JEDEC Standard No. 22-B111A
-i- Test Method B111A
(Revision of Test Method B111)
TEST METHOD B111A
BOARD LEVEL DROP TEST METHOD OF COMPONENTS
FOR HANDHELD ELECTRONIC PRODUCTS
Introduction
The handheld electronic products fit into the consumer and portable market segments. Included in the
handheld electronic products are cameras, calculators, cell phones, pagers, palm size PCs, Personal
Computer Memory Card International Association (PCMCIA) cards, smart cards, mobile phones,
personal digital assistants (PDAs) and other electronic products that can be conveniently stored in a
pocket and used while held in user’s hand.
These handheld electronic products are more prone to being dropped during their useful service life
because of their size and weight. This dropping event can not only cause mechanical failures in the
housing of the device but also create electrical failures in the printed circuit board (PCB) assemblies
mounted inside the housing due to transfer of energy through PCB supports. The electrical failures may
result from various failure modes such as cracking of circuit board, trace cracking on the board, cracking
of solder interconnections between the components and the board, and the component cracks. The
primary driver of these failures is excessive flexing of circuit board due to input acceleration to the board
created from dropping the handheld electronic product. This flexing of the board causes relative motion
between the board and the components mounted on it, resulting in component, interconnects, or board
failures. This type of failure is a strong function of the combination of the board design, construction,
material, thickness, and surface finish; interconnect material and standoff height; and component size.
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