单片机驱动ST7522实测可用.zip
单片机驱动ST7522实测可用.zip D7-SI,D6-SCL,A0, CS2 串行通信实测可用
PH2.0封装包含立式插件,卧式插件,卧式贴片,立式贴片。全部都有3D模型加载,可以直接使用。(三维PCB封装库)AD用PCB封装库
STM32F030 低功耗学习 (stop mode),待机电流5~6uA。寄存器操作学习 功能: 1.开机后LED(PC13) 亮0.2s后关闭,0.2s进入stop mode 2.K1~K6 按键外部中断唤醒LED闪烁,结束后继续进入stop mode。 3.TIMER3 200ms自动重装中断;外部中断启动并给定中断次数;计次为0关闭timer3,为进入stop mode 准备。
STM32L151C8T6ADC单次转换串口打印例程,Keil5工程可以直接使用,网上很难找到,共享参考
如何使用STM32L1XX 标准固件库 1. 创建工程并设置所选型号的启动文件 选择相对应MCU型号的启动文件: * startup_stm32l1xx_md.s: 适用于STM32L Ultra Low Power Medium density devices * startup_stm32l1xx_mdp.s:适用于STM32L Ultra Low Power Medium density Plus devices * startup_stm32l1xx_hd.s: 适用于STM32L Ultra Low Power High density devices * startup_stm32l1xx_xl.s: 适用于STM32L Ultra Low Power XL density devices 上面四种类型所对应的MCU型号分别是: * Ultra Low Power Medium-density devices: - STM32L151x6xx, STM32L151x8xx, STM32L151xBxx, STM32L152x6xx, STM32L152x8xx, STM32L152xBxx, STM32L151x6xxA, STM32L151x8xxA, STM32L151xBxxA, STM32L152x6xxA, STM32L152x8xxA and STM32L152xBxxA, STM32L100x6xx, STM32L100x8xx and STM32L100xBxx * Ultra Low Power Medium-density Plus devices: - STM32L151xCxx, STM32L152xCxx and STM32L162xCxx, STM32L100xCxx * Ultra Low Power High-density devices: STM32L151xDxx, STM32L152xDxx and STM32L162xDxx * Ultra Low Power XL-density devices: STM32L151xExx, STM32L152xExx and STM32L162xExx 2. 根据所选的MCU型号配置固件库 在 stm32l1xx.h (under Libraries\CMSIS\Device\ST\STM32L1xx\Include)中配置所选的MCU类型,以及使用的外设头文件。 #if !defined (STM32L1XX_MD) && !defined (STM32L1XX_MDP) && !defined (STM32L1XX_HD) && !defined (STM32L1XX_XL) /* #define STM32L1XX_MD */ /*!< - Ultra Low Power Medium-densitydevices: STM32L151x6xx, STM32L151x8xx, STM32L151xBxx, STM32L152x6xx, STM32L152x8xx and STM32L152xBxx. - Ultra Low Power Medium-density Value Line devices: STM32L100x6xx,STM32L100x8xx and STM32L100xBxx.*/ /* #define STM32L1XX_MDP */ /*!< - Ultra Low Power Medium-density Plus devices: STM32L151xCxx, STM32L152xCxx and STM32L162xCxx - Ultra Low Power Medium-density Plus Value Line devices: STM32L100xCxx */ /* #define STM32L1XX_HD */ /*!< Ultra Low Power High-density devices: STM32L151xDxx, STM32L152xDxx and STM32L162xDxx */ /* #define STM32L1XX_XL */ /*!< Ultra Low Power XL-density devices: STM32L151xExx, STM32L152xExx and STM32L162xExx */ #endif 1 2 3 4 5 6 7 到这里,对固件库的配置就算完成了,剩下的就是将这些文件包含进编译器中,并对编译器进行相应的配置。