MCIMX31，飞思卡尔的arm11的datasheet，很难找的东西
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© Freescale Semiconductor, Inc., 2005–2008. All rights reserved.
Freescale Semiconductor
Data Sheet: Technical Data
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Document Number: MCIMX31
Rev. 4, 06/2008
MCIMX31 and
MCIMX31L
Package Information
Plastic Package
Case 1581 14 x 14 mm, 0.5 mm Pitch
Case 1931 19 x 19 mm, 0.8 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
1 Introduction
The MCIMX31 and MCIMX31L multimedia
applications processors represent the next step in
low-power, high-performance application processors.
Unless otherwise specified, the material in this data sheet
is applicable to both the MCIMX31 and MCIMX31L
processors and referred to singularly throughout this
document as MCIMX31. The MCIMX31L does not
include a graphics processing unit (GPU).
Based on an ARM11™ microprocessor core, the
MCIMX31 provides the performance with low power
consumption required by modern digital devices such
as:
• Feature-rich cellular phones
• Portable media players and mobile gaming
machines
• Personal digital assistants (PDAs) and Wireless PDAs
• Portable DVD players
• Digital cameras
The MCIMX31 takes advantage of the ARM1136JF-S™
core running at up to 532 MHz, and is optimized for
MCIMX31 and
MCIMX31L
Multimedia Applications
Processors
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Functional Description and Application Information . . . . . 4
2.1 ARM11 Microprocessor Core . . . . . . . . . . . . . . . . . 4
2.2 Module Inventory. . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 10
4.2 Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.3 Module-Level Electrical Specifications . . . . . . . . . 21
5 Package Information and Pinout . . . . . . . . . . . . . . . . . . 104
5.1 MAPBGA Production Package—457 14 x 14 mm,
0.5 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
5.2 MAPBGA Production Package—473 19 x 19 mm,
0.8 mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
5.3 Ball Maps. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
6 Product Differences. . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
7 Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . 119
8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
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