Genesys Logic, Inc.
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SD Specifications
Part 1
Physical Layer Specification
Version 3.00
April 16, 2009
SD Group
Panasonic Corporation
SanDisk Corporation
Toshiba Corporation
Technical Committee
SD Card Association
Genesys Logic, Inc.
Downloaded by Sharon Huang Genesys Logic, Inc. on 04/28/2009
©Copyright 2001-2009 SD Group (Panasonic, SanDisk, Toshiba) and SD Card Association
Physical Layer Specification Version 3.00
Confidential
i
Revision History
Date Version Changes compared to previous issue
March 22, 2000 1.0 Base version (Draft only)
April 15, 2001 1.01 Initial release version
October 15, 2004 1.10 - Version 1.01 + supplementary notes Version 1.01e(March 21, 2004)
- CMD6 (Switch Function command) is specified and CMD34-37, 50
and 57 are reserved for new command system.
- High-Speed mode is specified.(Up to 25 MB/sec Read/Write rate)
- eCommerce command set and Vendor Specific command set are
specified
May 9, 2006 2.00 - Version 1.10 + supplementary notes Version 1.00.
- High Capacity SD Memory Card is specified. (Up to and including 32
GB)
April 16, 2009 3.00 Followings are added to the Version 2.00
(1) Physical Ver2.00 Supplementary Notes Version 1.00 is applied.
(2) Extended Capacity (SDXC) is supported
(3) Ultra High Speed I (UHS-I) is supported
(4) Speed Class Specification Update
(5) Set Block Count Command (CMD23) is added
To the extent this proposed specification, which is being submitted for review under the IP
Policy, implements, incorporates by reference or refers to any portion of versions 1.0 or 1.01
of the SD Specifications (including Parts 1 through 4), adoption of the proposed specification
shall require Members utilizing the adopted specification to obtain the appropriate licenses
from the SD-3C, LLC, as required for the utilization of those portion(s) of versions 1.0 or 1.01
of the SD Specifications.
For example, implementation of the SD Specifications in a host device under versions 1.0 or
1.01 and under the adopted specification requires the execution of a SD Host Ancillary
License Agreement with the SD-3C, LLC; and implementation of the SD Specifications under
versions 1.0 or 1.01 and under the proposed specification in a SD Card containing any
memory storage capability (other than for storage of executable code for a controller or
microprocessor within the SD Card) requires the execution of a SD Memory Card License
Agreement with the SD-3C, LLC.
Genesys Logic, Inc.
Downloaded by Sharon Huang Genesys Logic, Inc. on 04/28/2009
©Copyright 2001-2009 SD Group (Panasonic, SanDisk, Toshiba) and SD Card Association
Physical Layer Specification Version 3.00
Confidential ii
Conditions for publication
Publisher:
SD Card Association
2400 Camino Ramon, Suite 375
San Ramon, CA 94583 USA
Telephone: +1 (925) 275-6615,
Fax: +1 (925) 886-4870
E-mail: office@sdcard.org
Copyright Holders:
The SD Group
Panasonic Corporation
SanDisk Corporation
Toshiba Corporation
The SD Card Association
Notes:
The copyright of the previous versions (Version 1.00 and 1.01) and all corrections or non-material
changes thereto are owned by SD Group.
The copyright of material changes to the previous versions (Version 1.01) are owned by SD Card
Association.
Confidentiality:
The contents of this document are deemed confidential information of the SD-3C LLC and/or the SD
Card Association (the "Disclosers"). As such, the contents and your right to use the contents are
subject to the confidentiality obligations stated in the written agreement you entered into with the
Disclosers which entitled you to receive this document, such as a Non-Disclosure Agreement, the
License Agreement for SDA Memory Card Specifications (also known as "LAMS"), the SD
Host/Ancillary Product License Agreement (also known as "HALA") or the IP Policy.
Disclaimers:
The information contained herein is presented only as a standard specification for SD Card and SD
Host/Ancillary products. No responsibility is assumed by SD Card Association for any damages, any
infringements of patents or other right of the third parties, which may result from its use. No license is
granted by implication or otherwise under any patent or rights of SD Group and SD Card Association or
others.
