JOINT JEDEC/ECA
STANDARD
Definition of “Low-Halogen” For
Electronic Products
JS709C
(Revision of JS709B, April 2015)
MARCH 2018
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
ELECTRONIC COMPONENTS INDUSTRY ASSOCIATION
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Joint JEDEC/ECA Standard No. 709C
-i-
DEFINITION OF “LOW-HALOGEN” FOR ELECTRONIC PRODUCTS
______________________________________Contents_______________________________________
Foreword ii
Introduction ii
1 Scope 1
2 Reference documents 2
3 Terms and definitions 3
4 Requirements for low-halogen electronic products 5
5 Compliance process for low-halogen electronic materials and components 5
6 Marking and labeling for low-halogen electronic products 6
Annexes (Informative)
A Where BFRs, CFRs, and PVC are used in electronic or electrical products 7
B Suggested test protocols – low-halogen process flow 8
C Clarification for including only Bromine & Chlorine in the definition of low-halogen materials 10
D Differences between revisions 11
Joint JEDEC/ECA Standard No. 709C
-ii-
DEFINITION OF “LOW-HALOGEN” FOR ELECTRONIC PRODUCTS
Foreword
The term “low-halogen” is currently not well defined, nor is it mandated as a requirement by any
legislation worldwide at the time of this standard. Nevertheless, to ensure a uniform and consistent
understanding throughout the industry of the meaning of “low-halogen”, this term needs to be clearly
defined as it pertains to materials within electronic products. In this standard, the term “low-halogen” is
defined in Clause 4 and is used to identify materials within electronic products that contain low
concentrations of bromine and chlorine from brominated and chlorinated flame retardants (BFRs, CFRs)
and polyvinyl chloride (PVC). Should one choose to implement a “low-halogen” technology, this
standard shall be utilized to identify the industry accepted definition, targeted materials, and systems
requirements.
Introduction
Halogenated polymeric materials and compounds are used in various engineering applications, including
flame retardation. Several decades of use have proven these materials and compounds to be reliable and
cost-effective. The electronic industry seeks to reduce the overall environmental impact of our products
by working to develop reliable and cost-effective alternatives to these materials and compounds.
However, the timetable for broad-scale adoption of low-halogen materials is difficult to predict, because
applications such as complex multilayer PCBs and large molded integrated circuits will require further
investigation and qualification of new materials.
The halogen group contains fluorine, chlorine, bromine, iodine, and astatine; however, this document will
use the term “low-halogen” to refer only to bromine and chlorine to be consistent with the International
Electrotechnical Commission (IEC) and IPC definitions of “halogen-free” (see 2.4). Refer to Annex C
for further explanation for exclusion of astatine, iodine and fluorine. In this document, the term “low-
halogen” is used to identify a material that contains low concentrations of bromine and chlorine from
brominated and chlorinated flame retardants (BFRs, CFRs) and polyvinyl chloride (PVC).
Joint JEDEC/ECA Standard No. 709C
Page 1
DEFINITION OF “LOW-HALOGEN” FOR ELECTRONIC PRODUCTS
(From JEDEC Board Ballot JCB-18-03, formulated under the cognizance of the JEDEC JC-14.4 Subcommittee on
Quality Processes and Methods and the ECA S-1 Passive Components Steering Committee.)
1 Scope
This standard provides terms and definitions for “low-halogen” electronic products that have the potential
to contain the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFRs, and PVC, and
recommends methods for marking and labeling. This standard may be applied to all nonmetallic and
nonceramic materials within electronic products including, but not limited to, materials in the following
components commonly found in electronic products:
1. Transistors, integrated circuits, modules consisting mainly of integrated circuits (e.g., multichip,
hybrid), and memory modules
2. Resistors, capacitors, relays, inductors, and connectors
3. Printed circuit board assemblies (PCBA’s) including components
4. Plastic in cables, sockets, switches and external wiring
5. Mechanical plastics (enclosures, fans, etc.)
6. Films, tapes, inks, and adhesives
7. Soldering flux residues (when present)
8. Sound, shock, and vibration dampeners (foams, resins, etc.)
This document establishes the maximum concentration level for the halogens bromine (Br) and chlorine
(Cl) from the use of BFRs, CFRs, and PVC. While the halogen group contains fluorine, chlorine,
bromine, iodine, and astatine, this document will use the term “low-halogen” to refer only to bromine and
chlorine. Refer to Annex C for further explanation for exclusion of astatine, iodine and fluorine.
NOTE The definition of “low-halogen” is different from the term “halogen-free” as described in IEC 61249-2
sectional standard related to non-halogenated base material and as defined in the J-STD-609A marking and labeling
standard; standards that pertain only to printed boards and are currently in use in the electronics and solid-state
industries.
BFRs, CFRs, and PVC in materials that may be used during processing, in product delivery systems, or in
packaging, but do not remain within the final product are not included in the scope of this document.
