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* Product structure: Silicon monolithic integrated circuit. ** This product is not designed to protect against radioactive rays.

http://www.rohm.com/

1/127

TSZ22111-14-001

TSZ02201-0B4B0A700040-1-2

18. Jul. 2017, Rev.001

1 to 4-Cell Li-Ion Battery Manager

For Application Processors

BD99954MWV, BD99954GW

 General Description

BD99954 is a Battery Management LSI for 1-4 cell

Lithium-Ion secondary battery, and available in a 40pin

0.40 mm pitch 5.0 mm x 5.0 mm QFN package and small

41-ball 0.4mm pitch 2.6mm x 3.0mm Wafer-Level CSP

package which is designed to meet high degree demands

for space-constraint equipment such as Low profile

Notebook PC, Tablets and other applications.

BD99954 provides a Dual-source Battery Charger, two

port BC1.2 detection and a Battery Monitor with several

alarm(INT#, PROCHOT#) outputs

 Features

 Dual-source Battery Charger

 High efficiency Step-Up/Down switching charger for

1-4 cell Li-Ion/Li-poly battery

 Two separate input sources for USB-VBUS and DC

adapter.

 Two port BC1.2 detectors.

 JEITA compliant charging profile

 Programmable parameters for Preconditioning, Pre-

charge current, and Fast-charge current

 Programmable charging voltage

 Programmable charge current

 Programmable Switching Frequency: 600kHz to

1.2MHz

 Support USB BCS 1.2, ACA, ID pin, OTG

 USB-VBUS Over Voltage Protection

 Over Voltage Battery Protection

 Battery Short Circuit Detection

 Power Path Management with charge pump gate

driver

 Flexibility power path control

 Reverse Buck/Boost Option for USB/USB-PD

 Bias voltage output for the external thermistor

 PMON output

 PROCHOT# output

 Support Inhibit / Autonomous Charging

 Battery Learn Function

 Input Operating Range: 3.8V to 25V

 Voltage Measurement for Thermistor.

 Bias voltage output for the external thermistor.

 SMBus Interface (Clock up friendly I2C) for Host

communication

 Embedded OTPROM for initial settings

 Packages

Pitch

UQFN040V5050

0.4mm

5.0mm

1.0mm

UCSP55M3C

6 x 7balls

0.4mm

2.6mm

3.0mm

0.62mm

UQFN040V5050

UCSP55M3C

 Applications

 Ultrabook

 Notebook PC

 Ultra-mobile PC

 Tablet PC

 Structure

Silicon Monolithic Integrated Circuit

 Line up matrix

Parts No.

Package

BD99954MWV

UQFN040V5050

BD99954GW

UCSP55M3C

* Product structure: Silicon monolithic integrated circuit. ** This product is not designed to protect against radioactive rays.

http://www.rohm.com/

2/127

BD99954MWV, BD99954GW

Datasheet

TSZ22111-14-001

TSZ02201-0B4B0A700040-1-2

18. Jul. 2017, Rev.001

Contents

Notation .................................................................................................................................................................... 3

Reference ................................................................................................................................................................. 3

1. INTRODUCTION ................................................................................................................. 4

2. SIGNAL DESCRIPTION ...................................................................................................... 5

3. PIN CONFIGURATION ........................................................................................................ 6

4. ABSOLUTE MAXIMUM RATING ........................................................................................ 7

5. THERMAL RESISTANCE

(NOTE 1)

........................................................................................ 7

6. RECOMMENDED OPERATING CONDITION ..................................................................... 7

7. FUNCTION DESCRIPTIONS ............................................................................................... 8

7.1. Block Diagram ............................................................................................................................................ 8

7.2. External Characteristics for Battery Charger .......................................................................................... 9

7.3. DC Input & Over Voltage Protection (OVP) ............................................................................................ 10

7.4. USB Detection ........................................................................................................................................... 11

7.5. DC/DC Converter ...................................................................................................................................... 12

7.6. Charger ...................................................................................................................................................... 14

7.7. Reverse DC/DC Converter ....................................................................................................................... 16

7.8. 12-bit ADC ................................................................................................................................................. 17

7.9. Power On ................................................................................................................................................... 18

8. CONTROL SPECIFICATION ............................................................................................. 20

8.1. SMBus Communication ........................................................................................................................... 20

8.2. SMBus Protocols ...................................................................................................................................... 20

8.3. Command Code ........................................................................................................................................ 22

8.4. Battery Charger Commands Description ............................................................................................... 26

8.5. Extended Commands Description .......................................................................................................... 29

8.6. Resister Default Value ............................................................................................................................ 115

9. I/O EQUIVALENT CIRCUIT DIAGRAM .......................................................................... 118

10. ORDERING INFORMATION ............................................................................................ 121

11. MARKING DIAGRAMS ................................................................................................... 121

12. PHYSICAL DIMENSION TAPE AND REEL INFORMATION .......................................... 122

13. OPERATIONAL NOTES .................................................................................................. 124

* Product structure: Silicon monolithic integrated circuit. ** This product is not designed to protect against radioactive rays.

http://www.rohm.com/

3/127

BD99954MWV, BD99954GW

Datasheet

TSZ22111-14-001

TSZ02201-0B4B0A700040-1-2

18. Jul. 2017, Rev.001

Notation

Category

Notation

Description

Unit

Volt (Unit of voltage)

Ampere (Unit of current)

Ω, Ohm

Ohm (Unit of resistance)

Farad (Unit of capacitance)

deg., degree

degree Celsius (Unit of Temperature)

Hertz (Unit of frequency)

s (lower case)

second (Unit of time)

Min

minute (Unit of time)

b, bit

bit (Unit of digital data)

B, byte

1 byte = 8 bits

Unit prefix

M, mega-, mebi-

= 1,048,576 (used with “bit” or “byte”)

M, mega-, million-

= 1,000,000 (used with “Ω” or “Hz”)

K, kilo-, kibi-

= 1,024 (used with “bit” or “byte”)

k, kilo-

= 1,000 (used with “Ω” or “Hz”)

m, milli-

-3

μ, micro-

-6

n, nano-

-9

p, pico-

-12

Numeric value

xxh, xxH

Hexadecimal number.

