S3C6410\S3C2410\s3c2500b\s3c2510a英文手册

共4个文件

pdf：4个

S3C6410,S3C2410,s3c2500,s3c2510

需积分: 9 83 浏览量 2010-08-11 15:42:19 上传评论收藏 14.37MB RAR 举报

资源推荐

资源详情

资源评论

收起资源包目录

S3C6410_S3C2410_s3c2500b_s3c2510a英文手册.rar （4个子文件）

um_s3c2510a_rev1.pdf 3.05MB

S3C2410_en.pdf 3.22MB

S3C6410_Manual_rev12.pdf 12.35MB

um_s3c2500b_rev1.pdf 2.43MB

USER'S MANUAL

S3C6410X

RISC Microprocessor

Feb 13, 2009

REV 1.20

Samsung Electronics Co., Ltd

Important Notice

The information in this publication has been carefully

checked and is believed to be entirely accurate at

the time of publication. Samsung assumes no

responsibility, however, for possible errors or

omissions, or for any consequences resulting from

the use of the information contained herein.

Samsung reserves the right to make changes in its

products or product specifications with the intent to

improve function or design at any time and without

notice and is not required to update this

documentation to reflect such changes.

This publication does not convey to a purchaser of

semiconductor devices described herein any license

under the patent rights of Samsung or others.

Samsung makes no warranty, representation, or

guarantee regarding the suitability of its products for

any particular purpose, nor does Samsung assume

any liability arising out of the application or use of

any product or circuit and specifically disclaims any

and all liability, including without limitation any

consequential or incidental damages.

"Typical" parameters can and do vary in different

applications. All operating parameters, including

"Typicals" must be validated for each customer

application by the customer's technical experts.

Samsung products are not designed, intended, or

authorized for use as components in systems

intended for surgical implant into the body, for other

applications intended to support or sustain life, or for

any other application in which the failure of the

Samsung product could create a situation where

personal injury or death may occur.

Should the Buyer purchase or use a Samsung

product for any such unintended or unauthorized

application, the Buyer shall indemnify and hold

Samsung and its officers, employees, subsidiaries,

affiliates, and distributors harmless against all

claims, costs, damages, expenses, and reasonable

attorney fees arising out of, either directly or

indirectly, any claim of personal injury or death that

may be associated with such unintended or

unauthorized use, even if such claim alleges that

Samsung was negligent regarding the design or

manufacture of said product.

S3C6410X RISC Microprocessor

User's Manual, Revision 1.20

any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior

written consent of Samsung Electronics Co.,Ltd.

Samsung Electronics Co., Ltd.

San #24 Nongseo-Dong, Giheung-Gu

Yongin-City Gyeonggi-Do, Korea

446-711

Home Page: http://www.samsungsemi.com/

E-Mail: mobilesol.cs@samsung.com

Printed in the Republic of Korea

S3C6410X_USER’S MANUAL_REV 1.20 iii

Revision History

Revision No Description of Change Refer to Author(s) Date

1.00 - Public Release - W.J.Kim July 18, 2008

1.10 Overview, System Controller, GPIO,

CAMIF, IISBUSI/F, Key I/F, IIS Multi

Audio I/F, Electrical Data has been

modified

Errata Rev1.00 W.J.Kim Aug 22, 2008

1.20 System Controller, DRAMC, OneNAND

Controller, DMAC, TV Encoder, CAMIF,

Modem Interface, USB2.0 HS OTG,

SDMMC, SPI, PWM, IIS Bus Interface,

PCM Audio Interface, Key Interface, IIS

Multi Audio Interface, and Electrical

DATA has been modified.

Errata Rev1.10 C.G.Oh Feb 13, 2009

iv S3C6410X_USER’S MANUAL_REV 1.20

Table of Contents

Chapter 1 Product Overview

1.1 Architectural Overview ............................................................................................................................1-1

1.2 Features ..................................................................................................................................................1-2

1.2.1 S3C6410X RISC Microprocessor Features Summary ....................................................................1-3

1.2.2 Microprocessor ................................................................................................................................1-4

1.2.3 Memory Subsystem .........................................................................................................................1-5

1.2.3.1 SROM Memory Port configurable to support the following memory types: .............................1-5

1.2.3.2 DRAM port configurable to support the following memory types: ............................................1-6

1.2.4 Multimedia Acceleration...................................................................................................................1-6

1.2.4.1 Camera Interface......................................................................................................................1-6

