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TI-DS25MB200.pdf
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PRE_S
LO_0 ±
MUX_S0
SIA_0 ±
SIB_0 ±
LB0A
LB0B
SOA_0 ±
EQ
EQ
EQ
SOB_0 ±
LI_0 ±
PRE_S
PRE_L
PRE_S
LO_1 ±
MUX_S1
SIA_1 ±
SIB_1 ±
LB1A
LB1B
SOA_1 ±
EQ
EQ
EQ
SOB_1 ±
LI_1 ±
PRE_S
PRE_L
Pre-emphasis
Control
PreL_0
PreS_1
PreS_0
PreL_1
PRE_S
PRE_L
V
CC
GND
Port 0
Port 1
RSV
Switch Side
Line Side
DS25MB200
www.ti.com
SNLS220G –MARCH 2006–REVISED APRIL 2013
DS25MB200 Dual 2.5 Gbps 2:1/1:2 CML Mux/Buffer with Transmit Pre-Emphasis and
Receive Equalization
Check for Samples: DS25MB200
1
FEATURES
DESCRIPTION
The DS25MB200 is a dual signal conditioning 2:1
2
• 0.6–2.5 Gbps Low Jitter Operation
multiplexer and 1:2 fan-out buffer designed for use in
• Fixed Input Equalization
backplane redundancy applications. Signal
• Programmable Output Pre-Emphasis
conditioning features include input equalization and
programmable output pre-emphasis that enable data
• Independent Switch and Line Side Pre-
communication in FR4 backplanes up to 2.5 Gbps.
Emphasis Controls
Each input stage has a fixed equalizer to reduce ISI
• Programmable Switch-Side Loopback Modes
distortion from board traces. All output drivers have 4
• On-Chip Terminations
selectable steps of pre-emphasis to compensate for
transmission losses from long FR4 backplanes and
• HBM ESD Rating 6 kV on All Pins
reduce deterministic jitter. The pre-emphasis levels
• +3.3V Supply
can be independently controlled for the line-side and
• Lead-Less WQFN-48 Package (7mm x 7mm x
switch-side drivers. The internal loopback paths from
0.8mm, 0.5mm Pitch)
switch-side input to switch-side output enable at-
speed system testing. All receiver inputs are internally
• -40°C to +85°C Operating Temperature Range
terminated with 100Ω differential terminating
resistors. All drivers are internally terminated with
APPLICATIONS
50Ω to V
CC
.
• Backplane or Cable Driver
• Redundancy and Signal Conditioning
Applications
Functional Block Diagram
All CML inputs and outputs must be AC coupled for optimal performance.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LI_0+
50
50
1.5V
LI_0-
Input stage
+EQ
M
U
X
M
U
X
50
50
1.5V
50
50
1.5V
M
U
X
SOA_0+
SOA_0-
SOB_0+
SOB_0-
SIA_0+
SIA_0-
SIB_0+
SIB_0-
LO_0+
LO_0-
50
50
50
50
50
50
PreL_0
PreL_1
PreS_0
PreS_1
PRE_L
PRE_S
LB0A
LB0B
MUX_S0
DS25MB200
2
2
2
2
V
CC
V
CC
PRE_L
PRE_S
PRE_S
CML
driver
CML
driver
Pre-emphasis
Control
CML
driver
Input stage
+EQ
Input stage
+EQ
LI_1+
50
50
1.5V
LI_1-
Input stage
+EQ
M
U
X
M
U
X
50
50
1.5V
50
50
1.5V
M
U
X
SOA_1+
SOA_1-
SOB_1+
SOB_1-
SIA_1+
SIA_1-
SIB_1+
SIB_1-
LO_1+
LO_1-
50
50
50 50
50
50
LB1A
LB1B
MUX_S1
V
CC
pins
GND pins
and DAP
2
2
2
2
PRE_L
PRE_S
PRE_S
CML
driver
CML
driver
CML
driver
Input stage
+EQ
Input stage
+EQ
PORT 0
PORT 1
V
CC
V
CC
V
CC
V
CC
DS25MB200
SNLS220G –MARCH 2006–REVISED APRIL 2013
