STM32F030F4-IIC+DS3231时钟芯片例程+中文资料

共532个文件

c：340个

h：112个

s：49个

STM32F

F030

DS3231

高精度RTC

中文资料

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STM32F030F4-IIC+DS3231时钟芯片例程+中文资料（532个子文件）

libarm_cortexM0l_math.a 2.65MB

arm_common_tables.c 868KB

arm_dct4_init_f32.c 786KB

arm_dct4_init_q31.c 417KB

arm_rfft_init_f32.c 362KB

arm_dct4_init_q15.c 272KB

arm_rfft_init_q31.c 215KB

stm32f0xx_hal_tim.c 170KB

stm32f0xx_hal_i2c.c 160KB

arm_rfft_init_q15.c 141KB

stm32f0xx_hal_spi.c 124KB

stm32f0xx_hal_uart.c 98KB

stm32f0xx_hal_smartcard.c 91KB

stm32f0xx_hal_usart.c 89KB

stm32f0xx_hal_irda.c 87KB

stm32f0xx_hal_adc.c 84KB

stm32f0xx_hal_smbus.c 77KB

stm32f0xx_hal_tim_ex.c 66KB

arm_cfft_radix4_q15.c 56KB

stm32f0xx_hal_can.c 56KB

stm32f0xx_hal_rcc.c 50KB

stm32f0xx_hal_rtc_ex.c 49KB

stm32f0xx_hal_i2s.c 48KB

stm32f0xx_hal_rtc.c 47KB

stm32f0xx_ll_tim.c 45KB

arm_conv_partial_fast_q15.c 44KB

arm_cfft_radix4_q31.c 40KB

arm_conv_fast_q15.c 40KB

stm32f0xx_hal_dac_ex.c 39KB

stm32f0xx_hal_pcd.c 39KB

arm_correlate_fast_q15.c 38KB

stm32f0xx_hal_rcc_ex.c 37KB

arm_cfft_radix4_f32.c 35KB

stm32f0xx_hal_flash_ex.c 33KB

arm_fir_f32.c 30KB

stm32f0xx_hal_dma.c 29KB

stm32f0xx_hal_dac.c 28KB

stm32f0xx_ll_rtc.c 27KB

stm32f0xx_hal_tsc.c 26KB

arm_conv_partial_q15.c 25KB

arm_correlate_q7.c 25KB

stm32f0xx_ll_adc.c 24KB

stm32f0xx_ll_utils.c 24KB

arm_conv_partial_q7.c 24KB

stm32f0xx_hal_comp.c 24KB

arm_mat_inverse_f32.c 24KB

arm_mat_inverse_f64.c 24KB

arm_correlate_f32.c 24KB

arm_biquad_cascade_stereo_df2T_f32.c 23KB

stm32f0xx_hal_cec.c 23KB

stm32f0xx_hal_uart_ex.c 23KB

arm_correlate_q15.c 23KB

arm_conv_q15.c 23KB

stm32f0xx_hal_flash.c 22KB

arm_fir_q15.c 22KB

stm32f0xx_ll_spi.c 22KB

arm_conv_q7.c 22KB

arm_conv_partial_f32.c 22KB

arm_conv_partial_fast_opt_q15.c 22KB

arm_conv_partial_opt_q7.c 22KB

arm_correlate_q31.c 21KB

arm_biquad_cascade_df1_32x64_q31.c 21KB

arm_conv_partial_opt_q15.c 21KB

arm_conv_partial_fast_q31.c 21KB

stm32f0xx_ll_usart.c 21KB

arm_correlate_fast_q31.c 20KB

stm32f0xx_hal_gpio.c 20KB

arm_conv_f32.c 20KB

stm32f0xx_ll_dma.c 20KB

arm_fir_interpolate_f32.c 20KB

