JEDEC Publication No. 155B
-i-
RECOMMENDED ESD TARGET LEVEL FOR HBM QUALIFICATION
Contents
Foreword ............................................................................................................................................................................... ii
Introduction .......................................................................................................................................................................... ii
1 Scope ........................................................................................................................................................................ 1
2 References ............................................................................................................................................................... 1
3 Terms, definitions, and letter symbols .................................................................................................................. 4
4 Historical Perspective on HBM/MM ESD Requirements ................................................................................... 5
4.1 Motivation for the HBM Target Level ..................................................................................................................... 5
4.2 Motivation for Introducing Machine Model (MM) .................................................................................................. 5
5 Changes and Improvements in ESD and Control Environment ........................................................................ 6
5.1 Historic ESD Handling Procedures .......................................................................................................................... 6
5.2 Global Implementation of ESD Control ................................................................................................................... 7
5.2.1 Ground and Bond all Conductors: ............................................................................................................................ 8
5.2.2 Control Charges on Insulators .................................................................................................................................. 8
5.2.3 Use Protective Packaging for Transit and Storage ................................................................................................... 8
5.2.4 ESD Control Programs and Resulting Data ............................................................................................................. 9
5.2.5 Advantage of Process Analysis .............................................................................................................................. 10
5.3 Change of HBM Hazard Scenario by Increasing the Automation Level ................................................................ 12
6 Consolidated Industry Data on HBM Levels vs. Field Returns ....................................................................... 13
6.1 Field Return Rates versus HBM Level ................................................................................................................... 13
6.2 Case Studies ........................................................................................................................................................... 16
6.2.1 Devices with Failure Levels below 500 V HBM .................................................................................................... 16
6.2.2 Devices that Fail between 500-1000 V HBM ........................................................................................................ 16
6.2.3 Devices that Fail between 1000-2000 V HBM....................................................................................................... 17
6.3 Conclusion ............................................................................................................................................................. 17
7 Impact of ESD Requirements from Customers and Suppliers ......................................................................... 18
7.1 ESD Requirements and Specification Failures ....................................................................................................... 18
7.2 Impact of “ESD Failures”....................................................................................................................................... 18
7.3 Impact of a Revised ESD Target Level .................................................................................................................. 20
8 IC Technology Scaling Effects on Component Level ESD ................................................................................ 21
8.1 Scaling Effects on ESD Robustness ....................................................................................................................... 21
8.2 Protection Design Window .................................................................................................................................... 24
8.3 ESD Capacitive Loading Requirements ................................................................................................................. 26
8.4 Package Effects ...................................................................................................................................................... 29
8.5 ESD Technology Roadmap .................................................................................................................................... 30
8.6 Discussion .............................................................................................................................................................. 31
9 Differences between Component ESD and System Level ESD ......................................................................... 32
9.1 The History of System Level ESD ......................................................................................................................... 32
9.2 Differences in Component and System Level ESD Stress Models ........................................................................ 32
9.3 Case Studies ........................................................................................................................................................... 34
9.4 Conclusion ............................................................................................................................................................. 34
10 Recommendations for a New ESD Target Level ................................................................................................ 35
10.1 New Realistic Target Level for HBM .................................................................................................................... 35
10.2 Treatment of Special Pins....................................................................................................................................... 36
10.3 Timeframe for Applying New Recommendations ................................................................................................. 36
10.4 Future Cost of ESD Design .................................................................................................................................... 36
10.5 Product ESD Evaluation Criteria............................................................................................................................ 37
10.6 Looking Forward .................................................................................................................................................... 38
Annex A (informative) Frequently Asked Questions ....................................................................................................... 39
Annex B (informative) Machine Model – Correlation between HBM and MM ESD ................................................... 44
B.1 Correlation: HBM vs. MM ..................................................................................................................................... 44
B.1.1 Consequence of 1 kV HBM Target ........................................................................................................................ 45
B.2 Exceptions to HBM/MM Ratio .............................................................................................................................. 47
B.2.1 Bipolar vs. Unipolar Stress ..................................................................................................................................... 47
B.2.2 Advanced Technologies ......................................................................................................................................... 48
B.3 Conclusions ............................................................................................................................................................ 49
Annex C (informative) Differences between JEP155B and JEP155A.01 ........................................................................ 50
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