“x”: any alphanumeric of 0 to 9 or A to F.

Xxb

Binary number; “b” may be omitted.

“x”: a number, 0 or 1

“_” is used as a nibble (4-bit) delimiter.

(e.g. “0011_0101b” = “35h”)

Address

#xxh

Address in a hexadecimal number.

“x”: any alphanumeric of 0 to 9 or A to F.

Data

bit[n]

n-th single bit in the multi-bit data.

bit[n:m]

Bit range from bit[n] to bit[m].

Signal level

“H”, High

High level (over V

or V

) of logic signal.

“L”, Low

Low level (under V

or V

) of logic signal.

“Z”, “Hi-Z”

High impedance state of 3-state signal.

Reference

Name

Reference Document

Release Date

Publisher

I2C-bus

“UM10204: I

C-bus specification and user manual Rev. 4”

Feb. 13, 2012

NXP Semiconductors

SMBus

System Management Bus (SMBus) Specification 3.0

Dec. 20, 2014

SBS-IF

JEITA Profile

“A Guide to the Safe Use of Secondary Lithium Ion Batteries in

Notebook-type Personal Computers”

Apr. 10, 2007

JEITA

USB BC

“Battery Charging Specification Revision 1.2”

Dec. 7, 2010

USB.org

Smart Battery

Charger

Smart Battery Charger Specification Revision 1.1

Dec. 11, 1998

SBS-IF

USB 2.0

Universal Serial Bus Specification Revision 2.0

Jul. 26, 2013

USB.org

USB 3.1

Universal Serial Bus Revision 3.1 Specification Rev. 1.0

Aug. 11, 2014

USB.org

USB PD

USB Power Delivery Specification Rev. 2.0 V1.0

Apr. 27, 2000

USB.org

* Product structure: Silicon monolithic integrated circuit. ** This product is not designed to protect against radioactive rays.

http://www.rohm.com/

5/127

BD99954MWV, BD99954GW

Datasheet

TSZ22111-14-001

TSZ02201-0B4B0A700040-1-2

18. Jul. 2017, Rev.001

2. Signal Description

Table 2-1 Signal Description

No.

Ball

No.

[CSP]

Pin Name

Function

VBUS

USB Power Supply

VCC

DC Power Supply

ACOK

AC adapter voltage detection open drain output.

INT#

Interrupt for I2C

PROCHOT#

Active low open drain output of “processor hot” indicator. The charger

IC monitors events like adapter current, battery discharge current. Once any

event in PROCHOT# profile is triggered, a minimum 10ms pulse is asserted.

ACN

Input current sense resistor negative input.

ACP

Input current sense resistor positive input.

ACGATE1

Charge pump output to drive adapter input n-channel MOSFET s.

The ACGATE1 voltage is 5V above VBUS during AC adapter insertion.

ACGATE2

Charge pump output to drive adapter input n-channel MOSFET s.

The ACGATE2 voltage is 5V above VCC during AC adapter insertion.

IADP/RESET

Default Input Current Limit Setting pin and System resistor reset pin.

VBUS_DMI

VBUS side USB D- Input / Output

VBUS_DPI

VBUS side USB D+ Input / Output

VBUS_DMO VBUS side USB D- Output / Input

VBUS_DPO VBUS side USB D+ Output / Input

VBUS_ID

VBUS side USB ID pin input

VCC_DMI

VCC side USB D- Input / Output

VCC_DPI

VCC side USB D+ Input / Output

VCC_DMO VCC side USB D- Output / Input

VCC_DPO VCC side USB D+ Output / Input

VCC_ID

VCC side USB ID pin input

SCL

SMBus Clock Input

SDA

SMBus Data Input / Output

PMON

Buffered total system power current output. Place a resistor between

PMON pin and GND.

IOUT

Buffered adapter or charge current output selectable with SMBus command.

VREF

1.5V LDO Output

TSENSE

Battery temperature monitor pin.

Active low battery present input signal. LOW indicates battery is present,

and HIGH indicates the battery is absent and the charging stop.

BATT

Battery Voltage Input

BGATE

Gate Control Output

SRN

Charge current sense resistor negative input.

SRP

Charge current sense resistor positive input.

GND

Ground

HG2

DC/DC Boost side High Side Gate Driver

LX2

DC/DC Boost side Inductor Connection

BOOT2

DC/DC Boost side Driver Voltage Output

LG2

DC/DC Boost side Low Side Gate Driver

LG1

DC/DC Buck side Low Side Gate Driver

BOOT1

DC/DC Buck side Driver Voltage Output

LX1

DC/DC Buck side Inductor Connection

HG1

DC/DC Buck side High Side Gate Driver

REGN

LDO Output

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