JEDEC
STANDARD
High Temperature Storage Life
JESD22-A103E.01
(Minor Editorial Revision of JESD22-A103E, October 2015)
JULY 2021
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
NOTICE
JEDEC standards and publications contain material that has been prepared, reviewed, and
approved through the JEDEC Board of Directors level and subsequently reviewed and approved
by the JEDEC legal counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating
misunderstandings between manufacturers and purchasers, facilitating interchangeability and
improvement of products, and assisting the purchaser in selecting and obtaining with minimum
delay the proper product for use by those other than JEDEC members, whether the standard is to
be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption
may involve patents or articles, materials, or processes. By such action JEDEC does not assume
any liability to any patent owner, nor does it assume any obligation whatever to parties adopting
the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to
product specification and application, principally from the solid state device manufacturer
viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or
publication may be further processed and ultimately become an ANSI standard.
No claims to be in conformance with this standard may be made unless all requirements stated in
the standard are met.
Inquiries, comments, and suggestions relative to the content of this JEDEC standard or
publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under
Standards and Documents for alternative contact information.
Published by
©JEDEC Solid State Technology Association 2015
3103 North 10th Street
Suite 240 South
Arlington, VA 22201-2107
This document may be downloaded free of charge; however JEDEC retains the
copyright on this material. By downloading this file the individual agrees not to
charge for or resell the resulting material.
PRICE: Contact JEDEC
Printed in the U.S.A.
All rights reserved
PLEASE!
DON’T VIOLATE
THE
LAW!
This document is copyrighted by JEDEC and may not be
reproduced without permission.
For information, contact:
JEDEC Solid State Technology Association
3103 North 10th Street
Suite 240 South
Arlington, VA 22201-2107
or refer to www.jedec.org under Standards-Documents/Copyright Information.
JEDEC Standard No. 22-A103E.01
Page 1
Test Method A103E.01
(Revision of A103E)
TEST METHOD A103E.01
HIGH TEMPERATURE STORAGE LIFE
(From JEDEC Board Ballot JCB-15-48, formulated under the cognizance of JC-14.1 Subcommittee on
Reliability Test Methods for Packaged Devices.)
1 Scope
The test is applicable for evaluation, screening, monitoring, and/or qualification of all solid state
devices.
The high temperature storage test is typically used to determine the effects of time and
temperature, under storage conditions, for thermally activated failure mechanisms and time-to-
failure distributions of solid state electronic devices, including nonvolatile memory devices (data
retention failure mechanisms). Thermally activated failure mechanisms are modeled using the
Arrhenius Equation for acceleration. During the test, accelerated stress temperatures are used
without electrical conditions applied. This test may be destructive, depending on time,
temperature and packaging (if any).
2 Reference documents (informative)
JEP122, Failure Mechanisms and Models for Semiconductor Devices.
JESD22-A113, Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability
Testing.
JESD22-B101, External Visual.
JESD47, Stress-Test-Driven Qualification of Integrated Circuits.
JESD94, Application Specific Qualification Using Knowledge Based Test Methodology.
J-STD-020, Joint IPC/JEDEC Standard, Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface-Mount Devices.
