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EC芯片WPC8763L的datasheet
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EC芯片WPC8763L的datasheet,WPC8763L Notebook Embedded Controller with SPI Flash Interface
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WPC8763L Notebook Embedded Controller with SPI
TM
Flash Interface
© 2007 Winbond Electronics Corporation www.winbond.com
March 2007
Revision 1.0
WPC8763L Notebook Embedded Controller with SPI
TM
Flash Interface
General Description
The Winbond WPC8763L is a highly integrated embedded
controller (EC) with an embedded RISC core and integrated
advanced functions. It is targeted for a wide range of porta-
ble applications.
The WPC8763L incorporates the CompactRISC
®
CR16CPlus
core (a high-performance 16-bit RISC processor), on-chip
ROM and RAM memories, system support functions and a
Flash Interface Unit (FIU) that interfaces directly with exter-
nal SPI flash memory devices.
System support functions include: watchdog, PWM, timers,
interrupt control, General-Purpose I/O (GPIO) with internal
keyboard matrix scanning, PS/2
®
interface, SMBus
®
inter-
face, UART, high-accuracy analog-to-digital (ADC) and dig-
ital-to-analog (DAC) converters for battery charging, system
control, system health monitoring and analog controls.
The WPC8763L interfaces with the host via an LPC inter-
face.
The WPC8763L is PC01 and ACPI compliant, and offers a
single-chip solution for the most commonly used notebook
PC I/O peripherals.
Outstanding Features
■ Shared BIOS flash memory
■ Support for SPI flash memories
■ Flash page programing support
■ High-accuracy, high-speed ADC
■ Up to 88 GPIO ports (including keyboard scanning)
with a variety of wake-up events
■ 16-bit RISC core, with up to 4 Mbytes of external ad-
dress space, running at up to 25 MHz
■ 128-pin LQFP package
Charger
A/D and D/A
D/A
Brightness
Contrast
South Bridge
Keyboard Matrix
Keyboard
Touch Pad
Mouse
Shared Flash
3 x Fan
PWM
Tacho
12 x 8 - 18 x 8
JTAG
Switch Pad
and LEDs
SPI
WPC8763L
Main
V
DD
Standby
V
CC
System Block Diagram
Analog
V
CC
2x SMBus
3 x PS2
Battery
Panel
Winbond Confidential - Provided to Wistron under NDA
www.winbond.com 2 Revision 1.0
WPC8763L
Features
Embedded Controller Features
■ Processing Unit
— CompactRISC CR16CPlus 16-bit embedded RISC
processor core (the “core”)
— Up to 4 Mbytes of external address space
■ Internal Memory
— 1 Kbyte of ROM
— 4 Kbytes of on-chip RAM
— All memory types can hold both code and data
■ Flash Interface Unit (FIU)
— Up to 4 Mbytes of code and data
— Hardware-protected boot zone block protection
— SPI External Memory
❏ Up to 32 Mbits
❏ Fast Read mode
❏ Page programing support
❏ Configurable clock rate
— Field upgradeable
■ Shared Memory Controller (SHM)
— Supports BIOS (flash) memory sharing with PC host
— Supports host-controlled code download and update
— Memory access protection
LPC System Interface
■ Based on Intel’s LPC Interface Specification Revision
1.1, August 2002
■ I/O, Memory and 8-bit Firmware Memory read and write
cycles, Firmware Memory writes may insert wait cycles
■ Bootable Memory Support
■ Base Address (BADDR1-0) straps to determine the
base address of the index-data register pair
— Alternate base address configurable by the core
■ LPCPD
and CLKRUN support
Embedded Controller System Features
■ Host Interface
— Comprises host interface channels, typically used
for KBC and ACPI Private or Shared EC channels
— 8042 KBC-standard interface (legacy 60h, 64h)
— Two PM interface ports (legacy 62h, 66h; 68h, 6Ch)
— ACPI EC with either Shared or Private interface
through the PM interface
— Two Mailbox areas for host-core communication, up
to 4 Kbytes each; maximum 4 Kbytes total
— Generates IRQ, SMI and SCI
— Provides IRQ1 and IRQ12 support
— Provides Fast Gate A20 and Fast Host reset via firmware
■ Interrupt Control Unit (ICU)
— 31 maskable vectored interrupts (of which eight are
external)
— General-purpose external interrupt inputs through
MIWU
— Enable and pending indication for each interrupt
— Non-maskable interrupt input
■ Multi-Input Wake-Up (MIWU)
— Up to 40 wake-up or interrupt inputs
— Generates wake-up event to PMC (Power Manage-
ment Controller)
— Generates interrupts to ICU
— User-selectable trigger conditions
■ Internal Keyboard Matrix Scanning
— Up to 18 open-collector outputs (at least 12)
— Eight Schmitt inputs with internal pull-ups
■ General-Purpose I/O (GPIO) Ports
— 64 port pins