1.2.4.2 Multi Format Codec (MFC).......................................................................................................1-7

1.2.4.3 JPEG Codec.............................................................................................................................1-7

1.2.5 2D Graphics Accelerator..................................................................................................................1-7

1.2.6 3D Graphics Accelerator..................................................................................................................1-8

1.2.6 Image Rotator ..................................................................................................................................1-8

1.2.7 Display Control.................................................................................................................................1-9

1.2.7.1 TFT LCD Interface....................................................................................................................1-9

1.2.7.2 Video Post Processor ...............................................................................................................1-9

1.2.7.3 TV (NTSC/PAL) Video Encoder with Image Enhancer ............................................................1-9

1.2.8 Audio Interface.................................................................................................................................1-9

1.2.8.1 AC97 Controller ........................................................................................................................1-9

1.2.8.2 PCM serial Audio Interface.......................................................................................................1-9

1.2.8.3 IIS-Bus Interface.......................................................................................................................1-10

1.2.9 USB Support ....................................................................................................................................1-10

1.2.9.1 USB OTG 2.0 High Speed........................................................................................................1-10

1.2.9.2 USB Host ..................................................................................................................................1-10

1.2.10 IrDA v1.1 ........................................................................................................................................1-10

1.2.11 Serial Communication....................................................................................................................1-10

1.2.11.1 UART ......................................................................................................................................1-10

1.2.11.2 IIC-Bus Interfac

e.....................................................................................................................1-11

1.2.11.3 SPI Interface...........................................................................................................................1-11

1.2.11.4 MIPI HSI .................................................................................................................................1-11

1.2.12 Modem & HOST Interface..............................................................................................................1-11

1.2.12.1 Parallel Modem Chip Interface ...............................................................................................1-11

1.2.12.1 Host Interface .........................................................................................................................1-11

1.2.13 GPIO (General Purpose I/O)..........................................................................................................1-12

1.2.14 Input Devices .................................................................................................................................1-12

1.2.14.1 Keypad Interface.....................................................................................................................1-12

1.2.14.2 A/D Converter and Touch Screen Interface ...........................................................................1-12

S3C6410X_USER’S MANUAL_REV 1.20 v

Table of Contents

Chapter 1 Product Overview

1.2.15 Storage Devices ............................................................................................................................1-12

1.2.15.1 SD/MMC Host Controller........................................................................................................1-12

1.2.16 System Peripherals........................................................................................................................1-12

1.2.16.1 DMA controller........................................................................................................................1-12

1.2.16.2 Vectored Interrupt Controller..................................................................................................1-13

1.2.16.3 TrustZone Protection Controller.............................................................................................1-13

1.2.16.4 Timer with PWM (Pulse Width Modulation) ...........................................................................1-13

1.2.16.5 16-bit Watchdog Timer...........................................................................................................1-13

1.2.16.6 RTC (Real Time Clock) ..........................................................................................................1-13

1.2.17 security sub-system.......................................................................................................................1-13

1.2.18 System Management.....................................................................................................................1-14

1.2.19 System Operating Frequencies.....................................................................................................1-14

1.3 Power Management................................................................................................................................1-15

1.4 Electrical Characteristics.........................................................................................................................1-15

1.5 Package ..................................................................................................................................................1-15

1.6 Pin Assignments .....................................................................................................................................1-16

1.7 Pin Description........................................................................................................................................1-36

1.7.1 External Memory Interface ..............................................................................................................1-36

1.7.2 Serial Communication .....................................................................................................................1-39

1.7.3 Parallel Communication...................................................................................................................1-43

1.7.4 Modem Interface..............................................................................................................................1-44

1.7.5 Image/Video Processing..................................................................................................................1-46

1.7.6 Display Control ................................................................................................................................1-47

1.7.7 Storage Devices ..............................................................................................................................1-49

1.7.8 System Management.......................................................................................................................1-51

1.8 Power-supply Groups .............................................................................................................................1-53

Chapter 2 Memory Map

2.1 Memory System Block Diagram..............................................................................................................2-1

2.2 Device Specific Address Space..............................................................................................................2-3

Chapter 3 System Controller

3.1 Overview .................................................................................................................................................3-1

3.2 Features..................................................................................................................................................3-2

3.3 Functional description.............................................................................................................................3-2

3.3.1 Hardware architecture .....................................................................................................................3-2

3.3.2 Clock Architecture............................................................................................................................3-3

3.3.3 Clock source selection.....................................................................................................................3-4

评论收藏

内容反馈