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雅马哈音频处理器ASDP YMU836 datasheet
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2022-09-22
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雅马哈音频处理器ASDP YMU836 datasheet
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YMU836
6MU836A21 3
PRECAUTIONS AND INSTRUCTIONS FOR SAFETY
WARNING
Prohibited
Do not use the device under stresses beyond those listed in Absolute Maximum Ratings. Such stresses may become
causes of breakdown, damages, or deterioration, causing explosion or ignition, and this may lead to fire or personal injury.
Prohibited
Do not mount the device reversely or improperly and also do not connect a supply voltage in wrong polarity. Otherwise,
this may cause current and/or power-consumption to exceed the absolute maximum ratings, causing personal injury due
to explosion or ignition as well as causing breakdown, damages, or deterioration. And, do not use the device again that
has been improperly mounted and powered once.
Prohibited
Do not short between pins. In particular, when different power supply pins, such as between high-voltage and low-voltage
pins, are shorted, smoke, fire, or explosion may take place.
Instructions
As to devices capable of generating sound from its speaker outputs, please design with safety of your products and
system in mind, such as the consequences of unusual speaker output due to a malfunction or failure. A speaker dissipates
heat in a voice-coil by air flow accompanying vibration of a diaphragm. When a DC signal (several Hz or less) is input due
to device failure, heat dissipation characteristics degrade rapidly, thereby leading to voice-coil burnout, smoking or ignition
of the speaker even if it is used within the rated input value.
CAUTION
Prohibited
Do not use Yamaha products in close proximity to burning materials, combustible substances, or inflammable materials, in
order to prevent the spread of the fire caused by Yamaha products, and to prevent the smoke or fire of Yamaha products
due to peripheral components.
Instructions
Generally, semiconductor products may malfunction and break down due to aging, degradation, etc. It is the responsibility
of the designer to take actions such as safety design of products and the entire system and also fail-safe design according
to applications, so as not to cause property damage and/or bodily injury due to malfunction and/or failure of semiconductor
products.
Instructions
The built-in DSP may output the maximum amplitude waveform suddenly due to malfunction from disturbances etc. and
this may cause damage to headphones, external amplifiers, and human body (the ear). Please pay attention to safety
measures for device malfunction and failure both in product and system design.
Instructions
As semiconductor devices are not nonflammable, overcurrent or failure may cause smoke or fire. Therefore, products
should be designed with safety in mind such as using overcurrent protection circuits to control the amount of current during
operation and to shut off on failure.
Instructions
Products should be designed with fail safe in mind in case of malfunction of the built-in protection circuits. Note that the
built
-in protection circuits such as overcurrent protection circuit and high-temperature protection circuit do not always
protect the internal circuits. In some cases, depending on usage or situations, such protection circuit may not work
properly or the device itself may break down before the protection circuit kicks in.
Instructions
Use a robust power supply. The use of an unrobust power supply may lead to malfunctions of the protection circuit,
causing device breakdown, personal injury due to explosion, or smoke or fire.
Instructions
Product's housing should be designed with the considerations of short-circuiting between pins of the mounted device due
to foreign conductive substances (such as metal pins etc.). Moreover, the housing should be designed with spatter
prevention etc. due to explosion or burning. Otherwise, the spattered substance may cause bodily injury.
Instructions
The device may be heated to a high temperature due to internal heat generation during operation. Therefore, please take
care not to touch an operating device directly.
Instructions
Electrostatic discharges can damage and destroy semiconductor devices. Pay close attention to static build-up when
handling devices.
Instructions
The product of the WLCSP package should be used under light-shielded conditions.
Since the WLCSP package has a structure that a silicon wafer is exposed, if light (such as sunlight) hits the wafer, the
device may malfunction (leak current increase etc.) due to electric charge internally generated by the photoelectric effect.
