JEDEC
STANDARD
Temperature, Bias, and Operating Life
JESD22-A108G
(Revision of JESD22-A108F dated July 2017)
NOVEMBER 2022
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
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TEMPERATURE, BIAS, AND OPERATING LIFE
Contents
Page
1
Scope .......................................................................................................................................................... 1
2 Apparatus .................................................................................................................................................. 1
2.1 Circuitry ...................................................................................................................................................... 1
2.1.1 Device Schematic ....................................................................................................................................... 1
2.1.2 Power .......................................................................................................................................................... 1
2.2 Device Mounting ........................................................................................................................................ 1
2.3 Power Supplies and Signal Sources ............................................................................................................ 2
2.4 Environmental Chamber ............................................................................................................................. 2
3 Definitions .................................................................................................................................................. 2
3.1 Maximum Operating Voltage ..................................................................................................................... 2
3.2 Absolute Maximum Rated Voltage ............................................................................................................ 2
3.3 Absolute Maximum Rated Junction Temperature ...................................................................................... 2
4 Procedure................................................................................................................................................... 2
4.1 Stress Duration ............................................................................................................................................ 2
4.2 Stress Conditions ........................................................................................................................................ 3
4.2.1 Ambient Temperature ................................................................................................................................. 3
4.2.2 Operating Voltage ....................................................................................................................................... 3
4.2.3 Biasing Configurations ............................................................................................................................... 3
4.2.3.1 High Temperature Forward Bias (HTFB) ................................................................................................... 3
4.2.3.2 High Temperature Operating Life (HTOL) / Low Temperature Operating Life (LTOL) .......................... 3
4.2.3.3 High Temperature Reverse Bias (HTRB) ................................................................................................... 4
4.2.3.4 High Temperature Gate Bias (HTGB) ........................................................................................................ 4
5 Cool-Down ................................................................................................................................................. 4
6 Measurements ........................................................................................................................................... 4
7 Failure Criteria ......................................................................................................................................... 5
8 Life Test Reporting ................................................................................................................................... 5
Annex A (Informative) Differences Between JESD22-A108F and Its Predecessors ........................................... 6
Tables Page
Table 1 — Additional Stress Requirements for Parts Not Tested Within Time Window .............................................. 5
