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E-mail:sales@hoperf.com
D
IGITA
L
I
2
C H
UMIDIT
Features
Relative Humidity Sensor
± 4.5 % RH (maximum @ 0–80%
RH)
Temperature Sensor
±0.5 ºC accuracy (typical)
±1 ºC accuracy (maximum @ 0 to
70 °C)
0 to 100% RH operating range
–40 to +85 °C (GM) or 0 to +70 °C
operating range (FM)
Wide operating voltage range
(2.1 to 3.6 V)
Low Power Consumption
240 µA during RH conversion
Applications
Industrial HVAC/R
Thermostats/humidistats
Respiratory therapy
White goods
www.hoperf.com
UMIDIT
Y
AND
T
EMPERATURE
S
ENSO
RH)
I
2
C host interface
Integrated on-chip heater
4x4 mm QFN package
Excellent long term stability
70 °C)
GND
1
Factory calibrated
Optional factory-installed
cover
Low-profile
Protection during reflow
Excludes liquids and
particulates
(hydrophobic/oleophobic)
DNC
2
SCL
3
SDA
4
DNC
5
DNC
6
Micro-environments/data centers
Automotive climate control and de-
fogging
Asset and goods tracking
TH02
Rev 2.0
DNC
7
24
DNC
GND
8
23
DNC
V
DD
9
22
DNC
C
EXT
10
21
DNC
GND
11
20
DNC
DNC
12
19
GND
ENSO
R
Pin Assignments
18 DNC
17 DNC
16 DNC
15
CS
14
DNC
13
DNC
E-mail:sales@hoperf.com
C = 0.1 µF
C = 4.7 µF
Description
The TH02 is a digital relative humidity and
IC integrates temperature and humidity
converter, signal processing, calibration dat
a
of industry-standard, low-K polymeric dielect
rics
construction of a low-power, monolithic CMO
S
excellent long term stability.
Both the temperature and humidity sensors
a
stored in the on-chip non-volatile memo
r
interchangeable, with no recalibration or soft
wa
The TH02 is packaged in a 4x4 mm QF
N
optional factory-installed protective cover of
fe
protecting the sensor during assembly (e.g.,
r
product, excluding liquids
(hydrophobic/oleop
ho
The TH02 offers an accurate, low-power
,
measuring temperature, humidity, and
dew
and asset tracking to industrial and consu
m
Functional Block Diagram
V
DD
V
DD
CEXT
GND
www.hoperf.com
temperature sensor. This monolithic CMOS
sensor elements, an analog-to-digital
a
, and an I
2
C host interface. The patented use
rics
for sensing humidity enables the
S
sensor IC with low drift and hysteresis and
a
re factory-calibrated and the calibration data is
r
y. This ensures that the sensors are fully
wa
re changes required.
N
package and is reflow solderable. The
fe
rs a low- profile, convenient means of
r
eflow soldering) and throughout the life of the
ho
bic)
and particulates.
,
factory-calibrated digital solution ideal for
dew
-point in applications ranging from HVAC/R
m
er platforms.
MUX
ADC
TH02
NV
CAL
32 kHz
Osc
Logic
I
2
C
Serial
IF
SCL
SDA
CS
TH02
Rev 2.0
R = 10 k (typ)
R = 10 k (typ)
I
2
C pullups may be
integrated in microcontroller
V
DD
PXx
PXy
PXz
Microcontroller
E-mail:sales@hoperf.com
T
ABLE
OF
C
ONTENT
S
Section
1. Electrical Specifications
. . . . . . . . . . . . . . . . . . . . . . .
2. Typical Application Circuits
. . . . . . . . . . . . .
3. Bill of Materials
. . . . . . . . . . . . . . . . . . . . .
4. Functional Description
. . . . . . . . . . . . . . . . . . . .
4.1. Overview . . . . . . . . .
. . . . . . . . . . . . . . . .
4.2. Relative Humidity Sens
or Ac
4.3. Linearization . . . . . .
. . . . . . . . . . . . . . . .
4.4. Temperature Compensation
4.5. Hysteresis
. . . . . . . . . . . . .
4
.6. Prolonged Exposure to High Humidity
4.7. PCB Assembly . . . . . .
. . . . . . . . . . . . . . . .
4.8. Protecting the Sensor
. . . . . . . . . . . . . . . . .
4.9. Bake/Hydrate Procedur
e
4.10. Long Term Drift/Aging
. . . . . . . . . . . . . . . .
5. Host Interface
. . . . . . . . . . . . . . . . . . . . . . .
5.1. I
2
C Interface
. . . . . . . . . . . . . . . . . . . . . . . . .
5.2. I
2
C Operation
. . . . . . . . . . . . . . . . . . . . . . . . .
6. TH02 Connection Diagrams
7. Control Registers
. . . . . . . . . . . . . . . . . . . . . . . . .
7.1. Register Detail (Defaults
8. Pin Descriptions: TH02 . . . .
9. Ordering Guide . . . . . . .
. . . . . . . . . . . . . . . .
10. Package Outline . . . . . . .
. . . . . . . . . . . . . . . .
10.1. 24-Pin QFN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10.2. 24-
Pin QFN with Protective
11. PCB Land Pattern and So
lder Mask
12. Top Marking
. . . . . . . . . . . . . . . . . . . . . . .
12.1. TH02 Top Marking
. . . . . . . . .
12.2. Top Marking Explanati
on
www.hoperf.com
S
. . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . .
. . . . . . . . . . . . .
. . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . .
or Ac
curacy
. . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
4.4. Temperature Compensation
. . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . .
. . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . .
.6. Prolonged Exposure to High Humidity
. . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
e
. . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . .
. . . . . . . . . . . . . .
in Bold) . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
Pin QFN with Protective
Cover
. . . . . . . . . . . . . . . . . . . . . . . .
lder Mask
Design . . . . . . . . .
. . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . .
. . . . . . . . .
. . . . . . . . . . . . . .
. . . . . . . . . . . . .
on
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . .
TH02
Rev 2.0
Page
. . . . . . . . . . . . .
. . . . . . . . . . . . . . . 4
. . . . . . . . . . . . . . . . .
10
. . . . . . . . . . . . . . . .
. . . . . 11
. . . . . . . . . . . . . . .
. 12
. . . . . . . . . . . . . .
. . . 12
. . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . 13
. . . . . . . . . . . . . . . .
. 15
. . . . . . . . . . . . .
. . . . . . . . . . . . 16
. . . . . . . . . . . . . .
. 16
. . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . 16
. . . . . . . . . . . . . . .
17
. . . . . . . . . . . . . . .
18
. . . . . . . . . . . . . .
. . . . . . . . . . . . 18
. . . . . . . . . . . . . . .
18
. . . . . . . . . . . . . . . .
. . . . 19
. . . . . . . . . . . . . . 19
. . . . . . . . . . . . . . 23
. . . . . . . . . . . . . . 25
. . . . . . . . . . . . . .
. . . 27
. . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . 27
. . . . . . . . . . . . . . .
30
. . . . . . . . . . . . . . . .
. . . 31
. . . . . . . . . . . . . .
. . . 32
. . . . . . . . . . . . . . .
32
. . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . 33
. . . . . . . . . . . . .
. . . . . . . . . . . 34
. . . . . . . . . . . . . . . .
. . . . 36
. . . . . . . . . . . . .
. . . . . . . . . . . . 36
. . . . . . . . . . . . . . .
36
E-mail:sales@hoperf.com
1. Electrical Specifications
Unless otherwise specified, all min/max
spe
Table 1. Recommended Operating
Conditi
Parameter
Power Supply
Operating Temperature
Operating Temperature
Table 2. General Specifications
2.1
≤
V
DD
≤
3.6 V; T
A
= 0 to 70 °C (F gra
de) or
Parameter Symbol
Input Voltage High
V
IH
Input Voltage Low
V
IL
Input Voltage Range
V
IN
Input Leakage
I
IL
Output Voltage Low
V
OL
Notes:
1.
TH02 can draw excess current if VDD
CS low while V
DD
ramps or pulse CS
l
2.
SDA and SCL pins have an intern
al 75 k
www.hoperf.com
spe
cifications apply over the recommended
operating
Conditi
ons
Symbol
Test Condition Min T
yp
V
DD
2.1 3
.3
T
A
G grade –40
—
T
A
F
grade
0
—
de) or
–40 to 85 °C (G grade) unless otherwise noted.
Test Condition Min Typ
CS, SCL, SDA pins 0.7xV
DD
—
CS, SCL, SDA pins
—
—
SCL, SDA pins with respect
to GND
0.0
—
CS, C
EXT
pin with respect
to
GND
0.0
—
CS, SCL, SDA pins
—
—
SDA pin; I
OL
= 8.5 mA;
V
DD
= 3.3 V
—
—
SDA pin; I
OL
= 3.5 mA;
V
DD
= 2.1 V
—
—
and CS are ramped high together. To enter the l
owest
l
ow after V
DD
reaches its final value.
al 75 k
Ω
pull-up resistor to VDD
TH02
Rev 2.0
operating
conditions.
yp
Max Unit
.3
3.6
V
—
85
°C
—
70
°C
Max Unit
—
V
0.3xV
DD
V
3.6
V
V
DD
V
±1
µA
0.6
V
0.4
V
owest
power mode, either hold
E-mail:sales@hoperf.com
Table 2. General Specifications
(Continue
2.1
≤
V
DD
≤
3.6 V; T
A
= 0 to 70 °C (F gra
de) or
Parameter Symbol
Power Consumption
I
DD
Conversion Time t
CONV
Wake Up Time
t
CS
Power Up Time
t
PU
Notes:
1.
TH02 can draw excess current if VDD
CS low while V
DD
ramps or pulse CS
l
2.
SDA and SCL pins have an intern
al 75 k
www.hoperf.com
(Continue
d)
de) or
–40 to 85 °C (G grade) unless otherwise noted.
Test Condition Min Typ
RH conversion in progress
—
240
Temperature conversion in
progress
—
320
Average for 1
temperature
and 1 RH conversion
/
minute
—
1
CS < V
IL
; no conversion
in
progress; V
DD
= 3.3
V;
SDA = SCL ≥
V
IH
—
150
CS >
V
IH
—
—
CS < V
IL
; no conversion
in
progress; V
DD
= 3.3
V;
SDA = SCL ≥ V
IH
; HEAT =
1
—
24
14-bit temperature; 12-bit RH
(Fast = 0)
35
13-bit temperature; 11-bit RH
(Fast = 1)
18
From CS < VIL to ready for a
temp/RH conversion
10
From V
DD
≥ 2.1V to ready for
a temp/RH conversion
10
and CS are ramped high together. To enter the l
owest
l
ow after V
DD
reaches its final value.
al 75 k
Ω
pull-up resistor to VDD
TH02
Rev 2.0
Max Unit
560
µA
565
µA
—
µA
—
µA
100
µA
31
mA
40
ms
21
15
ms
15
ms
owest
power mode, either hold
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