www.ti.com
Simplified Block Diagram
2 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS25MB200
13 14 15 16 17 18 2019 21 22
26
27
28
29
30
31
32
33
34
11
10
9
8
7
6
5
4
3
48 47 46 45 44 43 4142 40 39
V
CC
SOB_0-
SOB_0+
GND
LI_0+
LI_0-
V
CC
LO_1+
LO_1-
GND
2
1
35
36
PreL1
WQFN-48
Top View Shown
DAP = GND
23
38
12PreL0
24
25
37
SIA_1+
LB1A
SOA_1+
SOA_1-
V
CC
SIB_1+
SIB_1-
GND
SIA_1-
MUX_S1
LB1B
V
CC
SOA_0-
LB0A
SIA_0-
SIA_0+
GND
SIB_0-
SIB_0+
V
CC
LB0B
SOA_0+
V
CC
MUX_S0
V
CC
LO_0-
LO_0+
GND
LI_1-
LI_1+
V
CC
SOB_1+
RSV
SOB_1-
PreS0
PreS1
DS25MB200
www.ti.com
SNLS220G –MARCH 2006–REVISED APRIL 2013
Connection Diagram
Figure 1. 48 Pin (Top View)
See Package Number NJU0048D
PIN DESCRIPTIONS
(1)
Pin Name Pin Number I/O
(2)
Description
LINE SIDE HIGH SPEED DIFFERENTIAL IO's
LI_0+ 6 I Inverting and non-inverting differential inputs of port_0 at the line side. LI_0+ and LI_0− have an
LI_0− 7 internal 50Ω connected to an internal reference voltage. See Figure 7.
LO_0+ 33 O Inverting and non-inverting differential outputs of port_0 at the line side. LO_0+ and LO_0− have an
LO_0− 34 internal 50Ω connected to V
CC
.
LI_1+ 30 I Inverting and non-inverting differential inputs of port_1 at the line side. LI_1+ and LI_1− have an
LI_1− 31 internal 50Ω connected to an internal reference voltage. See Figure 7.
LO_1+ 9 O Inverting and non-inverting differential outputs of port_1 at the line side. LO_1+ and LO_1− have an
LO_1− 10 internal 50Ω connected to V
CC
.
SWITCH SIDE HIGH SPEED DIFFERENTIAL IO's
SOA_0+ 46 O Inverting and non-inverting differential outputs of mux_0 at the switch_A side. SOA_0+ and SOA_0−
SOA_0− 45 have an internal 50Ω connected to V
CC
.
SOB_0+ 4 O Inverting and non-inverting differential outputs of mux_0 at the switch_B side. SOB_0+ and SOB_0−
SOB_0− 3 have an internal 50Ω connected to V
CC
.
SIA_0+ 40 I Inverting and non-inverting differential inputs to the mux_0 at the switch_A side. SIA_0+ and SIA_0−
SIA_0− 39 have an internal 50Ω connected to an internal reference voltage. See Figure 7.
SIB_0+ 43 I Inverting and non-inverting differential inputs to the mux_0 at the switch_B side. SIB_0+ and SIB_0−
SIB_0− 42 have an internal 50Ω connected to an internal reference voltage. See Figure 7.
(1) All CML Inputs or Outputs must be AC coupled.
(2) I = Input, O = Output, P = Power
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: DS25MB200
DS25MB200
SNLS220G –MARCH 2006–REVISED APRIL 2013
www.ti.com
PIN DESCRIPTIONS
(1)
(continued)
Pin Name Pin Number I/O
(2)
Description
SOA_1+ 22 O Inverting and non-inverting differential outputs of mux_1 at the switch_A side. SOA_1+ and SOA_1−
SOA_1− 21 have an internal 50Ω connected to V
CC
.
SOB_1+ 28 O Inverting and non-inverting differential outputs of mux_1 at the switch_B side. SOB_1+ and SOB_1−
SOB_1− 27 have an internal 50Ω connected to V
CC
.
