loginid=mack.zhang@power7tech.com.cn,time=2013-12-04 15:07:12,ip=183.238.1.26,doctitle=MT7621_Datasheet_v0_3.docx,company=東莞泰克威電子有限公司 Dongguan power 7 technology Corp
MT7621_Data_Sheet_v0.2 Page 3 of 44
MT7621
Network Processor
Table of Contents
OVERVIEW ....................................................................................................................................................... 2
FEATURES ........................................................................................................................................................ 2
FUNCTIONAL BLOCK DIAGRAM ........................................................................................................................ 2
TABLE OF CONTENTS ........................................................................................................................................ 3
1. MAIN FEATURES .......................................................................................................................................... 5
1.1 SWITCH CORE .................................................................................................................................................... 5
1.1.1 Overview ................................................................................................................................................ 5
1.1.2 Features ................................................................................................................................................. 6
2. PINS ............................................................................................................................................................. 7
2.1 BALL MAP (TOP VIEW) ....................................................................................................................................... 7
2.2 PIN DESCRIPTIONS ............................................................................................................................................. 8
2.3 PIN SHARING SCHEMES ..................................................................................................................................... 15
2.3.1 GPIO pin share scheme ........................................................................................................................ 15
2.3.2 UART pin share scheme ....................................................................................................................... 16
2.3.3 RGMII pin share schemes ..................................................................................................................... 17
2.3.4 WDT_RST_MODE pin share scheme .................................................................................................... 17
2.3.5 PERST_N pin share scheme .................................................................................................................. 17
2.3.6 MDC/MDIO pin share scheme: ............................................................................................................ 17
2.3.7 NAND/SDXC/SPI pin share scheme ...................................................................................................... 18
2.3.8 xMII PHY/MAC Pin Mapping ................................................................................................................ 20
2.4 STRAPPING OPTIONS ........................................................................................................................................ 21
3. ELECTRICAL CHARACTERISTICS ................................................................................................................... 22
3.1 ABSOLUTE MAXIMUM RATINGS .......................................................................................................................... 22
3.2 RECOMMENDED OPERATING RANGE ................................................................................................................... 22
3.3 DC CHARACTERISTICS ....................................................................................................................................... 22
3.4 THERMAL CHARACTERISTICS ............................................................................................................................... 23
3.5 CURRENT CONSUMPTION .................................................................................................................................. 23
3.6 STORAGE CONDITIONS ...................................................................................................................................... 24
3.7 EXTERNAL XTAL SPECFICATION ........................................................................................................................... 24
3.8 AC ELECTRICAL CHARACTERISTICS ....................................................................................................................... 25
3.8.1 DDR SDRAM Interface .......................................................................................................................... 25
3.8.2 RGMII Interface .................................................................................................................................... 27
3.8.3 MII Interface (25 Mhz) ......................................................................................................................... 28
3.8.4 RvMII Interface (PHY Mode MII Timing) (25 Mhz) ............................................................................... 29
3.8.5 SPI Interface ......................................................................................................................................... 30
3.8.6 I
2
S Interface .......................................................................................................................................... 31
3.8.7 PCM Interface ...................................................................................................................................... 32
3.8.8 I2C Interface ......................................................................................................................................... 32
3.8.9 SDIO Interface ...................................................................................................................................... 33
3.8.10 NAND Flash Interface (Samsung Compatibel Device) ........................................................................ 34
3.8.11 Power On Sequence ........................................................................................................................... 37
4. PACKAGE INFORMATION ........................................................................................................................... 38
4.1 DIMENSIONS - TFBGA (11.7 MM X 13.6 MM) ..................................................................................................... 38
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