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YMU836
6MU836A21 4
Table of Contents
1 Symbols, Marks, and Notations .................................................................. 6
2 Overview ................................................................................................. 8
2.1 Features ............................................................................................... 9
2.1.1 DSP Functions .......................................................................................... 9
2.1.2 General Functions .................................................................................. 10
3 Block Diagram ........................................................................................ 11
4 Pin Assignments ..................................................................................... 12
5 Pin Descriptions ...................................................................................... 13
5.1 Pin Summary ....................................................................................... 13
5.2 Device Pin States ................................................................................. 16
5.2.1 Device Pin States During and On Exiting Power-on Resets ........................... 16
5.2.2 Handling of Unused Pins .......................................................................... 18
6 Device Operations .................................................................................. 20
6.1 Host Controller Interface ....................................................................... 20
6.1.1 SPI ....................................................................................................... 21
6.1.2 I
2
C ....................................................................................................... 29
6.2 Device Startups and Power Management ................................................. 30
6.2.1 LDO ...................................................................................................... 30
6.2.2 Power Domains ...................................................................................... 31
6.2.3 Starting Device ...................................................................................... 32
6.3 Embedded Microcontroller ..................................................................... 33
6.3.1 External Flash Memory Access ................................................................. 33
6.3.2 Selecting DSP Data With GPI Pin Strapping ................................................ 34
6.3.3 Selecting GPO Pin Output ........................................................................ 34
6.3.4 I
2
C Interface .......................................................................................... 34
6.4 Digital Microphone Interface (PDM) ......................................................... 35
7 Register Descriptions .............................................................................. 36
7.1 Register Overview ................................................................................ 36
7.2 Accessing Intermediate Registers ........................................................... 37
7.2.1 Burst Access Support to Intermediate Register Read/Write .......................... 37
7.2.2 Writing Intermediate Registers ................................................................ 37
7.2.3 Reading Intermediate Registers ............................................................... 37
7.3 Register Map ....................................................................................... 38
7.3.1 IF_REG (Interface of intermediate Register) .............................................. 38
7.3.2 A_REG (Clock, PLL etc) ........................................................................... 39
7.3.3 MA_REG (Digital volume Mixer etc.) ......................................................... 40
7.3.4 MB_REG (Digital audio etc.) ..................................................................... 41
7.3.5 B_REG (B-DSP) ...................................................................................... 42
7.3.6 C_REG (C-DSP) ...................................................................................... 43
7.3.7 E_REG (E-DSP) ...................................................................................... 44
7.3.8 F_REG (F-DSP) ...................................................................................... 45
7.3.9 ANA_REG (Analog volume, Mixer, etc.) ..................................................... 46
7.3.10 CD_REG ................................................................................................ 47
7.4 IF_REG Details ..................................................................................... 48
7.4.1 Intermediate Register Access ................................................................... 48
7.4.2 Power Management ................................................................................ 54
7.4.3 Reset .................................................................................................... 55
7.5 A_REG Details ..................................................................................... 56
7.5.1 DevID / VerID........................................................................................ 56
7.5.2 CLOCK .................................................................................................. 56
7.5.3 Digital Interface Pin Controls ................................................................... 58
7.5.4 GPIO (PA[0/1/2]) Pin Controls ................................................................. 62
7.5.5 PLL / Clock ............................................................................................ 66
7.5.6 Clock Settings ........................................................................................ 71
7.6 MA_REG Details ................................................................................... 74
YMU836
6MU836A21 5
7.6.1 Volume ................................................................................................. 74
7.6.2 SWAP ................................................................................................... 88
7.6.3 MIXER .................................................................................................. 90
7.7 E_REG Details ...................................................................................... 97
7.7.1 Oversampling Filter(OSF) ........................................................................ 97
7.7.2 DC Blocking Filters ............................................................................... 100
7.7.3 PDM Interface ...................................................................................... 102
7.8 ANA_REG Details ................................................................................ 107
7.8.1 Hardware ID ........................................................................................ 107
7.8.2 Soft Reset ........................................................................................... 107
7.8.3 Power Management .............................................................................. 108
7.8.4 Mic Bias Controls .................................................................................. 114
7.8.5 Pin Function Controls ............................................................................ 115
7.8.6 VOLUME .............................................................................................. 116
7.8.7 ANALOG MIXER.................................................................................... 120
7.8.8 CHARGE PUMP ..................................................................................... 121
7.9 CD_REG Details .................................................................................. 122
7.9.1 Soft Reset ........................................................................................... 122
7.9.2 Power Management .............................................................................. 123
7.9.3 GPIO(GPIO[0/1/2/3]) Pin Controls.......................................................... 128
8 Electrical Characteristics ........................................................................ 133
8.1 Absolute Maximum Ratings ................................................................... 133
8.2 Recommended Operating Conditions ...................................................... 134
8.3 Operating Current ............................................................................... 135
8.4 DC Characteristics ............................................................................... 136
8.5 AC Characteristics ............................................................................... 137
8.5.1 Power-on rule, Input signal slope rule ..................................................... 137
8.5.2 Input Clock (CLKI) ................................................................................ 139
8.5.3 SPI Timing .......................................................................................... 140
8.5.4 I
2
C Interface Timing ............................................................................. 143
8.5.5 Digital Audio Interface Timing ................................................................ 144
8.5.6 PCM Interface Timing ........................................................................... 148
8.5.7 Digital Microphone Interface Timing ........................................................ 151
8.6 Analog Characteristic ........................................................................... 152
8.6.1 Line Output Amplifier ............................................................................ 152
8.6.2 MIC Amplifiers #1 to #3 ....................................................................... 152
8.6.3 MIC Amplifiers #4 ................................................................................ 152
8.6.4 VREF .................................................................................................. 153
8.6.5 MIC Biases #1 to #3 ............................................................................ 153
8.6.6 ADC .................................................................................................... 153
8.6.7 DAC .................................................................................................... 153
8.6.8 LINEOUT1/LINEOUT2 Volume (LO[1/2]VOL_L/R) ..................................... 153
8.6.9 MIC1/MIC2/MIC3/MIC4 Gain Settings (MC[1/2/3/4]VOL) .......................... 154
9 Package Dimensions ............................................................................. 155
10 Peripheral Circuit Example ..................................................................... 156
10.1 SPI Master Mode ................................................................................. 156
10.2 SPI Slave Mode ................................................................................... 157
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