cadence元件封装总结
关于cadence中自建封装的个人总结,详细论述了焊盘的大小计算规则,assembly,placebound,silkscreen的区域安排规则。对于初涉cadence进行硬件设计的朋友将会帮助很大!
关于cadence中自建封装的个人总结,详细论述了焊盘的大小计算规则,assembly,placebound,silkscreen的区域安排规则。对于初涉cadence进行硬件设计的朋友将会帮助很大!
有关并行处理结构很不错的一本书 Chapter 1 Fundamentals of Computer Design 1.1 Introduction 2 1.2 Classes of Computers 4 1.3 Defining Computer Architecture 8 1.4 Trends in Technology 14 1.5 Trends in Power in Integrated Circuits 17 1.6 Trends in Cost 19 1.7 Dependability 25 1.8 Measuring, Reporting, and Summarizing Performance 28 1.9 Quantitative Principles of Computer Design 37 1.10 Putting It All Together: Performance and Price-Performance 44 1.11 Fallacies and Pitfalls 48 1.12 Concluding Remarks 52 1.13 Historical Perspectives and References 54 Case Studies with Exercises by Diana Franklin 55 Chapter 2 Instruction-Level Parallelism and Its Exploitation 2.1 Instruction-Level Parallelism: Concepts and Challenges 66 2.2 Basic Compiler Techniques for Exposing ILP 74 2.3 Reducing Branch Costs with Prediction 80 2.4 Overcoming Data Hazards with Dynamic Scheduling 89 2.5 Dynamic Scheduling: Examples and the Algorithm 97 2.6 Hardware-Based Speculation 104 2.7 Exploiting ILP Using Multiple Issue and Static Scheduling 114 。。。。。。。。 。。。。。。。。。