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TSUMV59XUS 应用说明
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2014-04-17
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MSTAR公司的产品,广泛应用于各种尺寸的TFT电视机中,LVDS接口,也可以通过外围电路转换为TTL接口。音视频输入输出接口类型众多。软件设定各个寄存器的数据,可以做出丰富的OSD显示界面。
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TSUMV59XUS
Application Note
TSUMV59XUS APN 1.02
© 2012 MStar Semiconductor, Inc. All rights reserved.
MStar Semiconductor makes no representations or warranties including, for example but not limited to,
warranties of merchantability, fitness for a particular purpose, infringement of any intellectual property right or
the accuracy or completeness of this document, and reserves the right to make changes without further notice to
any products herein to improve reliability, function or design. No responsibility is assumed by MStar
Semiconductor arising out of the application or user of any product or circuit described herein; neither does it
convey any license under its patent rights, nor the rights of others.
MStar is a trademark of MStar Semiconductor, Inc. Other trademarks or names herein are only for identification
purposes only and owned by their respective owners.
{TSUMV59XUS}
{ Application Note}
{TSUMV59XUSAPN 1.0.2}
Security Level: Confidential A - i - 10/24/2012
Copyright © 2012 MStar Semiconductor, Inc. All rights reserved.
F-3697
REVISION HISTORY
Revision No.
Description
Date
1.0.1
Initial release
{7/11/2012}
1.0.2
修正 2.2 DDR Power
增加 3.7 HDMI ARC 做 SPDIF 同轴输出
增加 3.11 SAR0(PIN110)对串接电阻的要求
{10/16/2012}
{TSUMV59XUS}
{ Application Note}
{TSUMV59XUSAPN 1.0.2}
Security Level: Confidential A - ii - 10/24/2012
Copyright © 2012 MStar Semiconductor, Inc. All rights reserved.
F-3697
目录
1. IC 应用说明 .................................................................................................................................... 1
1.1. PAD 使用说明 ........................................................................................................................ 1
1.1.1. GPIO PAD .................................................................................................................... 1
1.1.2. 耐压 ............................................................................................................................ 2
1.1.3. Standby PIN ................................................................................................................ 2
1.1.4. CEC ............................................................................................................................ 2
1.1.5. ARC ............................................................................................................................ 2
1.1.6. UART .......................................................................................................................... 2
1.1.7. LED ............................................................................................................................ 2
1.1.8. I2C ............................................................................................................................. 3
1.1.9. USB ............................................................................................................................ 3
1.2. 电源应用 ................................................................................................................................ 4
1.2.1. 电源注意事项 ............................................................................................................... 4
1.2.2. VDDC ............................................................................................................................ 4
1.2.3. DDR 电压 ...................................................................................................................... 4
1.2.4. 待机唤醒 ..................................................................................................................... 4
1.2.5. 3.3V 供电说明 .............................................................................................................. 4
1.2.6. 功耗 ............................................................................................................................ 6
1.3. 上电时序要求 ......................................................................................................................... 7
1.4. ESD 事项说明 .......................................................................................................................... 8
1.5. SPI Flash .............................................................................................................................. 9
1.6. CPU 配置................................................................................................................................ 10
1.7. Front End USE ....................................................................................................................... 11
1.8. Video and Audio OUT ............................................................................................................. 12
1.9. USB ....................................................................................................................................... 15
1.10. 晶振 ..................................................................................................................................... 16
1.11. LVDS ..................................................................................................................................... 17
1.12. Debug 记录............................................................................................................................ 18
2. PCB layout Guide ......................................................................................................................... 19
2.1. Power and GND ..................................................................................................................... 19
2.1.1. PCB 板材 .................................................................................................................... 19
2.1.2. 走线宽度 .................................................................................................................... 19
2.1.3. 元件摆放 .................................................................................................................... 19
2.1.4. 散热 ........................................................................................................................... 20
2.1.5. IC GND layout ............................................................................................................. 20
2.1.6. E-PAD 设计 ................................................................................................................ 20
2.2. DDR Power ............................................................................................................................. 22
2.3. HDMI ..................................................................................................................................... 23
2.4. LVDS ..................................................................................................................................... 24
2.5. USB ....................................................................................................................................... 25
2.6. Video 和 RGB .......................................................................................................................... 26
2.7. 晶振 ..................................................................................................................................... 27
2.8. LVDS CLOCK 做 GPIO ................................................................................................................ 28
{TSUMV59XUS}
{ Application Note}
{TSUMV59XUSAPN 1.0.2}
Security Level: Confidential A - iii - 10/24/2012
Copyright © 2012 MStar Semiconductor, Inc. All rights reserved.
F-3697
3. 调板和常遇问题 debug 方法 ............................................................................................................ 29
3.1. 电源 ..................................................................................................................................... 29
3.2. 晶振 ..................................................................................................................................... 29
3.3. config 电路 ........................................................................................................................... 29
3.4. DDR ....................................................................................................................................... 29
3.5. LVDS ..................................................................................................................................... 29
3.6. Tuner 配置............................................................................................................................ 30
3.7. HDMI ARC 做 SPDIF 同轴输出 .................................................................................................... 30
3.8. SAR0(PIN110)对串接电阻的要求 ........................................................................................... 30
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