DS25MB200
SNLS220G –MARCH 2006–REVISED APRIL 2013
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PIN DESCRIPTIONS
(1)
(continued)
Pin Name Pin Number I/O
(2)
Description
SOA_1+ 22 O Inverting and non-inverting differential outputs of mux_1 at the switch_A side. SOA_1+ and SOA_1−
SOA_1− 21 have an internal 50Ω connected to V
CC
.
SOB_1+ 28 O Inverting and non-inverting differential outputs of mux_1 at the switch_B side. SOB_1+ and SOB_1−
SOB_1− 27 have an internal 50Ω connected to V
CC
.
SIA_1+ 16 I Inverting and non-inverting differential inputs to the mux_1 at the switch_A side. SIA_1+ and SIA_1−
SIA_1− 15 have an internal 50Ω connected to an internal reference voltage. See Figure 7.
SIB_1+ 19 I Inverting and non-inverting differential inputs to the mux_1 at the switch_B side. SIB_1+ and SIB_1−
SIB_1− 18 have an internal 50Ω connected to an internal reference voltage. See Figure 7.
CONTROL (3.3V LVCMOS)
MUX_S0 37 I A logic low at MUX_S0 selects mux_0 to switch B. MUX_S0 is internally pulled high. Default state for
mux_0 is switch A.
MUX_S1 13 I A logic low at MUX_S1 selects mux_1 to switch B. MUX_S0 is internally pulled high. Default state for
mux_1 is switch A.
PREL_0 12 I PREL_0 and PREL_1 select the output pre-emphasis of the line side drivers (LO_0± and LO_1±).
PREL_1 1 PREL_0 and PREL_1 are internally pulled high. See Table 3 for line side pre-emphasis levels.
PRES_0 36 I PRES_0 and PRES_1 select the output pre-emphasis of the switch side drivers (SOA_0±, SOB_0±,
PRES_1 25 SOA_1± and SOB_1±). PRES_0 and PRES_1 are internally pulled high. See Table 4 for switch side
pre-emphasis levels.
LB0A 47 I A logic low at LB0A enables the internal loopback path from SIA_0± to SOA_0±. LB0A is internally
pulled high.
LB0B 48 I A logic low at LB0B enables the internal loopback path from SIB_0± to SOB_0±. LB0B is internally
pulled high.
LB1A 23 I A logic low at LB1A enables the internal loopback path from SIA_1± to SOA_1±. LB1A is internally
pulled high.
LB1B 24 I A logic low at LB1B enables the internal loopback path from SIB_1± to SOB_1±. LB1B is internally
pulled high.
RSV 26 I Reserve pin to support factory testing. This pin can be left open, or tied to GND, or tied to GND
through an external pull-down resistor.
POWER
V
CC
2, 8, 14, 20, P V
CC
= 3.3V ± 5%.
29, 35, 38, Each V
CC
pin should be connected to the V
CC
plane through a low inductance path, typically with a
44 via located as close as possible to the landing pad of the V
CC
pin.
It is recommended to have a 0.01 μF or 0.1 μF, X7R, size-0402 bypass capacitor from each V
CC
pin
to ground plane.
GND 5, 11, 17, 32, P Ground reference. Each ground pin should be connected to the ground plane through a low
41 inductance path, typically with a via located as close as possible to the landing pad of the GND pin.
GND DAP P Die Attach Pad (DAP) is the metal contact at the bottom side, located at the center of the WQFN-48
package. It should be connected to the GND plane with at least 4 via to lower the ground impedance
and improve the thermal performance of the package.
Functional Description
The DS25MB200 is a signal conditioning 2:1 multiplexer and a 1:2 buffer designed to support port redundancy up
to 2.5 Gbps. The high speed inputs are self-biased to about 1.3V and are designed for AC coupling. See
Figure 7 for details. The inputs are compatible to most AC coupling differential signals such as LVDS, LVPECL
and CML. The DS25MB200 is not designed to operate with data rates below 250 Mbps or with a DC bias applied
to the CML inputs or outputs. Most high speed links are encoded for DC balance and have been defined to
include AC coupling capacitors allowing the DS25MB200 to be directly inserted into the datapath without any
limitation. The ideal AC coupling capacitor value is often based on the lowest frequency component embedded
within the serial link. A typical AC coupling capacitor value ranges between 100 and 1000nF. Some
specifications with scrambled data may require a larger capacitor for optimal performance. To reduce unwanted
parasitics around and within the AC coupling capacitor, a body size of 0402 is recommended. Figure 6 shows the
AC coupling capacitor placement in an AC test circuit.
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