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英伟达orin手册和参考
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英伟达orin手册和参考
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DS-10662-001_v1.0 | March 2022
NVIDIA Jetson AGX Orin Series
Ampere GPU + Arm Cortex-A78AE CPU + LPDDR5 + 64GB eMMC5.1
Data Sheet
NVIDIA Jetson AGX Orin Series DS-10662-001_v1.0 | ii
NVIDIA Jetson AGX Orin Modules
Module Description
Jetson AGX Orin 64GB (JAO 64GB) Ampere GPU + Arm Cortex-A78AE CPU + 64GB LPDDR5 +
64GB eMMC 5.1
Jetson AGX Orin 32GB (JAO 32GB) Ampere GPU + Arm Cortex-A78AE CPU + 32GB LPDDR5 +
64GB eMMC 5.1
References to JAO and Jetson AGX Orin include and can be read as Jetson AGX Orin 64GB and
Jetson AGX Orin 32GB except where explicitly noted.
NVIDIA Jetson AGX Orin Series DS-10662-001_v1.0 | iii
AI Performance
JAO 64GB: Up to 275 Sparse TOPS (INT8)
JAO 32GB: Up to 200 Sparse TOPs (INT8)
Ampere GPU
JAO 64GB: 2 GPC | 8 TPC | 2048 NVIDIA
®
CUDA
®
cores | 64 Tensor cores
Ray-Tracing cores | 170 Sparse TOPS | Maximum Operating Frequency:
1.3 GHz
JAO 32GB: 2 GPC | 7 TPC | | 1792 NVIDIA
®
CUDA
®
cores | 56 Tensor
cores Ray-Tracing cores | 108 Sparse TOPS Maximum Operating
Frequency: 939 MHz
JAO: End-to-end lossless compression | Tiled Caching | OpenGL
®
4.6+ |
OpenGL ES 3.2 | Vulkan™ 1.2+
◊
| CUDA 10.2+
| Maximum Operating
Frequency: 1.3 GHz
Arm Cortex-A78AE CPU
Arm v8.2 (64-bit) heterogeneous multi-processing (HMP) CPU
architecture |
JAO 64GB: 12x cores | 3 CPU clusters (4 cores/cluster) | 259
SPECint_rate2006
JAO 32GB: 8x cores | 2 CPU clusters (4 cores/cluster) | 177
SPECint_rate2006
JAO: L1 Cache: 64 KB L1 instruction cache (I-cache) + 64 KB L1 data
cache (D-cache) per CPU core | L2 Cache: 256 KB per CPU core | L3
Cache: 2MB per CPU cluster | Maximum Operating Frequency: 2.2 GHz
DL Accelerator
JAO: 2x NVDLA 2.0 Engines |
JAO 64GB: Maximum Operating Frequency: 1.6 GHz | 52.5 TOPS
each(Sparse INT8)
JAO 32GB: Maximum Operating Frequency: 1.4 GHz | 46 TOPs each
(Sparse INT8)
Memory
JAO 64GB: 64GB 256-bit LPDDR5 DRAM
JAO 32GB: 32GB 256-bit LPDDR5 DRAM
JAO: Secure External Memory Access Using TrustZone
®
Technology |
System MMU | Maximum Operating Frequency: 3200 MHz
Storage
64GB eMMC 5.1 Flash Storage | Bus Width: 8-bit | Maximum Bus
Frequency: 200 MHz (HS400 or HS533)
64MB NOR Boot Flash | 8MB NOR Secure Key Flash
Display Controller
1x shared HDMI 2.1, eDP1.4, VESA DisplayPort 1.4a HBR3
Maximum Resolution (eDP/DP/HDMI): (up to) 8K60 (up to 36 bpp) |
Multiple displays can be supported over DP interface with MST
Multi-Stream HD Video and JPEG
Video Decode: H.265 (HEVC), H.264, AV1, VP9, VP8, MPEG-4, MPEG-2,
VC-1
Video Encode: H.265 (HEVC), H.264, AV1
JPEG (Decode & Encode)
Optical Flow Accelerator
o Optical Flow
o Stereo Disparity Estimation
Audio
Dedicated programmable audio processor | ARM Cortex A9 with NEON |
PDM in/out | Industry-standard High-Definition Audio (HDA) controller
provides a multi-channel audio path to the HDMI
®
interface
Imaging
16x lanes total | D-PHY v2.1 (40 Gbps)
16x trio links total | C-PHY v2.0 (164 Gbps)
Networking
1x GbE | 4x 10GbE
Peripheral Interfaces
USB: xHCI host controller with integrated PHY (up to) 3x USB 3.2 Gen2
(10Gbps), 4x USB2.0 | PCIe Gen4: 1 x8, 2 x4, 2 x2, 2 x1 | SD/MMC
controller (supporting eMMC 5.1, SD 4.0, SDHOST 4.0 and SDIO 3.0) | 4x
UART | 3x SPI | 8x I
2
C | 2x CAN | 4x I
2
S | 2x DMIC | 1x DSPK | GPIOs
Mechanical
Module Size: 100.0 mm x 87.0 mm x 16.0 mm | 699 pin B2B Connector |
Integrated Thermal Transfer Plate (TTP) with Heatpipe
Operating Requirements
TTP Surface Temperature*: -25 °C to 80 °C | TTP Surface: 80 °C max
Power Input: 5V (MV) and 12V (HV) | Operating Lifetime (24x7): 5 years
JAO 64GB Maximum Module Power: Up to 60 W
JAO 32GB Maximum Module Power: Up to 40W
Note: The Jetson AGX Orin Developer Kit can be used to develop the Jetson AGX Orin Series. The Developer Kit has the full
GPU, CPU, DLA, NVENC, and NVDEC performance of Jetson AGX Orin 64GB, but with 32 GB memory. Refer to the “Software
Features” section of the latest
L4T Developer Guide
for a list of supported features; all features may not be available.
◊
Product is based on a published Khronos Specification and is expected to pass the Khronos Conformance Process. Current
conformance status can be found at www.khronos.org/conformance
.
* See the
NVIDIA Jetson AGX Orin Thermal Design Guide
for details
NVIDIA Jetson AGX Orin Series DS-10662-001_v1.0 | iv
Document History
DS-10662-001_v1.0
Version Date Description of Change
1.0 March 18, 2022 Initial release
NVIDIA Jetson AGX Orin Series DS-10662-001_v1.0 | v
Table of Contents
