USB 3.0规范(Universal Serial Bus 3.0 Specification)

由Intel、微软、惠普、德州仪器、NEC、ST-NXP等业界巨头组成的USB 3.0 Promoter Group负责制定的新一代USB 3.0标准已经正式完成并公开发布。新规范提供了十倍于USB 2.0的传输速度和更高的节能效率，可广泛用于PC外围设备和消费电子产品。

inter chip usb Use in SIM card interface

inter chip usb Use in SIM card interface

wireless usb WUSBSpec

wireless usb WUSBSpec

USB 2.0 on the go spec

USB 2.0 on the go spec

Inter-Chip USB Supplement to the USB 2.0 Specification_1.0.

Inter-Chip USB Supplement to the USB 2.0 Specification_1.0.

high speed inter chip USB2.0 SPEC

high speed inter chip USB2.0 SPEC