— I/O pins individually configured as input or output
— Configurable internal pull-up / pull-down resistors
— Outputs individually configured as push-pull or
open-drain
— Two echo inputs with wake-enabled interrupts
— Additional 12 GPIOs with wake-enabled interrupts
— Four GPIOs capable of 12 mA sink current
— Seven GPIOs are accessible to the host
— Optional low-cost external GPIO expansion through
the SensorPath interface
■ PS/2 Interface
— Three external ports: can be used for keyboard,
mouse and an additional pointing device
— Byte-level handling via hardware accelerator
■ Two SMBus (SMB) Interface Modules; each module:
— Is Intel SMBus, Philips I
2
C
®
and ACCESS.bus
compatible
— Is SMBus master and slave
— Supports up to two simultaneous slave addresses
— Supports polling- and interrupt-controlled operations
— Generates a wake-up signal on detection of a Start
condition while in Idle mode
— Supports an optional internal pull-up on SDA and
SCL pins
■ Core Universal Asynchronous Receiver-Transmitter
(CR_UART) Module
— A full-duplex UART channel
— Programmable baud rate
— Data transfer via interrupt or polling
■ Two 16-bit Multi-Function Timer (MFT16) Modules;
each module has:
— Two 16-bit timers with a 5-bit prescaler
— Pulse Width Modulation (PWM), Capture and
Timer/Counter modes
— Capture inputs with programmable edge detection
— An interrupt on compare match
Winbond Confidential - Provided to Wistron under NDA
Revision 1.0 3 www.winbond.com
WPC8763L
Features (Continued)
■ Two Pulse Width Modulation (PWM) Modules
— Group A_PWM: two outputs
— Group B_PWM: one output
■ Timer and Watchdog (TWD)
— 16-bit periodic interrupt timer with 30 µs resolution
and 5-bit prescaler for system tick and periodic
wake-up tasks
— 8-bit watchdog timer with enable/disable
— “Watchdog occurred” flag
— Two watchdog reset options: warm or cold
■ SensorPath
™
Bus Interface
— Single Wire bus master
— Supports up to seven slave devices
— x1, x4 SensorPath clock rate support
■ Analog-to-Digital Converter (ADC)
— Four channels, with 8-bit resolution
— 125 µs conversion time
— External voltage reference
■ Digital-to-Analog Converter (DAC)
— Two channels, 8-bit resolution
— 1 µs conversion time for 50 pF load
— Full output range from AGND to AVCC
■ Development Support
— Interface to debugger via Nexus 5001 interface
❏ Physical connection using JTAG
❏ On-board Debug mode with eight hardware
breakpoints
❏ Embedded memory programing via JTAG with
content read protection
■ Core Access to Host Modules
— Enabled via lock mechanism
Host Function Features
■ Mobile System Wake-Up Control (MSWC)
— Software-controlled off events
— Event routing to IRQ, SMI
or PWUREQ
■ Supports Microsoft
®
Advanced Power Management
(APM) Specifications Revision 1.2, February 1996
— Generates the System Management Interrupt (SMI)
■ PC01 Rev 1.0 and ACPI 3.0 Compliant
— PnP configuration register structure
— Flexible resource allocation for all logical devices
❏ Relocatable base address
❏ 15 IRQ routing options
Clocking, Supply and Package Information
■ Strap Input-Controlled Operating Modes:
— Shared BIOS memory mode
— TRI-STATE
®
mode
— Development mode
■ Clocks
— Single 32.768 KHz crystal oscillator
— On-chip high-frequency clock generator
— Either 32.768 KHz or CR16CPlus clock out
■ Testability
— XOR-tree structure includes all device pins (except
supply, A/D, D/A, and crystal oscillator pins), select-
ed at power-up by strap inputs
— TRI-STATE device pins, selected at power-up by
strap input (TRIS
)
■ Power Supply
— 3.3V supply operation
— 5V tolerance and back-drive protection on all pins
(except crystal oscillator, A/D, D/A, LPC bus, and
SPI flash pins)
— Separate supply for host I/F (V
DD
) and EC functions
(V
CC
)
— Reduced power consumption capability
— Software- or hardware-switched power modes:
❏ Active mode
❏ Active mode executing WAIT
❏ Idle
❏ Deep Idle
— Automatic wake-up on system events
■ Package Options
— 128-pin LQFP package
Winbond Confidential - Provided to Wistron under NDA
www.winbond.com 4 Revision 1.0
WPC8763L
Datasheet Revision Record
Revision Date Status Comments
October 4, 2006
Revision 0.96 First Preliminary Datasheet.
March 12, 2007
Revision 1.0 Datasheet revision. List of changes:
1. In cover page and Features:
1.1 Changed the order of the Host Function Features.
2. In Detailed Signal/Pin Descriptions, PS/2 Interface, added clarification on quasi-bi-
directional buffers.
