only and functional operation of the device at those or any
other conditions above those indicated in the operational listings
of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1: PAD FUNCTION TABLE
1.2 P
ad Descriptions
1.2.1 SDA (Serial Data)
This is a bi-directional pad used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to V
CC
(typical 10 K
Ω
for 100 kHz, 2 K
Ω
for
400 kHz).
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are reserved
for indicating the START and STOP conditions.
1.2.2 SCL (Serial Clock)
This input is used to synchronize the data transfer from
and to the device.
Name Function
V
SS
SDA
SCL
V
CC
Ground
Serial Address/Data I/O
Serial Clock
+2.5V to 5.5V Power Supply
TABLE 1-1 DC CHARACTERISTICS
All Parameters apply across the recom-
mended operating ranges unless other-
wise noted.
Commercial (C): Tamb = 0˚C to +70˚C, V
CC
= 2.5V to 5.5V
Parameter Symbol Min. Max. Units Conditions
SCL and SDA pins:
High level input voltage V
IH
0.7 V
CC
V (Note)
Low level input voltage V
IL
0.3 V
CC
V (Note)
Hysteresis of Schmitt trigger inputs V
HYS
0.05 V
CC
— V Vcc
≥
2.5V (Note)
Low level output voltage V
OL
0.40 V I
OL
= 3.0 mA, V
CC
= 4.5V
I
OL
= 2.1 mA, V
CC
= 2.5V
Input leakage current I
LI
-10 10
µ
A V
IN
= V
CC
or V
SS
Output leakage current I
LO
-10 10
µ
A V
OUT
= V
CC
or V
SS
Pin capacitance (all inputs/outputs) C
IN
,
C
OUT
— 10 pF V
CC
= 5.0V (Note)
Tamb = 25˚C, f = 1 MHz
Operating current I
CC
Write — 3 mA V
CC
= 5.5V, SCL = 400 kHz
I
CC
Read — 1 mA V
CC
= 5.5V, SCL = 400 kHz
Standby current I
CCS
— 100
µ
A V
CC
= 5.5V, SDA = SCL = V
CC
Note:
This parameter is periodically sampled and not 100% tested.
24LC01B/02B Modules
1997 Microchip Technology Inc. DS21222A-page 3
TABLE 1-2 AC CHARACTERISTICS
FIGURE 1-1: BUS TIMING DATA
All parameters apply across the specified operat-
ing ranges unless otherwise noted.
Vcc = 2.5V to 5.5V
Commercial (C): Tamb = 0
°
C to +70
°
C
Parameter Symbol
Vcc = 2.5V - 5.5V
STD MODE
Vcc = 4.5V - 5.5V
FAST MODE
Units Remarks
Min. Max. Min. Max.
Clock frequency F
CLK
— 100 — 400 kHz
Clock high time T
HIGH
4000 — 600 — ns
Clock low time T
LOW
4700 — 1300 — ns
SDA and SCL rise time T
R
— 1000 — 300 ns (Note 1)
SDA and SCL fall time T
F
— 300 — 300 ns (Note 1)
START condition hold time T
HD
:
STA
4000 — 600 — ns After this period the first
clock pulse is generated
START condition setup time T
SU
:
STA
4700 — 600 — ns Only relevant for repeated
START condition
Data input hold time T
HD
:
DAT
0 — 0 — ns (Note 2)
Data input setup time T
SU
:
DAT
250 — 100 — ns
STOP condition setup time T
SU
:
STO
4000 — 600 — ns
Output valid from clock T
AA
— 3500 — 900 ns (Note 2)
Bus free time T
BUF
4700 — 1300 — ns Time the bus must be free
before a new transmission
can start
Output fall time from V
IH
minimum to V
IL
maximum
T
OF
— 250 20 +0.1
C
B
250 ns (Note 1), C
B
≤
100 pF
Input filter spike suppression
(SDA and SCL pins)
T
SP
— 50 — 50 ns (Notes 1, 3)
Write cycle time T
WC
— 10 — 10 ms Byte or Page mode
Endurance 1M — 1M — cycles 25
°
C, V
CC
= 5.0V, Block
Mode (Note 4)
Note 1:
Not 100% tested. C
B
= total capacitance of one bus line in pF.
2:
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of START or STOP conditions.
3:
The combined T
SP
and V
HYS
specifications are due to Schmitt trigger inputs which provide improved noise
spike suppression. This eliminates the need for a TI specification for standard operation.
4:
This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific
application, please consult the Total Endurance Model which can be obtained on our BBS or website.
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