湿度温度传感器HDC1080的Verilog仿真模块实现与测试

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Verilog

IIC

HDC1080

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HDC1080.zip （3个子文件）

HDC1080.PDF 473KB

HDC1080.txt 20KB

HDC_sim.txt 1KB

GND

MCU

Peripheral

3.3 V

ADC

TEMPERATURE

Registers

Logic

HDC1080

SDA

SCL

OTP

Calibration Coefficients

VDD

GND

3.3 V

VDD

3.3 V

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

Reference

Design

HDC1080

SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016

HDC1080 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor

1 Features 3 Description

The HDC1080 is a digital humidity sensor with

• Relative Humidity Accuracy ±2% (typical)

integrated temperature sensor that provides excellent

• Temperature Accuracy ±0.2°C (typical)

measurement accuracy at very low power. The

• Excellent Stability at High Humidity

HDC1080 operates over a wide supply range, and is

a low cost, low power alternative to competitive

• 14 Bit Measurement Resolution

solutions in a wide range of common applications.

• 100 nA Sleep Mode Current

The humidity and temperature sensors are factory

• Average Supply Current:

calibrated.

– 710 nA @ 1sps, 11 bit RH Measurement

Device Information

(1)

– 1.3 µA @ 1sps, 11 bit RH and Temperature

PART

Measurement

PACKAGE BODY SIZE (NOM)

NUMBER

• Supply Voltage 2.7 V to 5.5 V

HDC1080 PWSON (6-pin) DMB 3.00 mm x 3.00 mm

• Small 3 mm x 3 mm Device Footprint

(1) For all available packages, see the orderable addendum at

• I

C Interface

the end of the datasheet.

2 Applications

• HVAC

• Smart Thermostats and Room Monitors

• White Goods

• Printers

• Handheld Meters

• Medical Devices

• Wireless Sensor (TIDA: 00374, 00484, 00524)

4 Typical Application

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

HDC1080

SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016

www.ti.com

Table of Contents

8.4 Device Functional Modes.......................................... 9

1 Features.................................................................. 1

8.5 Programming........................................................... 10

2 Applications ........................................................... 1

8.6 Register Map .......................................................... 14

3 Description ............................................................. 1

9 Application and Implementation ........................ 17

4 Typical Application................................................ 1

9.1 Application Information............................................ 17

5 Revision History..................................................... 2

9.2 Typical Application ................................................. 17

6 Pin Configuration and Functions......................... 3

9.3 Implementation and Usage Recommendations ..... 18

7 Specifications......................................................... 4

10 Power Supply Recommendations ..................... 19

7.1 Absolute Maximum Ratings ...................................... 4

11 Layout................................................................... 19

7.2 ESD Ratings.............................................................. 4

11.1 Layout Guidelines ................................................ 19

7.3 Recommended Operating Conditions....................... 4

11.2 Layout Example .................................................... 19

7.4 Thermal Information ................................................. 4

12 Device and Documentation Support ................. 21

7.5 Electrical Characteristics........................................... 5

12.1 Documentation Support ........................................ 21

7.6 I2C Interface Electrical Characteristics..................... 6

12.2 Community Resources.......................................... 21

7.7 I2C Interface Timing Requirements ........................ 6

12.3 Trademarks........................................................... 21

7.8 Typical Characteristics.............................................. 7

12.4 Electrostatic Discharge Caution............................ 21

8 Detailed Description.............................................. 9

12.5 Glossary................................................................ 21

8.1 Overview ................................................................... 9

13 Mechanical, Packaging, and Orderable

8.2 Functional Block Diagram ......................................... 9

Information ........................................................... 21

8.3 Feature Description................................................... 9

5 Revision History

Changes from Original (November 2015) to Revision A Page

• Product Preview to Production Data Release ....................................................................................................................... 1

Product Folder Links: HDC1080

Top View

SDA

GND

VDD

SCL

SENSOR

HDC1080

www.ti.com

SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016

6 Pin Configuration and Functions

DMB Package

6 Pin PWSON

Top View

Pin Functions

I/O TYPE

(1)

DESCRIPTION

NAME NO.