arm_conv_partial_q31.c 20KB

arm_biquad_cascade_df2T_f64.c 19KB

arm_biquad_cascade_df2T_f32.c 19KB

stm32f0xx_ll_rcc.c 19KB

arm_fir_decimate_q15.c 19KB

arm_conv_fast_q31.c 19KB

arm_cfft_f32.c 19KB

arm_cfft_radix2_q15.c 18KB

stm32f0xx_hal_crc.c 18KB

stm32f0xx_hal_pwr.c 18KB

arm_dct4_f32.c 18KB

arm_conv_q31.c 18KB

arm_fir_lattice_f32.c 17KB

arm_fir_decimate_f32.c 17KB

arm_fir_decimate_fast_q15.c 17KB

arm_biquad_cascade_df1_f32.c 17KB

arm_fir_lattice_q15.c 17KB

arm_lms_f32.c 16KB

arm_lms_norm_f32.c 16KB

stm32f0xx_hal.c 16KB

arm_fir_sparse_f32.c 15KB

arm_mat_mult_q15.c 15KB

arm_fir_interpolate_q15.c 15KB

arm_fir_sparse_q7.c 15KB

arm_fir_sparse_q15.c 15KB

arm_conv_fast_opt_q15.c 15KB

arm_fir_interpolate_q31.c 15KB

main.c 14KB

arm_conv_opt_q15.c 14KB

arm_iir_lattice_f32.c 14KB

共 532 条

___________________________________

ݣะ

DS3231

กّ֑ӊĂݽڪ

෯෫෫ት

(RTC)

ǈ঱ᅘࣅ֑

وུԣ໛ስظಹ

(TCXO)

ࠧ໛ăݡಹҪࠆ٫֠พ൩

ڭǈڱ৚ኙ٫ᆚ෫൒৹ү֞വوࣜ෫ăࣅ֑໛ስظ

ಹ໗ݽષಹوլಜവڪǈԌඵષූդ࿯وᆐื

ફă

DS3231

໗ޥඨᅋ࣌ࠧޠჟུ࣌ڪ۶ཙǈԳᅋ

ᄧĂ

300mil

ܢኰă

RTC

ү֞ஓĂܖĂ෫ĂဵಜĂ൓ಜĂᆨࠧ௰ဳྲăඵᅢ

໢وᆨܝǈዔڑٻሿᆨய൓ಜǈҪ൰௰ԣխă෫

ትوޠዷޏ෷৹ჾก

ဏ෫ࢪ؞

AM/PM

ቚ෸و

ဏ෫

ޏ෷ă໗ޥ઩ޔ৹Ӭ֔൓ઈ௜ትࠧქଁ৹Ӭ֔۽Ԓพ־ă

ٜ቙ᅳืয໼߹

ใဂዜ࿯הှבพă

஄وĂ߹ུڪԣխو٫ႅࢱኼࠧӔಹᅋࣶญ

ኴຢǈჾՌ٫ᆚ߆ሓĂ໗ޥݒ཭พ־ǈԌᇀӤე෫ዔ

ڑ೰ࡳفӄᅋ٫ᆚă૙༶ǈ

RST

ࣶญᄧ৹ჾዷཛྷฐڑѢ

ఉพ൩ǈჾդූ༶ԩݒ཭ဳࠟă

___________________________________

ᄮᅋ

ܾྣಹ ٫ӹ

ᆜ֔ဳྲ׌࿅༇

GPS

___________________________________

໎၂

♦ 0°C

ባ

+40°C

۶ཙ௠෫ትڪཛྷ

±2ppm

♦ -40°C

ባ

+85°C

۶ཙ௠෫ትڪཛྷ

±3.5ppm

♦

ཛྷઘၦࣜ෫໗ޥӄᅋ٫֠พ൩

♦

ޠዷུڪ۶ཙ

ඨᅋ࣌ǖ

0°C

ባ

+70°C

ޠჟ࣌ǖ

-40°C

ባ

+85°C

♦

ّޢࠞ

♦

෯෫෫ት໗ޥஓĂܖĂ෫ĂဵಜĂ൓ಜĂᆨĂ

௰ဳྲǈԌ໗ޥᅘပಜف

2100

௰و൰௰ԣխ

♦

઩ޔ൓ઈ௜ት

♦

৹Ӭ֔۽Ԓพ־

♦

๱

(400kHz) I



♦ 3.3V

ޠዷ٫ႅ

♦

ืዖུڪבݮಹพ־ǖڪཛྷ

±3°C

♦

ࡧ၌ቁࣚ،ಹ

♦ RST

พ־0ฐڑݒ཭ണژพ൩

♦

໼߹ү࿥ඨฎႵࢲ޵

(UL)

്ቆ

DS3231

ݽڪĂ

Ăࣅ֑

RTC/TCXO/

໛

______________________________________________ Maxim Integrated Products 1

Rev 4; 10/06

______________________________

ڊ޶ဳྲ

PART TEMP RANGE PIN-PACKAGE

TOP

MARK

DS3231S 0°C to +70°C 16 SO DS3231

DS3231SN -40°C to +85°C 16 SO DS3231N

DS3231S# 0°C to +70°C 16 SO DS3231S

DS3231SN# -40°C to +85°C 16 SO DS3231SN

ᄧైብᇀืযዊ઻وዮࡍޖ־ă

DS3231

SCL

= t

INT/SQW

32kHz

BAT

PUSHBUTTON

RESET

SDA

RST

N.C.