Genesys Logic, Inc.
Downloaded by Sharon Huang Genesys Logic, Inc. on 04/28/2009
©Copyright 2001-2009 SD Group (Panasonic, SanDisk, Toshiba) and SD Card Association
Physical Layer Specification Version 3.00
Confidential iii
Conventions Used in This Document
Naming Conventions
• Some terms are capitalized to distinguish their definition from their common English meaning. Words
not capitalized have their common English meaning.
Numbers and Number Bases
• Hexadecimal numbers are written with a lower case "h" suffix, e.g., FFFFh and 80h.
• Binary numbers are written with a lower case "b" suffix (e.g., 10b).
• Binary numbers larger than four digits are written with a space dividing each group of four digits, as in
1000 0101 0010b.
• All other numbers are decimal.
Key Words
• May: Indicates flexibility of choice with no implied recommendation or requirement.
• Shall: Indicates a mandatory requirement. Designers shall implement such mandatory
requirements to ensure interchangeability and to claim conformance with the specification.
• Should: Indicates a strong recommendation but not a mandatory requirement. Designers should
give strong consideration to such recommendations, but there is still a choice in
implementation.
Application Notes
Some sections of this document provide guidance to the host implementers as follows:
Application Note:
This is an example of an application note.
Genesys Logic, Inc.
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©Copyright 2001-2009 SD Group (Panasonic, SanDisk, Toshiba) and SD Card Association
Physical Layer Specification Version 3.00
Confidential iv
Table of Contents
1. General Description............................................................................................................1
2. System Features .................................................................................................................3
3. SD Memory Card System Concept....................................................................................5
3.1 Read-Write Property......................................................................................................................5
3.2 Supply Voltage...............................................................................................................................5
3.3 Card Capacity................................................................................................................................6
3.4 Speed Class ..................................................................................................................................7
3.5 Bus Topology .................................................................................................................................8
3.5.1 SD Bus ....................................................................................................................................8
3.5.2 SPI Bus ...................................................................................................................................9
3.6 Bus Protocol ................................................................................................................................10
3.6.1 SD Bus ..................................................................................................................................10
3.6.2 SPI Bus .................................................................................................................................13
3.7 SD Memory Card–Pins and Registers.........................................................................................14
3.8 ROM Card ...................................................................................................................................16
3.8.1 Register Setting Requirements .............................................................................................16
3.8.2 Unsupported Commands ......................................................................................................16
3.8.3 Optional Commands .............................................................................................................16
3.8.4 WP Switch.............................................................................................................................16
3.9 Ultra High Speed Phase I (UHS-I) Card ......................................................................................17
3.9.1 UHS-I Operation Modes........................................................................................................17
3.9.2 UHS-I Card Types .................................................................................................................17
3.9.3 Host and Card Combination..................................................................................................18
3.9.4 Bus Speed Modes Selection Sequence ................................................................................19
3.9.5 UHS System Block Diagram .................................................................................................20
3.9.5.1 Variable Sampling Host......................................................................................................... 20
3.9.5.2 Fixed Sampling Host............................................................................................................. 20
3.9.6 Summary of Bus Speed Mode ..............................................................................................21
4. SD Memory Card Functional Description .......................................................................22
4.1 General........................................................................................................................................22
4.2 Card Identification Mode..............................................................................................................23
4.2.1 Card Reset ............................................................................................................................23
4.2.2 Operating Condition Validation..............................................................................................23
4.2.3 Card Initialization and Identification Process ........................................................................25
4.2.3.1 Initialization Command (ACMD41)........................................................................................ 27
4.2.4 Bus Signal Voltage Switch Sequence ...................................................................................28
4.2.4.1 Initialization Sequence for UHS-I .......................................................................................... 28
4.2.4.2 Timing to Switch Signal Voltage............................................................................................ 29
4.2.4.3 Timing of Voltage Switch Error Detection.............................................................................. 30
4.2.4.4 Voltage Switch Command..................................................................................................... 30
4.2.4.5 Tuning Command ................................................................................................................. 31
4.2.4.6 An Example of UHS-I System Block Diagram....................................................................... 33
4.3 Data Transfer Mode.....................................................................................................................34
