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10-2-23 下午1:57MOSFET - Wikipedia, the free encyclopedia
Page 1 of 22http://en.wikipedia.org/wiki/MOSFET
MOSFET
Two power MOSFETs in the surface-
mount package D2PAK. Operating as
switches, each of these components can
sustain a blocking voltage of 120 volts in
the OFF state, and can conduct a
continuous current of 30 amperes in the
ON state, dissipating up to about 100
watts and controlling a load of over 2000
watts. A matchstick is pictured for scale.
A cross section through an nMOSFET
when the gate voltage V
GS
is below the
threshold for making a conductive
channel; there is little or no conduction
between the terminals source and drain;
the switch is off. When the gate is more
positive, it attracts electrons, inducing an
n-type conductive channel in the substrate
below the oxide, which allows electrons to
flow between the n-doped terminals; the
switch is on.
From Wikipedia, the free encyclopedia
The metal–oxide–semiconductor field-effect transistor
(MOSFET, MOS-FET, or MOS FET) is a device used for
amplifying or switching electronic signals. The basic principle
of the device was first proposed by Julius Edgar Lilienfeld in
1925. In MOSFETs, a voltage on the oxide-insulated gate
electrode can induce a conducting channel between the two
other contacts called source and drain. The channel can be of n-
type or p-type (see article on semiconductor devices), and is
accordingly called an NMOSFET or a PMOSFET (also
commonly nMOS, pMOS). It is by far the most common
transistor in both digital and analog circuits, though the bipolar
junction transistor was at one time much more common.
The 'metal' in the name is now often a misnomer because the
previously metal gate material is now often a layer of
polysilicon (polycrystalline silicon). Aluminium had been the
gate material until the mid 1970s, when polysilicon became
dominant, due to its capability to form self-aligned gates.
Metallic gates are regaining popularity, since it is difficult to
increase the speed of operation of transistors without metal
gates.
IGFET is a related term meaning insulated-gate field-effect
transistor, and is almost synonymous with MOSFET, though it
can refer to FETs with a gate insulator that is not oxide.
Another synonym is MISFET for metal–insulator–
semiconductor FET.
Contents
1 Composition
2 Circuit symbols
3 MOSFET operation
3.1 Metal–oxide–semiconductor structure
3.2 MOSFET structure and channel formation
3.3 Modes of operation
3.4 Body effect
10-2-23 下午1:57MOSFET - Wikipedia, the free encyclopedia
Page 2 of 22http://en.wikipedia.org/wiki/MOSFET
Simulation result for formation of inversion channel (electron density) and attainment of threshold
voltage (IV) in a nanowire MOSFET. Note that the threshold voltage for this device lies around 0.45V.
4 The primacy of MOSFETs
5 CMOS circuits
5.1 Digital
5.2 Analog
6 MOSFET scaling
6.1 Reasons for MOSFET scaling
6.2 Difficulties arising due to MOSFET size
reduction
6.2.1 Higher subthreshold conduction
6.2.2 Increased gate-oxide leakage
6.2.3 Increased junction leakage
6.2.4 Lower output resistance
6.2.5 Lower transconductance
6.2.6 Interconnect capacitance
6.2.7 Heat production
6.2.8 Process variations
6.2.9 Modeling challenges
7 MOSFET construction
7.1 Gate material
7.2 Insulator
7.3 Junction design
8 Other MOSFET types
8.1 Dual gate MOSFET
8.1.1 FinFET
8.2 Depletion-mode MOSFETs
8.3 NMOS logic
8.4 Power MOSFET
8.5 DMOS
8.6 RHBD MOSFETs
9 MOSFET analog switch
9.1 Single-type MOSFET switch
9.2 Dual-type (CMOS) MOSFET switch
10 References and notes
11 See also
12 External links
Composition
Usually the semiconductor of choice is silicon, but some
10-2-23 下午1:57MOSFET - Wikipedia, the free encyclopedia
Page 3 of 22http://en.wikipedia.org/wiki/MOSFET
Photomicrograph of two metal-gate MOSFETs in a
test pattern. Probe pads for two gates and three
source/drain nodes are labeled.
Usually the semiconductor of choice is silicon, but some
chip manufacturers, most notably IBM, recently started
using a compound (mixture) of silicon and germanium
(SiGe) in MOSFET channels. Unfortunately, many
semiconductors with better electrical properties than
silicon, such as gallium arsenide, do not form good
semiconductor-to-insulator interfaces, thus are not
suitable for MOSFETs. Research continues on creating
insulators with acceptable electrical characteristics on
other semiconductor material.
In order to overcome power consumption increase due
to gate current leakage, high-κ dielectric replaces silicon
dioxide for the gate insulator, while metal gates return
by replacing polysilicon (see Intel announcement
[1]
).
The gate is separated from the channel by a thin insulating layer, traditionally of silicon dioxide and later of
silicon oxynitride. Some companies have started to introduce a high-κ dielectric + metal gate combination
in the 45 nanometer node.
When a voltage is applied between the gate and body terminals, the electric field generated penetrates
through the oxide and creates an alleged "inversion layer" or "channel" at the semiconductor-insulator
interface. The inversion channel is of the same type, P-type or N-type, as the source and drain, thus it
provides a channel through which current can pass. Varying the voltage between the gate and body
modulates the conductivity of this layer and allows to control the current flow between drain and source.
Circuit symbols
A variety of symbols are used for the MOSFET. The basic design is generally a line for the channel with
the source and drain leaving it at right angles and then bending back at right angles into the same direction
as the channel. Sometimes three line segments are used for enhancement mode and a solid line for
depletion mode. Another line is drawn parallel to the channel for the gate.