SIA_1+ 16 I Inverting and non-inverting differential inputs to the mux_1 at the switch_A side. SIA_1+ and SIA_1−
SIA_1− 15 have an internal 50Ω connected to an internal reference voltage. See Figure 7.
SIB_1+ 19 I Inverting and non-inverting differential inputs to the mux_1 at the switch_B side. SIB_1+ and SIB_1−
SIB_1− 18 have an internal 50Ω connected to an internal reference voltage. See Figure 7.
CONTROL (3.3V LVCMOS)
MUX_S0 37 I A logic low at MUX_S0 selects mux_0 to switch B. MUX_S0 is internally pulled high. Default state for
mux_0 is switch A.
MUX_S1 13 I A logic low at MUX_S1 selects mux_1 to switch B. MUX_S0 is internally pulled high. Default state for
mux_1 is switch A.
PREL_0 12 I PREL_0 and PREL_1 select the output pre-emphasis of the line side drivers (LO_0± and LO_1±).
PREL_1 1 PREL_0 and PREL_1 are internally pulled high. See Table 3 for line side pre-emphasis levels.
PRES_0 36 I PRES_0 and PRES_1 select the output pre-emphasis of the switch side drivers (SOA_0±, SOB_0±,
PRES_1 25 SOA_1± and SOB_1±). PRES_0 and PRES_1 are internally pulled high. See Table 4 for switch side
pre-emphasis levels.
LB0A 47 I A logic low at LB0A enables the internal loopback path from SIA_0± to SOA_0±. LB0A is internally
pulled high.
LB0B 48 I A logic low at LB0B enables the internal loopback path from SIB_0± to SOB_0±. LB0B is internally
pulled high.
LB1A 23 I A logic low at LB1A enables the internal loopback path from SIA_1± to SOA_1±. LB1A is internally
pulled high.
LB1B 24 I A logic low at LB1B enables the internal loopback path from SIB_1± to SOB_1±. LB1B is internally
pulled high.
RSV 26 I Reserve pin to support factory testing. This pin can be left open, or tied to GND, or tied to GND
through an external pull-down resistor.
POWER
V
CC
2, 8, 14, 20, P V
CC
= 3.3V ± 5%.
29, 35, 38, Each V
CC
pin should be connected to the V
CC
plane through a low inductance path, typically with a
44 via located as close as possible to the landing pad of the V
CC
pin.
It is recommended to have a 0.01 μF or 0.1 μF, X7R, size-0402 bypass capacitor from each V
CC
pin
to ground plane.
GND 5, 11, 17, 32, P Ground reference. Each ground pin should be connected to the ground plane through a low
41 inductance path, typically with a via located as close as possible to the landing pad of the GND pin.
GND DAP P Die Attach Pad (DAP) is the metal contact at the bottom side, located at the center of the WQFN-48
package. It should be connected to the GND plane with at least 4 via to lower the ground impedance
and improve the thermal performance of the package.
Functional Description
The DS25MB200 is a signal conditioning 2:1 multiplexer and a 1:2 buffer designed to support port redundancy up
to 2.5 Gbps. The high speed inputs are self-biased to about 1.3V and are designed for AC coupling. See
Figure 7 for details. The inputs are compatible to most AC coupling differential signals such as LVDS, LVPECL
and CML. The DS25MB200 is not designed to operate with data rates below 250 Mbps or with a DC bias applied
to the CML inputs or outputs. Most high speed links are encoded for DC balance and have been defined to
include AC coupling capacitors allowing the DS25MB200 to be directly inserted into the datapath without any
limitation. The ideal AC coupling capacitor value is often based on the lowest frequency component embedded
within the serial link. A typical AC coupling capacitor value ranges between 100 and 1000nF. Some
specifications with scrambled data may require a larger capacitor for optimal performance. To reduce unwanted
parasitics around and within the AC coupling capacitor, a body size of 0402 is recommended. Figure 6 shows the
AC coupling capacitor placement in an AC test circuit.
4 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS25MB200
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