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OUT

= 2.5V/2A

OUT

FB1

FB2

10 PF

100 PF

10 PH

2.15k

Si2343

LM3475

GND

PGATE

1 nF

= 5V

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

LM3475

SNVS239C –OCTOBER 2004–REVISED OCTOBER 2015

LM3475 Hysteretic PFET Buck Controller

1 Features 3 Description

The LM3475 is a hysteretic P-FET buck controller

• Easy-to-Use Control Methodology

designed to support a wide range of high efficiency

• 0.8 V to V

Adjustable Output Range

applications in a very small SOT-23-5 package. The

• High Efficiency (90% Typical)

hysteretic control scheme has several advantages,

including simple system design with no external

• ±0.9% (±1.5% Over Temperature) Feedback

compensation, stable operation with a wide range of

Voltage

components, and extremely fast transient response.

• 100% Duty Cycle Capable

Hysteretic control also provides high efficiency

• Maximum Operating Frequency up to 2 MHz

operation, even at light loads. The PFET architecture

allows for low component count as well as 100% duty

• Internal Soft-Start

cycle and ultra-low dropout operation.

• Enable Pin

Device Information

(1)

2 Applications

PART NUMBER PACKAGE BODY SIZE (NOM)

• TFT Monitor

LM3475 SOT-23 (5) 1.60 mm × 2.90 mm

• Auto PC

(1) For all available packages, see the orderable addendum at

• Vehicle Security the end of the data sheet.

• Navigation Systems

• Notebook Standby Supply

• Battery Powered Portable Applications

• Distributed Power Systems

Typical Application

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM3475

SNVS239C –OCTOBER 2004–REVISED OCTOBER 2015

www.ti.com

Table of Contents

7.4 Device Functional Modes........................................ 10

1 Features.................................................................. 1

8 Application and Implementation ........................ 11

2 Applications ........................................................... 1

8.1 Application Information............................................ 11

3 Description ............................................................. 1

8.2 Typical Application ................................................. 11

4 Revision History..................................................... 2

9 Power Supply Recommendations...................... 16

5 Pin Configuration and Functions......................... 3

10 Layout................................................................... 16

6 Specifications......................................................... 4

10.1 Layout Guidelines ................................................. 16

6.1 Absolute Maximum Ratings ...................................... 4

10.2 Layout Example .................................................... 17

6.2 ESD Ratings.............................................................. 4

11 Device and Documentation Support ................. 18

6.3 Recommended Operating Ratings ........................... 4

11.1 Device Support...................................................... 18

6.4 Thermal Information.................................................. 4

11.2 Community Resources.......................................... 18

6.5 Electrical Characteristics........................................... 5

11.3 Trademarks........................................................... 18

6.6 Typical Characteristics.............................................. 6

11.4 Electrostatic Discharge Caution............................ 18

7 Detailed Description.............................................. 8

11.5 Glossary................................................................ 18

7.1 Overview ................................................................... 8

12 Mechanical, Packaging, and Orderable

7.2 Functional Block Diagram ......................................... 8

Information ........................................................... 18

7.3 Feature Description................................................... 8

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (March 2013) to Revision C Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1

Changes from Revision A (March 2013) to Revision B Page

• Changed layout of National Data Sheet to TI format. ........................................................................................................... 1

Product Folder Links: LM3475

LM3475

SNVS239C –OCTOBER 2004–REVISED OCTOBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

See

(1)(2)

MIN MAX UNIT

−0.3 16 V

PGATE −0.3 16 V

FB −0.3 5 V

EN −0.3 16 V

Power dissipation

(3)

440 mW

Vapor phase (60 s) 215

Lead temperature °C

Infrared (15 s) 220

stg

Storage temperature −65 1150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3) The maximum allowable power dissipation is a function of the maximum junction temperature, T

J_MAX

, the junction-to-ambient thermal

resistance, θ

and the ambient temperature, T

. The maximum allowable power dissipation at any ambient temperature is calculated

using: P

D_MAX

= (T

J_MAX

- T

)/θ

. The maximum power dissipation of 0.44 W is determined using T

= 25°C, θ

= 225°C/W, and

J_MAX

= 125°C.

6.2 ESD Ratings

over operating free-air temperature range (unless otherwise noted)

VALUE UNIT

(ESD)

Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

2500 V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Ratings

MIN NOM MAX UNIT

Supply voltage 2.7 10 V

Operating junction temperature -40 125 °C

6.4 Thermal Information

LM3475

THERMAL METRIC

(1)

DBV (SOT-23) UNIT

5 PINS

θJA

Junction-to-ambient thermal resistance 164.2 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 115.3 °C/W

θJB

Junction-to-board thermal resistance 27.0 °C/W

Junction-to-top characterization parameter 12.8 °C/W

Junction-to-board characterization parameter 26.5 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance N/A °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

Product Folder Links: LM3475

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