3. In Decoupling and Filter Capacitors, changed the 10-47
µ
F capacitors to tantalum/ceramic.
4. In SPI Flash Interface, UMA section, added clarification on byte order in UMA Ex-
tended Write transactions.
5. In MIWU, Input Assignments table:
5.1 Improved readability of footnote #3.
5.2 Added footnote #4 to LRESET
Active Wake-Up source
March 12, 2007
(cont.)
Revision 1.0
(cont.)
Datasheet revision. List of changes (cont.):
6. In PWM Block Diagram, reversed the “R” and “S” inputs of the flip-flops.
7. In SPI, Features, changed the data clock rate to 10 MHz.
8. In PM Channels:
8.1 In Enhanced PM Mode, IRQ, ECSCI
and SMI Control figure, changed the signal
names related to the SMI
output.
8.2 To the description of SCIPOL bit (HIPMnCTL register) and SMIPOL bit (HIPMnIC
register), added recommendation to use active low polarity setting.
9. In MSWC Core registers, MSWCTL1 register, added clarification to LPCRSTA bit.
10. In Booter Data, Header Contents table, updated footnote #2.
11. In Power Supply Current Consumption... updated the I
DD
, I
DDLP
, I
CC
and I
CCW
parameters.
12. In DC Characteristics of Pins:
12.1Added Leakage Current section.
12.2In Notes and Exceptions, updated item #1 and removed items #4 and #5 (they
are replaced by the new Leakage Current section).
13. In Internal Resistors, changed the Min. Max. values for the R
PU80
and R
PD80
parameters.
14. In DAC Characteristics:
14.1Changed the values of output resistance (R
S
).
15. In AC Test Conditions, added C
L
= 15 pF for CLKOUT.
16. In PS/2 Interface Timing, changed the “guaranteed by” for t
PSCLKL
and t
PSCLKH
.
Winbond Confidential - Provided to Wistron under NDA
Revision 1.0 5 www.winbond.com
WPC8763L
Table of Contents
Features.............................................................................................................................................................. 2
Datasheet Revision Record ............................................................................................................................... 4
1.0
Introduction
1.1 GENERAL DESCRIPTION ........................................................................................................ 18
1.1.1 System Connections .................................................................................................... 18
1.1.2 Power Management .................................................................................................... 18
1.2 INTERNAL ARCHITECTURE .................................................................................................... 18
1.3 OPERATING ENVIRONMENTS ................................................................................................ 19
1.3.1 IRE Environment ......................................................................................................... 19
1.3.2 OBD Environment ........................................................................................................ 19
1.4 MEMORY MAP .......................................................................................................................... 19
1.4.1 Core Address Domain Memory Map ........................................................................... 19
1.4.2 Host Address Domain Memory Map ............................................................................ 20
1.4.3 Core Access to Host Modules ..................................................................................... 20
2.0
Signal/Pin Description and Configuration
2.1 CONNECTION DIAGRAM ......................................................................................................... 22
2.2 BUFFER TYPES ........................................................................................................................ 23
2.3 PIN MULTIPLEXING ................................................................................................................. 23
2.4 DETAILED SIGNAL/PIN DESCRIPTIONS ................................................................................ 25
2.4.1 Host Interface .............................................................................................................. 25
2.4.2 SPI Flash Interface ...................................................................................................... 26
2.4.3 Internal Keyboard Scan ............................................................................................... 26
2.4.4 General-Purpose I/O (GPIO) ....................................................................................... 27
2.4.5 Host General-Purpose I/O (HGPIO) ............................................................................ 28
2.4.6 Analog Interface ..........................................................................................................28
2.4.7 PS/2 Interface .............................................................................................................. 28
2.4.8 SMBus Interface .......................................................................................................... 29
2.4.9 Timers and PWM ......................................................................................................... 29
2.4.10 SensorPath Interface ................................................................................................... 29
2.4.11 CR_UART .................................................................................................................... 29
2.4.12 JTAG ........................................................................................................................... 29
2.4.13 Miscellaneous .............................................................................................................. 30
2.4.14 Clocks .......................................................................................................................... 30
2.4.15 Strap Configuration and Testing .................................................................................. 30
2.4.16 Power and Ground ...................................................................................................... 31
2.5 INTERNAL PULL-UP AND PULL-DOWN RESISTORS ............................................................ 32
2.5.1 Internal Keyboard Scan ............................................................................................... 32
2.5.2 General-Purpose I/O (GPIO) ....................................................................................... 32
2.5.3 Host General-Purpose I/O (HGPIO) ............................................................................ 33
2.5.4 PS/2 Interface .............................................................................................................. 33
2.5.5 SMBus Interface .......................................................................................................... 33
2.5.6 Timers .......................................................................................................................... 34
2.5.7 SensorPath Interface ................................................................................................... 34
Winbond Confidential - Provided to Wistron under NDA
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