SDA 1 I/O Serial data line for I2C, open-drain; requires a pull-up resistor to VDD

GND 2 G Ground

NC 3,4 - These pins may be left floating, or connected to GND

VDD 5 P Supply Voltage

SCL 6 I Serial clock line for I2C, open-drain; requires a pull-up resistor to VDD

DAP DAP - Die Attach Pad. Should be left floating. (On bottom of the device, not shown in the figure)

(1) P=Power, G=Ground, I=Input, O=Output

Product Folder Links: HDC1080

HDC1080

SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

(1)

MIN MAX UNIT

VDD -0.3 6

Input Voltage SCL -0.3 6 V

SDA -0.3 6

Storage Temperature T

STG

-65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±2000

(ESD)

Electrostatic discharge V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

C101

(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating range (unless otherwise noted)

MIN NOM MAX UNIT

Supply Voltage 2.7 3 5.5 V

, Temperature sensor Ambient Operating Temperature -40 125 °C

, Humidity sensor

(1)

Ambient Operating Temperature -20 70 °C

, Humidity sensor

(1)

Functional Operating Temperature -20 85 °C

(1) See Figure 2.

7.4 Thermal Information

HDC1080

THERMAL METRIC

(1)

PWSON (DMB) UNIT

6 PINS

θJA

Junction-to-ambient thermal resistance 49.4 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 29.8 °C/W

θJB

Junction-to-board thermal resistance 23.1 °C/W

Junction-to-top characterization parameter 3.3 °C/W

Junction-to-board characterization parameter 23.1 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance 4.2 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

Product Folder Links: HDC1080

HDC1080

www.ti.com

SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016

7.5 Electrical Characteristics

(1)

The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. T

= 30°C,

RH = 40%, and V

= 3V.

PARAMETER TEST CONDITION

(2)

MIN

(3)

TYP

(4)

MAX

(3)

UNIT

POWER CONSUMPTION

Supply Current RH measurement, bit 12 of 0x02 register = 190 220 µA

(5)

Temperature measurement, bit 12 of 0x02 160 185 µA

(5)

Sleep Mode 100 200 nA

Average @ 1 measurement/second, RH (11 710 nA

bit), bit 12 of 0x02 register = 0

(5)(6)

Average @ 1 measurement/second, Temp 590 nA

(11 bit), bit 12 of 0x02 register = 0

(5)(6)

Average @ 1 measurement/second, RH 1.3 µA

(11bit) +temperature (11 bit), bit 12 of 0x02

(5)(6)

Startup (average on Start-up time) 300 µA

HEAT

Heater Current

(7)

Peak current 7.2 mA

Average @ 1 measurement/second, RH 50 µA

(11bit) +temperature (11 bit), bit 12 of 0x02

(5)(6)

RELATIVE HUMIDITY SENSOR

ACC

Accuracy Refer to Figure 2 in Typical Characteristics ±2 %RH

section.

REP

Repeatability

(7)

14 bit resolution ±0.1 %RH

HYS

Hysteresis

(8)

10% ≤ RH ≤ 70% ±1 %RH

Response Time

(9)

(10)

15 s

Conversion Time

(7)

8 bit resolution 2.50 ms

11 bit resolution 3.85 ms

14 bit resolution 6.50 ms

Operating Range

(11)

Non-condensing 0 100 %RH

LTD

Long Term Drift

(12)

±0.25 %RH/yr

TEMPERATURE SENSOR

TEMP

ACC

Accuracy

(7)

5°C < T

< 60°C ±0.2 ±0.4 °C

TEMP

REP

Repeatability

(7)

14 bit resolution ±0.1 °C

TEMP

Conversion Time

(7)

11 bit accuracy 3.65 ms

14 bit accuracy 6.35 ms

(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions

result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical

tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond

which the device may be permanently degraded, either mechanically or electrically.

(2) Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimal

values have no prefix.

(3) Limits are ensured by testing, design, or statistical analysis at 30°C. Limits over the operating temperature range are ensured through

correlations using statistical quality control (SQC) method.

(4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on

shipped production material.

(5) I

C read/write communication and pull-up resistors current through SCL and SDA not included.

(6) Average current consumption while conversion is in progress.

(7) This parameter is specified by design and/or characterization and it is not tested in production.

(8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point.

(9) Actual response times will vary dependent on system thermal mass and air-flow.

(10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity.

(11) Recommended humidity operating range is 10% to 70% RH. Prolonged operation outside this range may result in a measurement

offset. The measurement offset will decrease after operating the sensor in this recommended operating range.

(12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, out-

gassing tapes, adhesives, packaging materials, etc.

Product Folder Links: HDC1080

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