NCEMBS41-04G
ShenZhen Netcom Electronics Co.,Ltd www.netcom-3c.com
8/F, 1 Building. Finance Base, NO.8, KeFa Road,Shenzhen, China Tel:86-755-86168848
10/F, CHINA AEROSPACE CENTRE,143 HOI BUN ROAD, HK Tel: 852-23850111
TABLE OF CONTENTS
1. INTRODUCTION.....................................................................................................................1
1.1 Overview........................................................................................................................1
1.2 Features.........................................................................................................................1
1.3. Function Description................................................................................................1
1.4. Independent Technology........................................................................................2
1.5. Defect and Error Management.............................................................................2
2. PRODUCT SPECIFICATIONS..............................................................................................2
2.1Product list......................................................................................................................2
2.2 Performance (Typical value) 8bit@52MHz........................................................3
2.3Power Supply and Power Consumption...............................................................3
2.4 Operational Environment.........................................................................................3
3. Pin assignments.....................................................................................................................4
3.1 Ball Array view.............................................................................................................4
3.2 Pin Assignment............................................................................................................5
4. e·MMC4.41 Function Description.....................................................................................5
4.1 Partition Management...............................................................................................6
4.2 Boot operation.............................................................................................................6
4.3 Card identification mode..........................................................................................8
4.4 Automatic Sleep Mode..............................................................................................9
4.5 Sleep (CMD5)...............................................................................................................9
4.6 H/W Reset operation...............................................................................................10
4.7 Enhanced Reliable Write........................................................................................10
4.8 Secure Erase..............................................................................................................10
4.9 Secure Trim................................................................................................................11
4.10 Trim.............................................................................................................................11
4.11 Enhanced Write Protection.................................................................................11
4.12 Interrupt mode.......................................................................................................11
4.13 High Priority Interrupt..........................................................................................12
4.14 Data transfer mode...............................................................................................13
4.15 Background Operations.......................................................................................14
4.16 High-speed mode selection................................................................................15
4.17 Bus width selection...............................................................................................15
4.18 Card lock/unlock operation................................................................................15
4.19 CID register..............................................................................................................
15
4.20 CSD register.............................................................................................................16
4.21 Extended CSD register.........................................................................................17
4.22 OCR Register............................................................................................................23
5. Package Dimension............................................................................................................24
6. MARKING................................................................................................................................26
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