The bulk connection, if shown, is shown connected to the back of the channel with an arrow indicating
PMOS or NMOS. Arrows always point from P to N, so an NMOS (N-channel in P-well or P-substrate) has
the arrow pointing in (from the bulk to the channel). If the bulk is connected to the source (as is generally
the case with discrete devices) it is sometimes angled to meet up with the source leaving the transistor. If
the bulk is not shown (as is often the case in IC design as they are generally common bulk) an inversion
symbol is sometimes used to indicate PMOS, alternatively an arrow on the source may be used in the same
way as for bipolar transistors (out for NMOS, in for PMOS).
Comparison of enhancement-mode and depletion-mode MOSFET symbols, along with JFET symbols
(drawn with source and drain ordered such that higher voltages appear higher on the page than lower
voltages):
10-2-23 下午1:57MOSFET - Wikipedia, the free encyclopedia
Page 4 of 22http://en.wikipedia.org/wiki/MOSFET
Example application of an N-
Channel MOSFET. When the switch
is pushed the LED lights up.
[2]
Metal–oxide–semiconductor structure
on P-type silicon
P-channel
N-channel
JFET MOSFET enh MOSFET enh (no bulk) MOSFET dep
For the symbols in which the bulk, or body, terminal is shown, it is here shown internally connected to the
source. This is a typical configuration, but by no means the only important configuration. In general, the
MOSFET is a four-terminal device, and in integrated circuits many of the MOSFETs share a body
connection, not necessarily connected to the source terminals of all the transistors.
MOSFET operation
Metal–oxide–semiconductor structure
A traditional metal–oxide–semiconductor (MOS) structure is
obtained by growing a layer of silicon dioxide (SiO
2
) on top of a
silicon substrate and depositing a layer of metal or polycrystalline
silicon (the latter is commonly used). As the silicon dioxide is a
dielectric material, its structure is equivalent to a planar capacitor,
with one of the electrodes replaced by a semiconductor.
When a voltage is applied across a MOS structure, it modifies the
distribution of charges in the semiconductor. If we consider a P-type
semiconductor (with N
A
the density of acceptors, p the density of
holes; p = N
A
in neutral bulk), a positive voltage, V
GB
, from gate
to body (see figure) creates a depletion layer by forcing the
positively charged holes away from the gate-insulator/semiconductor
interface, leaving exposed a carrier-free region of immobile,
negatively charged acceptor ions (see doping (semiconductor)). If
V
GB
is high enough, a high concentration of negative charge
carriers forms in an inversion layer located in a thin layer next to
the interface between the semiconductor and the insulator. Unlike
the MOSFET, where the inversion layer electrons are supplied
rapidly from the source/drain electrodes, in the MOS capacitor they
are produced much more slowly by thermal generation through
carrier generation and recombination centers in the depletion region.
Conventionally, the gate voltage at which the volume density of
electrons in the inversion layer is the same as the volume density of holes in the body is called the threshold
voltage.
10-2-23 下午1:57MOSFET - Wikipedia, the free encyclopedia
Page 5 of 22http://en.wikipedia.org/wiki/MOSFET
Cross section of an NMOS without
channel formed: OFF state
Cross section of an NMOS with
channel formed: ON state
voltage.
This structure with P-type body is the basis of the N-type MOSFET, which requires the addition of an N-
type source and drain regions.
MOSFET structure and channel formation
A metal–oxide–semiconductor field-effect transistor (MOSFET) is
based on the modulation of charge concentration by a MOS
capacitance between a body electrode and a gate electrode located
above the body and insulated from all other device regions by a gate
dielectric layer which in the case of a MOSFET is an oxide, such as
silicon dioxide. If dielectrics other than an oxide such as silicon
dioxide (often referred to as oxide) are employed the device may be
referred to as a metal–insulator–semiconductor FET (MISFET).
Compared to the MOS capacitor, the MOSFET includes two
additional terminals (source and drain), each connected to
individual highly doped regions that are separated by the body
region. These regions can be either p or n type, but they must both
be of the same type, and of opposite type to the body region. The
source and drain (unlike the body) are highly doped as signified by a
'+' sign after the type of doping.
If the MOSFET is an n-channel or nMOS FET, then the source and
drain are 'n+' regions and the body is a 'p' region. As described
above, with sufficient gate voltage, above a threshold voltage value,
electrons from the source (and possibly
[citation needed]
also the drain)
enter the inversion layer or n-channel at the interface between the p
region and the oxide. This conducting channel extends between the
source and the drain, and current is conducted through it when a
voltage is applied between source and drain.
For gate voltages below the threshold value, the channel is lightly
populated, and only a very small subthreshold leakage current can
flow between the source and the drain.
If the MOSFET is a p-channel or pMOS FET, then the source and
drain are 'p+' regions and the body is a 'n' region. When a negative gate-source voltage (positive source-
gate) is applied, it creates a p-channel at the surface of the n region, analogous to the n-channel case, but
with opposite polarities of charges and voltages. When a voltage less negative than the threshold value (a
negative voltage for p-channel) is applied between gate and source, the channel disappears and only a very
small subthreshold current can flow between the source and the drain.
The source is so named because it is the source of the charge carriers (electrons for n-channel, holes for p-
channel) that flow through the channel; similarly, the drain is where the charge carriers leave the channel.
The device may comprise a Silicon On Insulator (SOI) device in which a Buried OXide (BOX) is formed
below a thin semiconductor layer. If the channel region between the gate dielectric and a Buried OXide
(BOX) region is very thin, the very thin channel region is referred to as an Ultra Thin Channel (UTC)
region with the source and drain regions formed on either side thereof in and/or above the thin
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