GND

CPU

N.C.

____________________________________________________________________

٨ျޠዷ٫ଁ

۾ᆪဵNbyjnᑵါ፞ᆪᓾ೯ࡼፉᆪǈNbyjnݙ࣪ፉᒦࡀᏴࡼތፊ૞ᎅࠥޘညࡼࡇᇙঌᐊă༿ᓖፀፉᆪᒦభถࡀᏴᆪᔊᔝᒅ૞

ፉࡇᇙǈྙኊཀྵཱྀྀࠤᎫࡼᓰཀྵቶǈ༿ݬఠ Nbyjnᄋ৙ࡼ፞ᆪۈᓾ೯ă

Ⴣན඾ዹອᔢቤۈࡼၫ௣ᓾ೯ǈ༿ᆰ Nbyjn ࡼᓍ጑ǖxxx/nbyjn.jd/dpn/doă

ӹ෸ܻࠩ

RoHS

ಹӶኼǈدᅘ৹௢ࠆೆǈᄽᅘ

RoHS

ߢڊوࢥ

ஊദăԳᅋ

JESD97 e3

ᄧ఻ߞ࣒ฯǈܻࠩࠆೆࢪྐೆࠒૣ

֔وეഓăڇӶණൌࠨ཭ብوĐ

đࠟোӹ෸ܻࠩ

RoHS

Ӷኼă

DS3231

ݽڪĂ

Ăࣅ֑

RTC/TCXO/

໛

2 _____________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED DC OPERATING CONDITIONS

= T

MIN

to T

MAX

, unless otherwise noted.) (Notes 1, 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Voltage Range on V

, V

BAT

, 32kHz, SCL, SDA, RST,

INT/SQW Relative to Ground.............................-0.3V to +6.0V

Operating Temperature Range

(noncondensing) .............................................-40°C to +85°C

Junction Temperature......................................................+125°C

Storage Temperature Range ...............................-40°C to +85°C

Lead Temperature

(Soldering, 10s).....................................................+260°C/10s

Soldering Temperature....................................See the Handling,

PC Board Layout, and Assembly section.

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

2.3 3.3 5.5 V

Supply Voltage

BAT

2.3 3.0 5.5 V

Logic 1 Input SDA, SCL V

0.7 x

0.3

Logic 0 Input SDA, SCL V

-0.3

+0.3 x

Pullup Voltage

(SDA, SCL, 32kHz, INT/SQW)

= 0V 5.5V V

ELECTRICAL CHARACTERISTICS

= 2.3V to 5.5V, V

= Active Supply (see Table 1), T

= T

MIN

to T

MAX

, unless otherwise noted.) (Typical values are at V

3.3V, V

BAT

= 3.0V, and T

= +25°C, unless otherwise noted.) (Notes 1, 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

= 3.63V 200

Active Supply Current I

CCA

(Notes 3, 4)

= 5.5V 300

μA

= 3.63V 110

Standby Supply Current I

CCS

C bus inactive, 32kHz

output on, SQW output off

(Note 4)

= 5.5V 170

μA

= 3.63V 575

Temperature Conversion Current I

CCSCONV

C bus inactive, 32kHz

output on, SQW output off

= 5.5V 650

μA

Power-Fail Voltage V

2.45 2.575 2.70 V

Logic 0 Output, 32kHz, INT/SQW,

SDA

= 3mA

0.4

Logic 0 Output, RST

= 1mA

0.4

Output Leakage Current 32kHz,

INT/SQW, SDA

Output high impedance

-1

+1 μA

Input Leakage SCL

-1

+1 μA

RST Pin I/O Leakage

RST high impedance (Note 5)

-200

+10

μA

BAT

Leakage Current

Active)

BATLKG

100

DS3231

ݽڪĂ

Ăࣅ֑

RTC/TCXO/

໛

_____________________________________________________________________ 3

ELECTRICAL CHARACTERISTICS (continued)

= 2.3V to 5.5V, V

= Active Supply (see Table 1), T

= T

MIN

to T

MAX

, unless otherwise noted.) (Typical values are at V

3.3V, V

BAT

= 3.0V, and T

= +25°C, unless otherwise noted.) (Notes 1, 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Output Frequency

OUT

= 3.3V or V

BAT

= 3.3V

32.768

kHz

0°C to +40°C

±2

Frequency Stability vs.

Temperature (Commercial)

Δf/f

OUT

= 3.3V or

BAT

= 3.3V,

aging offset = 00h

>40°C to +70°C

±3.5

ppm

-40°C to <0°C

±3.5

0°C to +40°C

±2

Frequency Stability vs.

