QCC5181芯片规格书资料_QCC5181噪声系数NF资源-CSDN文库

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Device description

■

Quad-core processor architecture

■

High-performance Bluetooth

stereo audio SoC

■

Flexible flash programmable platform

■

Low power modes to extend battery life

Applications

■

Wired/wireless stereo headsets/headphones

■

Qualcomm TrueWireless

™

stereo earbuds

Features

■

Qualified to Bluetooth v5.3

specification

■

Dual 240 MHz Qualcomm

Kalimba

™

audio DSPs

■

32/80 MHz Developer

Processor for applications

■

Firmware Processor for system

■

Flexible QSPI flash

programmable platform

■

High-performance 24‑bit stereo

audio interface

■

Digital and analog microphone

interfaces

■

Flexible LED controller and

LED pins with PWM support

■

Serial interfaces: UART, Bit

Serializer (I²C/SPI), USB 2.0

■

Advanced audio algorithms

■

Active Noise Cancellation:

Hybrid, Feedforward, and

Feedback modes, using Digital

or Analog Mics, enabled using

license keys available from

Qualcomm

■

Qualcomm

aptX

™

and aptX

HD Audio

■

aptX Adaptive, enabled using

license key

■

Qualcomm

cVc

™

Noise

Cancellation Technology,

enabled using license key

■

Integrated PMU: Dual SMPS

for system/digital circuits,

Integrated Li-ion battery

charger

■

99-ball 4.930 mm x 3.936 mm x

0.57 mm, 0.4 mm pitch WLCSP

System architecture

XTAL

Ext Memory

Bluetooth

Radio

Digital

Audio

Interface

Qualcomm

Kalimba

DSP

I/O

and

USB

Qualcomm

Kalimba

DSP

Apps

Developer

Processor

Apps

Firmware

Processor

UART/USB

PIO

I²C/SPI

Stereo HQ

ADC

Stereo

Class-D or

Class-AB

Headphones

Line Out

LED Driver

with PWM

SMPS

LDOs

Li-Ion

Charger

Line In / Dual

Analog Mic In

ANC

Headphones

Line Out

I²S/PCM

SPDIF

Battery

LED

DigMic

For additional information or to submit technical questions, go to https://createpoint.qti.qualcomm.com

Confidential – Qualcomm Technologies, Inc. and/or its affiliated companies – May Contain Trade Secrets

NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to DocCtrlAgent@qualcomm.com.

Confidential Distribution: Use or distribution of this item, in whole or in part, is prohibited except as expressly permitted by written agreement(s) and/or terms

with Qualcomm Incorporated and/or its subsidiaries.

Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of

Qualcomm Technologies International, Ltd.

All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm is a trademark or registered trademark of Qualcomm Incorporated. Kalimba, aptX , and cVc are trademarks or registered trademarks of Qualcomm

Technologies International, Ltd. Kymera is a trademark or registered trademark of Qualcomm Technologies International, Ltd. Other product and brand names may

be trademarks or registered trademarks of their respective owners.

This technical data may be subject to U.S. and international export, re-export, or transfer ("export") laws. Diversion contrary to U.S. and international law is strictly

prohibited.

Qualcomm Technologies International, Ltd. is a company registered in England and Wales

with a registered office at: Churchill House, Cambridge Business Park, Cowley Road,

Cambridge, CB4 0WZ, United Kingdom.

Registered Number: 3665875 | VAT number: GB787433096

QCC5181 WLCSP

Production Information Data Sheet

80-43045-1 Rev. AC

December 8, 2022

QCC5181 WLCSP descripon

QCC5181 WLCSP is a system on-chip (SoC) with:

■

On-chip Bluetooth

■

Audio and programmable application processor

■

High-performance, analog, and digital audio codecs

■

Class-AB and Class-D headphone drivers

■

Advanced power management

■

Li-ion battery charger

■

LED drivers

■

Flexible interfaces, including:

□

I²S

□

I²C

□

UART

□

PIO

Processors

QCC5181 WLCSP includes an application-dedicated Developer Processor and a system Firmware Processor that

run code from an external quad serial peripheral interface (QSPI) flash.

Both processors have tightly coupled memory (TCM) and an on-chip cache for performance while executing from

external flash memory. The system Firmware Processor provides functions developed by Qualcomm Technologies

International, Ltd. (QTIL). The Developer Processor provides flexibility to the product designer to customize their

product.

Audio subsystem

The Audio subsystem contains two programmable Kalimba cores running Qualcomm

Kymera

™

system DSP

architecture framework from read only memory (ROM). A range of audio processing capabilities are provided from

ROM, which are configurable in fully flexible audio graphs. Capabilities executed from random access memory

(RAM), including those provided by QTIL, the product designer or third parties may complement or replace built-in

capabilities in ROM.

IDE/Soware Development Tools

QCC5181 WLCSP is driven by a flexible software platform with integrated development environment (IDE) support.

This enables deployment of a broad range of consumer electronic products including headphones, headsets, and

Qualcomm TrueWireless stereo earbuds.

For more information on development tools and the audio development kit (ADK) for the QCC5181 WLCSP,

including information on Bluetooth and other features supported, go to www.qualcomm.com.