Chapter 1. Introduction ........................................................................................... 1
Chapter 2. Functional Description .......................................................................... 5
Chapter 3. Power and System Management ........................................................... 7
3.1 Input Power ........................................................................................................................ 7
3.2 Power Sequencing.............................................................................................................. 7
3.3 Power States ...................................................................................................................... 7
3.3.1 ON State........................................................................................................................ 8
3.3.2 SC7 – Deep Sleep State ............................................................................................... 8
3.3.3 OFF State ...................................................................................................................... 8
Chapter 4. NVIDIA Orin SoC Overview ..................................................................... 9
4.1 NVIDIA Ampere GPU .......................................................................................................... 9
4.1.1 Compute Features ..................................................................................................... 10
4.1.2 Graphics Features ...................................................................................................... 10
4.1.3 GPU Architecture ....................................................................................................... 11
4.2 CPU Complex .................................................................................................................... 11
4.2.1 CPU ............................................................................................................................. 12
4.2.2 Supporting Features .................................................................................................. 12
4.2.3 Performance Monitoring ........................................................................................... 12
4.3 Programmable Vision Accelerator and Deep Learning Accelerator Cluster ............... 13
4.4 Multi-Standard Video Decoder ........................................................................................ 14
4.5 Multi-Standard Video Encoder ........................................................................................ 15
4.6 Optical Flow Accelerator .................................................................................................. 16
4.7 NVJPEG ............................................................................................................................. 17
4.8 Sensor Processing Engine ............................................................................................... 18
4.9 Security Subsystem .......................................................................................................... 19
4.9.1 Platform Security Controller ..................................................................................... 19
4.9.2 Security Engine .......................................................................................................... 19
4.10 Jetson AGX Orin SOM Memory ........................................................................................ 20
Chapter 5. Interfaces ............................................................................................ 21
5.1 USB Interfaces ................................................................................................................. 21
5.2 SD and eMMC Controller ................................................................................................. 21
5.3 Serial Peripheral Interface .............................................................................................. 22
5.4 I2C Controller ................................................................................................................... 23
5.5 UART ................................................................................................................................. 23
5.6 RGMII ................................................................................................................................. 24
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- 以太快跑2023-01-31一个简版的 datasheet,聊胜于无,感谢。
zhoub593371
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