Temperature (Industrial)

Δf/f

OUT

= 3.3V or

BAT

= 3.3V,

aging offset = 00h

>40°C to +85°C

±3.5

ppm

Frequency Stability vs. Voltage

Δf/V

ppm/V

-40°C

0.7

+25°C

0.1

+70°C

0.4

Trim Register Frequency

Sensitivity per LSB

Δf/LSB

Specified at:

+85°C

0.8

ppm

Temperature Accuracy Temp V

= 3.3V or V

BAT

= 3.3V -3 +3 °C

First year ±1.0

Crystal Aging Δf/f

After reflow,

not production tested

0–10 years ±5.0

ppm

ELECTRICAL CHARACTERISTICS

= 0V, V

BAT

= 2.3V to 5.5V, T

= T

MIN

to T

MAX

, unless otherw.ise noted.) (Note 1)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

BAT

= 3.63V 70

Active Battery Current I

BATA

EOSC = 0, BBSQW = 0,

SCL = 400kHz (Note 4)

BAT

= 5.5V 150

μA

BAT

= 3.63V 0.84 3.0

Timekeeping Battery Current I

BATT

EOSC = 0, BBSQW = 0,

EN32kHz = 1,

SCL = SDA = 0V or

SCL = SDA = V

BAT

(Note 4)

BAT

= 5.5V 1.0 3.5

μA

BAT

= 3.63V 575

Temperature Conversion Current I

BATTC

EOSC = 0, BBSQW = 0,

SCL = SDA = 0V or

SCL = SDA = V

BAT

= 5.5V 650

μA

Data-Retention Current I

BATTDR

EOSC = 1, SCL = SDA = 0V, +25°C 100 nA

DS3231

ݽڪĂ

Ăࣅ֑

RTC/TCXO/

໛

4 _____________________________________________________________________

AC ELECTRICAL CHARACTERISTICS

= V

CC(MIN)

to V

CC(MAX)

or V

BAT

= V

BAT(MIN)

to V

BAT(MAX)

, V

BAT

> V

, T

= T

MIN

to T

MAX

, unless otherwise noted.) (Note 1)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Fast mode 100 400

SCL Clock Frequency f

SCL

Standard mode 0 100

kHz

Fast mode 1.3

Bus Free Time Between STOP

and START Conditions

BUF

Standard mode 4.7

μs

Fast mode 0.6

Hold Time (Repeated) START

Condition (Note 6)

HD:STA

Standard mode 4.0

μs

Fast mode 1.3

Low Period of SCL Clock t

LOW

Standard mode 4.7

μs

Fast mode 0.6

High Period of SCL Clock t

HIGH

Standard mode 4.0

μs

Fast mode 0 0.9

Data Hold Time (Notes 7, 8) t

HD:DAT

Standard mode 0 0.9

μs

Fast mode 100

Data Setup Time (Note 9) t

SU:DAT

Standard mode 250

Fast mode 0.6

Start Setup Time t

SU:STA

Standard mode 4.7

μs

Fast mode 300

Rise Time of Both SDA and SCL

Signals (Note 10)

Standard mode

20 +

0.1C

B 1000

Fast mode 300

Fall Time of Both SDA and SCL

Signals (Note 10)

Standard mode

20 +

0.1C

B 300

Fast mode 0.6

Setup Time for STOP Condition t

SU:STO

Standard mode 4.7

μs

Capacitive Load for Each Bus

Line (Note 10)

400 pF

Capacitance for SDA, SCL C

I/O

10 pF

Pulse Width of Spikes That Must

Be Suppressed by the Input Filter

30 ns

Pushbutton Debounce PB

250 ms

Reset Active Time t

RST

250 ms

Oscillator Stop Flag (OSF) Delay t

OSF

(Note 11) 100 ms

Temperature Conversion Time t

CONV

125 200 ms

POWER-SWITCH CHARACTERISTICS

= T

MIN

to T

MAX

)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Fall Time; V

PF(MAX)

PF(MIN)

VCCF

300 μs

Rise Time; V

PF(MIN)

PF(MAX)

VCCR

0μs

Recovery at Power-Up t

REC

(Note 12) 250 300 ms

DS3231

ݽڪĂ

Ăࣅ֑

RTC/TCXO/

໛

_____________________________________________________________________ 5

___________________________________________________________________

Ѣఉݒ཭෫ၠ

RST

___________________________________________________________________

٫ᆚ৚ߔ෫ၠ

VCCF

VCCR

REC

PF(MAX)

PF(MIN)

RST

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