80-43045-1 Rev. AC Confidential – Qualcomm Technologies, Inc. and/or its affiliated companies – May Contain Trade Secrets

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

QCC5181 WLCSP device details

Audio subsystem

■

Dual 32‑bit Kalimba audio digital signal processor (or

processing) (DSP) cores with flexible clocking from 2 MHz

to 240 MHz to enable optimization of performance vs.

power consumption

■

DSPs execute code from ROM and from program RAM

■

OEM and third party developed features can execute from

program RAM

■

384 KB program RAM

■

1408 KB data RAM

Application subsystem

■

Dual-core application subsystem 32/80 MHz operation

■

32‑bit Firmware Processor (reserved for system use)

executes:

□

Bluetooth upper stack

□

Profiles

□

House-keeping code

■

32‑bit Developer Processor executes:

□

Developer applications

■

Both cores execute code from external flash memory using

QSPI clocked at 32 MHz or 80 MHz

■

On-chip caches per core enable optimized performance

and power consumption

Bluetooth subsystem

■

Qualified to Bluetooth v5.3 specification including 2 Mbps

Bluetooth Low Energy and Bluetooth Low Energy

Isochronous Channels

■

Qualcomm

Bluetooth High Speed Link

■

Single ended antenna connection with on-chip balun and

Tx/Rx switch

■

Bluetooth, Bluetooth Low Energy, and mixed topologies

supported

■

Class 1 support

Li-ion battery charger

■

Integrated battery charger supporting:

□

Internal mode (up to 200 mA)

□

External mode (up to 1.8 A)

■

Variable float (or termination) voltage adjustable in 50 mV

steps from 3.65 V to 4.4 V

■

Thermal monitoring and management are available in

application software

■

Pre-charge to fast charge transition configurable at 2.5 V,

2.9 V, 3.0 V, and 3.1 V

Power management

■

Integrated power management unit (PMU) to minimize

external components

■

QCC5181 WLCSP runs directly from a Li-ion, USB, or

external supply (2.8 V to 6.5 V)

■

Auto-switching between battery and USB (or other)

charging source

■

Power islands employed to optimize power consumption

for variety of use-cases

■

Dual switch-mode power supply (SMPS):

□

Automatic mode selection to minimize power

consumption

□

1.8 V SMPS generates power for both the device and

off-chip circuits

□

Dedicated digital SMPS (output voltage changes

automatically to minimize device power consumption)

80-43045-1 Rev. AC Confidential – Qualcomm Technologies, Inc. and/or its affiliated companies – May Contain Trade Secrets

MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

Audio engine and digital audio interfaces

■ 24‑bit inter-integrated circuit sound (I²S) interface with 1

input and 3 output channels

■ Programmable audio master clock (MCLK)

■ Sony/Philips digital interface (SPDIF): Two instances

configurable as input or output

■ Stereo analog outputs configurable as differential Class-

AB headphone outputs or differential high efficiency

Class-D outputs:

□ Class-AB signal-to-noise ratio (SNR): 120.0 dB typ

(Quiet mode).

□ Class-AB total harmonic distortion plus noise (THD

N): -93.3 dB typ.

□ Class-D SNR: 105.1 dB typ.

□ Class-D THD+N: -88.1 dB typ.

■ Quad analog inputs configurable as single ended line

inputs or, unbalanced or balanced analog microphone

inputs:

□ SNR differential: 99.0 dB typ.

□ THD+N differential: -94.9 dB typ.

■ 1 microphone bias (single bias shared by four channels):

□ Crosstalk attenuation between two inputs using

recommended application circuit: 80 dB typ.

■ Digital microphone inputs with capability to interface up to

10 digital microphones

■ Both analog-to-digital converter (ADC)s and digital-to-

analog converter (DAC)s support sample rates of 8 kHz,

16 kHz, 32 kHz, 44.1 kHz, 48 kHz, 96 kHz. DACs also

support 192 kHz and 384 kHz.

Peripherals and physical interfaces

■

A universal asynchronous receiver transmitter (UART)

interface

■

3 x Bit Serializers (programmable serial peripheral

interface (SPI) and inter-integrated circuit interface (I²C)

hardware accelerator)

■

1 x USB interface:

□

A full speed USB (USB-FS) Device (12 Mbps)

■

QSPI NOR flash interface

□

QSPI encryption to protect developer code and data

□

Encryption programmable with a 128‑bit security key of

original equipment manufacturer (OEM) choice stored in

on-chip one-time programmable (OTP) memory

■

QSPI external RAM interface

■

Up to 27 programmable input/output (PIO) and 4 open

drain/digital input light-emitting diode (LED) pads with

pulse width modulation (PWM)

Package and compliance

■

99-ball 4.930 mm x 3.936 mm x 0.57 mm, 0.4 mm pitch

WLCSP

■

Green (restriction of hazardous substances (RoHS)

compliant, and no antimony or halogenated flame

retardants)

QCC5181 WLCSP Data Sheet QCC5181 WLCSP device details

80-43045-1 Rev. AC Confidential – Qualcomm Technologies, Inc. and/or its affiliated companies – May Contain Trade Secrets

Y CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

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